JPS6332262B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a shipping package for semiconductor devices, and more particularly to a shipping package for flat type semiconductor devices.

A semiconductor device generally has a form in which leads extend outward from the side surface of an airtight container in which the semiconductor device is enclosed, and a device in which the leads are not bent is called a flat type. A typical flat type semiconductor device is a quadruple-in-lead package (hereinafter referred to as QIP) type semiconductor device, in which the airtight container has a resin sealing layer and leads extend in four directions from the sides of the resin sealing layer. It is. This QIP type semiconductor device will be explained below as an example.

FIG. 1 is a perspective view showing an example of a QIP type semiconductor device. In the figure, 1 is a resin sealing layer.
A semiconductor element (not shown) is sealed inside the resin sealing layer 1. A plurality of leads 2 extend from the side surface of this resin sealing layer 1 in four directions. The lead 2 is connected to the semiconductor element (not shown) inside the resin sealing layer 1.

Since the lead width and lead pitch of the QIP type semiconductor device described above are narrow, the lead thickness is also reduced due to processing accuracy. As a result, the leads of QIP type semiconductor devices have low mechanical strength and are easily bent, distorted, and otherwise deformed. Therefore, great care is required when handling QIP type semiconductor devices, such as not touching the leads, and especially during shipping, in order to prevent deformation of the leads, conventional methods shown in Figures 2 and 3 are required. Special shipping packaging is adopted. That is, FIG. 2 is a perspective view showing packaging materials used for conventional shipping packaging. In the figure, 3 is a packaging material made of a thick polyurethane foam board or the like. A plurality of recesses 4 are provided at equal intervals on the surface of the packaging material 3. At the position where the recess 4 is provided, a recess is also provided on the back side. Then, as shown in the figure, the resin sealing layer 1 of the QIP type semiconductor device shown in FIG. Arrange the devices in a plane. At this time, the recesses 4 are provided with sufficient distance from each other so that the leads 2 do not come into contact with each other. In this way multiple
After arranging the QIP type semiconductor devices in a plane on the packaging material 4, they are laminated as appropriate as shown in FIG.
This laminate was further boxed in cardboard or the like to form a final shipping package before being shipped.

Although the shipping package described above can prevent the leads 2 of the QIP type semiconductor device from being deformed during shipping, it has the following problems. 1st
Moreover, since special packaging material 3 is required, the cost is high. Second, a large area is required to arrange QIP type semiconductor devices in a two-dimensional manner, and the packaging density is low. Third, packaging materials for QIP type semiconductor devices are
It is difficult to mechanically automate the process of arranging individual products from the packaged state.
It is also difficult to mechanize the process of taking out QIP type semiconductor devices one by one in order to test them on an automatic measuring device (the fact that the leads 2 are easily deformed also hinders this automation). Fourth, since QIP type semiconductor devices have a substantially symmetrical structure in four directions, if the packaging process is automated, there is a risk that the devices will be arranged in different directions.

The problem with the conventional shipping package described above is due to the fact that the leads 2 in the QIP type semiconductor device have weak mechanical strength and are easily deformed. Therefore, in order to provide a shipping package that solves the above problems, the inventors first proposed a QIP type semiconductor device that prevents lead deformation by providing a lead protection structure. FIG. 4 is a plan view showing an example. In the figure, 11 is a resin sealing layer. A semiconductor element (not shown) mounted on a mounting substrate 12 is sealed inside the resin sealing layer 11 . A plurality of leads 13 extend in four directions from the side surface of the resin sealing layer 11 (note that the portion of each lead 13 covered with the resin sealing layer 11 is not shown). The lead 13 is connected to the semiconductor element (not shown) inside the resin sealing layer 11. Further, a protective frame 14 is arranged on the outside of the lead 13 so as to be spaced apart from the tip of the lead 13. The protective frame 14 is connected to the mount substrate 12 via bridge portions 15 ₁ to 15 ₄ at positions corresponding to the four corners of the resin sealing layer 11 . As a result, the protective frame 14 is provided at the same level as the leads 13, and is apparently fixed to the four corners of the resin sealing layer 11. Further, cut grooves 16 ₁ to 16 ₄ are provided in the protective frame 14 from one side at the four corners of the resin sealing layer 11, so that the protective frame 14 only connects the bridge portion 15 on the other side of the resin sealing layer. ₁ to 15 Connected to ₄ . Furthermore, a groove (not shown) for breaking is provided along the resin sealing layer 11 on the front or back surface of the protective frame 14 of this connecting portion. Further, two cutout holes 17 ₁ and 17 ₂ are formed at the outer edge of one side of the protective frame 14, and one cutout hole 18 is formed at the outer edge of the opposite side. Note that the protective frame 14 is used as it is without separating the outer frame of a lead frame that is normally used in manufacturing resin-sealed semiconductor devices.

