JPH02152680A - Packing container for semiconductor device - Google Patents

Abstract

PURPOSE:To certainly and easily perform packing position setting work and to prevent the generation of an inferior product without receiving a mechanical shock at the time of feeding by providing partitions to the surface of a sponge plate in a packing container. CONSTITUTION:Recessed parts 3 are formed to the upper surface of plate-shaped sponge at a predetermined interval and a sponge conductor 2 is composed of a conductive material, for example, a foamed polystyrene resin containing a carbon powder. A device 4 is inserted in each of the recessed parts 3 of the sponge conductor 2 and fixed thereto by thrusting external leads 5 in the sponge. In fixing this device 4, the circumferential part of each recessed part becomes a partition part to prescribe the position of the device and the adjacent devices are not brought into contact with each other by holding a predetermined interval between the devices and a breakage or chipping of ceramic is prevented. Further, by making the dimension of each recessed part slightly larger than that of the device, the device is prevented from inclination or flying-out and stably contained in each recessed part.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to the structure of a packaging container for packaging a large number of semiconductor devices sealed in ceramic packages side by side.

[Conventional technology]

For information on packaging formats for transporting and moving large numbers of packaged semiconductor devices,
It is described on pages 205 to 206 of the 631st edition of 1986. The above-mentioned document describes that there are bulk packaging in which items are packed vertically and horizontally in a small box or the like at a certain interval, and magazine packaging that uses elongated cartridges or the like.

Particularly in the case of devices using ceramic packages or glass packages, the present applicant has so far adopted flat cases using sponge plates. Referring to FIG. 4, this case has a structure in which a conductor part 9 and a sponge plate 8 are stacked in plastic flat box-shaped upper and lower cases 10 and 11, and a semiconductor device 4 is placed inside the case. The rod 5 protruding from the side surface is inserted into the conductive portion 9Vc and fixed, and the sponge prevents impact during transportation.

[Problem to be solved by the invention]

When packaging the ceramic sealed device in the sponge-filled case described above, the arrangement position of the device,
Spacing etc. are specified by drawings, etc., but since this is done manually, the devices may not always be fixed in the specified position, and the devices may be too close to each other or in a crooked direction. 5) or tilted (
(Fig. 6), there was a risk that the corners of the ceramic package would crack or chip due to the shock caused by the contact between the corners of the ceramic package, resulting in a defective product.

On the other hand, if the distance between devices is too large, there will be wasted space, and there is a risk that devices may come close to each other in different areas and touch each other in order to cover the quantity packed in one case. This resulted in the problem of decreased sexual performance.

The present invention has been made to solve the above-mentioned problems, and its purpose is to provide packaging for semiconductor devices that prevents cracking and chipping during packaging of ceramic glass-sealed devices and improves workability. It is in the provision of containers.

[Means to solve the problem]

In order to achieve the above object, in the packaging container for ceramic-sealed semiconductor devices of the present invention, a plurality of semiconductor devices are arranged and positioned at predetermined intervals on the upper surface of a conductive sponge-like plate. It is provided with a protrusion or recess with a partition.

Further, the conductive sponge plate may be formed by laminating a conductive sponge plate and a frame having a through hole (window) that can define the arrangement position of the semiconductor devices.

[Effect]

By providing a partition on the surface of the sponge-like plate in the packaging container configured as described above, packaging positioning work becomes reliable and easy, and there is no shock during transportation, which prevents the production of defective products. can.

〔Example〕

Examples will be described with reference to the drawings.

Figure 1 shows a packaging container for ceramic encapsulated semiconductor devices.
FIG. 2 is a partial plan view of an embodiment to which the present invention is applied;
FIG. 2 is a sectional view taken along line AA.

1 is a bottom box (case) made of plastic and metal.

2 is a plate-shaped sponge, and recesses 3 are formed at predetermined intervals on the upper surface of the sponge. Sponge conductor is a conductive material,
For example, it is made of foamed polystyrene resin containing carbon powder.

Reference numeral 4 denotes a semiconductor device, which is a DiL (Deal in Line) type package in which a semiconductor element is built into a ceramic package, and external leads 5 are bent downward and protrude from the side surface.

The device 4 is inserted into the recess 3 of the sponge conductor as described above, and its external leads 5 are pierced into the sponge and fixed. When fixing the device 4, the area around the recess 3 acts as a partition to define the position of the device, and adjacent devices are kept at a predetermined distance to avoid cracks or chips in the ceramic. prevent. Furthermore, by making the dimensions of the recess slightly larger than the dimensions of the device, the device can be stably accommodated within the recess without tilting or protruding.

FIG. 3 is a partial perspective view of a packaging container showing another embodiment of the present invention.

In this example, a through hole (window) 7 with a size that allows the device to be inserted.
A plate material 6 with a hole formed therein is laminated on a sponge conductor 8. The plate material 6 having a through hole may be made of the same material as the sponge conductor 8. In this case, the through hole 7 defines the device position, and the external lead of the device 4 is fixed in a state where it is pierced through the lower sponge conductor.

Although not particularly illustrated in this example, an upper lid made of plastic or the like as shown in FIG. 4 elastically covers the top of the packaging container in which the device is packaged, and is fixed to the lower lid. It is a good idea to insert a cushioning sponge between the top lid and the sponge in which the device is buried.

〔Effect of the invention〕

Since the present invention is configured as described above, it produces the effects described below.

(1) By providing uneven partitions on the sponge board, which had previously had a flat top surface, devices do not come into contact with each other, preventing cracking or chipping of the ceramic package. For example, 20 to 30 ceramic sealed devices can be packaged in one case, but with a conventional flat structure, poor appearance due to cracks or chips results in a loss equal to the unit price of 20 devices. If the unit price of the device is 500 yen, it is 10,0
This results in a loss of 00 yen. This amount increases even more when factoring in labor and overhead costs at the assembly plant. The present invention is extremely effective in reducing costs and improving reliability.

(2) The unevenness provided on the sponge board facilitates positioning, allows for standards when packaging, and improves conventionality.

Also, automation becomes possible.

[Brief explanation of the drawing]

FIG. 1 is a partial plan view of a semiconductor device packaging container of the present invention, FIG. 2 is a sectional view taken along line A-A in FIG. Figure 4 is a full front sectional view of a conventional packaging container; Figure 5 is a partial plan view of a conventional device packaging case; FIG. 6 is a partial cross-sectional view of conventional device packaging. 1... Bottom box (case), 2... Conductive sponge board,
3... Recessed portion, 4... Ceramic sealing device, 5.
...External lead, 6...Frame plate, 7...Through hole, 8...
・Conductive sponge board. Figure 1 Figure 3 Figure 2, j-1-k”

Claims (2)

[Claims] 1. A packaging container for packaging multiple semiconductor devices, which has a protrusion on the top surface of a conductive sponge-like plate that serves as a partition that allows multiple semiconductor devices to be packed in a state where they are arranged and positioned at predetermined intervals. 1. A packaging container for a semiconductor device, characterized in that a recess is formed therein. 2. In the packaging container for semiconductor devices according to claim 1, the conductive sponge plate is a laminated structure of a conductive sponge plate and a sponge frame having a through hole that can define the arrangement position of the semiconductor devices. .