JPS57166050A - Packing body for shipment of semiconductor device - Google Patents

Abstract

PURPOSE:To enhance density of packing and to automate packing and taking out of a semiconductor device by a method wherein a frame is provided to a QIP extendedly provided with leads from the four sides of a resin sealed body to protect the leads, and the frames are accumulated being laminated in a cylindrical body provided with bottom. CONSTITUTION:A frame 14 is fixed to the outside of leads 13 being separated from the tip ends of the leads 13 extending out from the sides of a resin sealed layer 11. The frame 14 is coupled 151-154 to an equipping plate 12 at the positions corresponding to the four corners of the resin layer 11, and the frame 14 and the leads 13 are laid in the same level. Notches are provided in grooves 161-164 on the edges of the frame corresponding to the four corners of the resin layer 11, and grooves 171, 172, 18 are provided to the opposite edges on the outside of the frame. A bottom plate 25 is engaged sliding freely with the cylindrical body 21 provided with the convex stripes 221, 222, 23 for guide, the bottom plate is held by protruding edges 24, the frames 14 are housed being stacked in the prescribed direction making the outside circumferential grooves thereof to slide along the guides, a cover 27 having the same shape with the bottom plate 25 is put thereon to press, and a pin is inserted in holes 28 to fix. By this constitution, density of packing can be enhanced, and moreover packing and fixing work can be automated.