In the QIP type semiconductor device having the above structure, a protective frame 14 is provided on the outside of each lead 13, so by grasping and handling the protective frame 14, deformation of the lead 13 can be prevented during handling. can do. Furthermore, deformation caused by the lead 13 hitting something can be prevented. Furthermore, since the overall symmetry is impaired by the cutout holes 17 ₁ , 17 ₂ , and 18 provided in the protective frame 14, the direction can be confirmed very easily. By the way, when the above QIP type semiconductor device is actually used, the protective frame 14 must be removed.
However, since the protective frame 14 can be separated using a simple device, this operation can be extremely easily performed by the user at the shipping destination. In addition, since a groove is provided in the connecting portion of the protective frame 14 for breaking and cutting, the protective frame 14 can be cut without using a special device.
You can also break it off.

In addition, in the QIP type semiconductor device of the above embodiment,
Since the protective frame 14 is connected to the mount substrate 12 via the bridges 15 ₁ to 15 ₄ , the following effects are achieved. That is, the protective frame 14 is electrically connected to the mount substrate 12, so that the substrate potential of the semiconductor element can be fixed using the protective frame 14 as a terminal. Therefore, when testing electrical characteristics in the illustrated state, the workability can be significantly improved.

FIG. 5 is a plan view of another QIP type semiconductor device provided with a lead protection frame. In this example, the protection frame 14
and the mounting board 12 are not connected to each other, and the protective frame 14 is secured to the resin sealing layer 1 by means of fixing pieces 15' ₁ to 15' ₄ protruding into the interior from the four corners of the resin sealing layer 11.
It is fixed at 1. In this example as well, the fourth
Similar to the embodiment shown in the figures, it is possible to facilitate the removal of the protective frame 14 by providing cut grooves 16 ₁ to 16 ₄ or grooves for folding along the resin sealing layer 11.

FIG. 6 is a plan view showing still another example of a QIP type semiconductor device provided with a lead protection frame. In this example, a plurality of QIP type semiconductor devices are horizontally connected together by a protective frame 14'. The lead frame used in the manufacture of resin-sealed semiconductor devices originally consists of a plurality of continuous units. Therefore, the outer frame of the lead frame can be used as the protective frame 14' in this case, as shown in FIG. You can get the same effect as the one.

Note that in the QIP type semiconductor devices shown in FIGS. 4, 5, and 6, the cutout holes 17 ₁ , 17 ₂ , 18
A convex projection may be provided instead.

In addition to QIP type semiconductor devices, flat type DIP
Protective frames 14 and 1 are also used for other flat type resin-sealed semiconductor devices such as semiconductor devices made by
A similar effect can be obtained by providing 4'.

In this way, by providing a protective frame on a flat type resin-sealed semiconductor device, it has become possible to prevent lead deformation, which has been a problem in the past, especially in QIP type semiconductor devices.

The present invention was made in view of the above circumstances, and
By using a flat type resin-sealed semiconductor device with a protective frame to protect the leads,
The object of the present invention is to provide a semiconductor shipping package that has a high packaging density and can easily automate the packaging process and the unloading process.

An embodiment of the present invention will be described below with reference to FIGS. 7 to 11.

FIG. 7 is an explanatory diagram showing an embodiment of a shipping package to which the present invention is applied for the QIP type semiconductor device of FIG. 4. In the figure, 21 is a cylinder used for packaging for shipping. The internal space of the cylindrical body 21 has approximately the same cross-sectional shape as the outer edge of the protective frame 14 in the QIP type semiconductor device shown in FIG. 4 housed therein. The inner wall of this cylindrical body 21 has the QIP
Guide protrusions 22 ₁ , 22 ₂ , 23 are formed in the depth direction to correspond to the cutout holes 17 ₁ , 17 ₂ , 18 of the type semiconductor device, respectively. Further, at the lower opening end of the cylinder body 21, there are protrusions 24, 24 for the locking member extending inwardly.
is installed protrudingly. A bottom cover 25 is locked to the locking projections 24, 24. The bottom cover 25 is formed with notched holes 26 corresponding to the guide ridges 23 and notched holes (not shown) corresponding to the guide ridges 22 ₁ and 22 ₂ . And bottom cover 2
5, the notch hole is connected to the guide protrusion 22 ₁ , 2
2 ₂ , 23, and the cylindrical body 21
It is installed so that it can freely slide up and down inside. Inside the packaging container consisting of the cylinder body 21 and the bottom lid 25,
The QIP type semiconductor devices shown in FIG. 4 are stacked and housed. At that time, each of the cutout holes 17 ₁ , 17 ₂ , 18 formed in the protective frame 14 of the QIP type semiconductor device is fitted into the corresponding guide protrusion 22 ₁ , 22 ₂ , 23 , and the guide protrusion Store along the lines. Thus, QIP
After sequentially storing and stacking QIP type semiconductor devices in a container, a top cover 27 having the same shape as the bottom cover 25 is finally placed on top of the stack of stored QIP type semiconductor devices, and this is pressed and fixed to form the final container. The shipping package shall be a standard one. The upper lid 27 is fixed by pressing in the manner shown in FIG. 9 using the fixing member shown in FIG. In Figure 8,
31 is a hexagonal rotor. A rotating shaft 32 is provided at an eccentric position of the rotor 31, and a handle 33 is rotatably attached to the tip of the rotating shaft. When pressing and fixing the upper lid 27 using this fixing member, the upper lid 27 is
7 is placed on the stacked QIP type semiconductor devices, the handle 33 and rotating shaft 32 of the fixing member are inserted from the inside of the cylinder 21 through the pin hole 28 opened in the side wall thereof. Next, as shown in FIG. 9, a handle 33 protruding from the outside of the cylinder 21 is bent and fixed at right angles to the rotating shaft 32, and the handle 33 rotates the internal rotor 31 about the rotating shaft 32. let Since the rotating shaft 32 is provided at an eccentric position of the hexagonal rotor, the upper cover 27 is pressed downward by the rotation of the rotor 31 and is fixed in pressure contact with one side of the rotor 31. As the fixing member, a polygonal rotor other than a hexagonal rotor, for example, a rotor having a rectangular rotor 31' as shown in FIG. 10 may be used. In this case, there is no need to make the rotating shaft 32 eccentric. Alternatively, as shown in FIG. 11, a fixing member may be used in which a handle 33' is provided directly on the rotor 31 and a split pin-shaped leaf spring portion 34 is provided at the tip of the rotating shaft 32. In this case, the cylindrical body 21
The leaf spring portion 34 and the rotating shaft are inserted into the pin hole 28 from inside. The leaf spring portion 34 inserted in a contracted state expands outside the cylinder 21, thereby preventing the rotation member from falling off. Then, the rotor is rotated by a handle 33' provided on the rotor 31 inside the cylindrical body 21, and the upper cover 27 is pressed and fixed downward.

The shipping package of the above embodiment does not require any special packaging material 3 other than the storage container unlike the conventional shipping packaging shown in FIGS. 2 and 3, and QIP type semiconductor devices are stacked vertically. Therefore, high packaging density can be obtained. Furthermore, a cylinder body 2 used for the above-mentioned shipping package
1 has a simple structure and can be supplied at low cost. Therefore, this shipping package can significantly reduce the cost of conventional packaging.
In this case, since the leads 13 of the QIP type semiconductor device are protected by the protective frame 14, they will not be deformed.

Furthermore, by making the bottom cover 25 vertically slidable as described above, the automation shown in FIG. 12 is possible in combination with the protection of the leads by the protection frame 14. This figure is an explanatory diagram showing a method for automatically taking out individual QIP type semiconductor devices one by one from a packaging container at a shipping destination. In the figure, 35 is an elevator mechanism that pushes up the bottom cover 25. The elevator mechanism 35 allows the bottom cover 25 and the
The QIP type semiconductor device is pushed up and the protective frame 14 of the QIP type semiconductor device pushed out from the cylindrical body 21 is poked with the ejection pin 36 to eject the semiconductor devices one by one laterally. The ejected QIP type semiconductor device is moved by a belt conveyor 37 to a place where necessary work such as automatic measurement is performed. In this way, even when automation is performed using the ejector pins 36, the protective frame 14 can prevent the leads 13 from being deformed. On the other hand, by performing the above method in reverse, it is also possible to automate the process of stacking and storing QIP type semiconductor devices in a container. In this case, the shape of the QIP semiconductor device is entirely asymmetrical due to the cutout holes 17 ₁ , 17 ₂ , and 18 provided in the protective frame 14, and the cylindrical body 21 is arranged in correspondence with these cutout holes. Guide protrusion 2 provided on the inner wall of
Since the QIP type semiconductor devices are stored in the cylinder 21 along the lines 2 ₁ , 22 ₂ , and 23, the orientation of the QIP type semiconductor devices to be stored is specified in one direction, and it is possible to prevent them from being stored in different directions. .

Furthermore, according to the shipping package of the above embodiment, since the top lid 27 is pressed and fixed by the rotors 31 and 31' of the fixing member, the QIP type semiconductor device housed in the container is prevented from shaking during transportation. can be prevented.

In the above embodiment, the cutout holes 17 ₁ , 17 ₂ , 18 provided on the outer edge of the protective frame 14 of the QIP type semiconductor device
In response to this, guide protrusions 22 ₁ , 22 ₂ , 23 were provided on the inner wall of the shipping packaging cylinder 21, but the protective frame 14
In the case of a QIP type semiconductor device in which convex protrusions are provided instead of the notched concave holes 17 ₁ , 17 ₂ , 18 , guide grooves corresponding to the convex protrusions may be provided on the inner wall of the cylindrical body 21 . .

In addition, the bottom cover 25 in the above embodiment is replaced by the top cover 27.
Similarly, the fixing members shown in FIGS. 8, 10, and 11 may be used for fixing.

Furthermore, in the above embodiment, the notch holes 17 ₁ , 17 ₂ , 1 of the protective frame 14 in the QIP type semiconductor device
8 is not provided, and the corresponding guide protrusion 22 ₁ ,
22 ₂ and 23 are not provided, and even when the bottom cover 25 is not made vertically slidable, the main feature of the present invention is to achieve high packaging density and achieve efficiency and cost reduction of shipping packaging. effect can be obtained.

Furthermore, the shipping package of the present invention can be used not only for the QIP type semiconductor device shown in FIG.
The present invention can be similarly applied to the QIP type semiconductor devices shown in FIGS. It can also be applied to

As detailed above, according to the semiconductor device shipping package according to the present invention, the cost of shipping and packaging flat type semiconductor devices can be significantly reduced, and furthermore, the shipping and packaging process can be easily automated, etc. It has a remarkable effect.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a conventional QIP type semiconductor device, FIGS. 2 and 3 are explanatory diagrams showing the shipping packaging form of the QIP type semiconductor device of FIG. 1, and FIGS. 4, 5, and 6. 7 is a plan view of an improved QIP type semiconductor device proposed by the applicant, and FIG. 7 is a plan view of the improved QIP type semiconductor device proposed by the applicant.
FIG. 8 is an exploded perspective view showing a shipping package according to an embodiment of the present invention applied to shipping packaging for QIP type semiconductors; FIG. 8 is a perspective view of a fixing member used to press and fix the top cover in the embodiment of FIG. 7; FIG. 9 is an explanatory diagram showing a method of pressing and fixing the top cover using the fixing member shown in FIG. 8, FIGS. 10 and 11 are perspective views showing modified examples of the fixing member, and FIG. FIG. 2 is an explanatory diagram showing a method for automatically taking out individual QIP type semiconductor devices from a shipping package according to an embodiment of the present invention. 11...Resin sealing layer, 12...Mount substrate,
13...Lead, 14,14'...Protection frame, 15 ₁
~15 ₄ ...Bridge portion, 151 _' ~ ₁₅₄ '...Fixing piece, _{161 ~ 164} ...Cutting groove, _171,172,1
8... Notch hole, 21... Cylindrical body, 22 ₁ , 22 ₂ ,
23...Protruding strip for guide, 24...Protruding edge for locking, 2
5... Bottom cover, 27... Top cover, 31, 31'... Rotor, 32... Rotating shaft, 33, 33'... Handle, 34... Leaf spring section, 35... Elevator mechanism, 36... Ejector pin, 37...Belt conveyor.

Claims (1)

[Scope of Claims] 1. A sealed container in which a semiconductor element is sealed, and a plurality of parts connected to the semiconductor element inside the sealed container and extending linearly outward from a side surface of the sealed container. a protective frame disposed further outward from the tip of the lead and fixed to the sealed container, and a notch hole or protrusion provided on the outer edge of the protective frame so as to be entirely asymmetrical. The semiconductor device described above is placed in a container consisting of a cylindrical body provided with guide protrusions or grooves corresponding to the notched holes or protrusions in the depth direction of the inner wall, and a bottom cover provided at the lower end of the cylindrical body. 1. A shipping package for semiconductor devices, characterized in that the notch holes and the protrusions or the protrusions and the grooves are stacked and stored in a fitted state, and the upper opening of the cylindrical body is covered with an upper lid. 2. A shipping package for a semiconductor device according to claim 1, wherein the bottom cover is vertically slidable inside the cylinder. 3. The semiconductor according to claim 1 or 2, characterized in that the top lid is a drop lid that is housed in a cylindrical body, and the top lid that is placed on top of the stacked semiconductor devices is fixed by pressure. Equipment shipping packaging. 4. A rotor having a plurality of pressing surfaces at different distances from the rotating shaft is provided at the inner end of the cylinder of the rotating shaft inserted into a pin hole provided in the cylinder wall, and the pressing surface of the rotor 4. A shipping package for a semiconductor device according to claim 3, wherein the top lid is fixed.