JPS63317666A - Target for sputtering - Google Patents

Abstract

PURPOSE:To inhibit the penetration of solder into each joint in the titled target and to prevent solder from entering a thin film during sputtering by treating the joining surfaces of target members so as to reduce the adhesive strength of solder to the joining surfaces. CONSTITUTION:When plural target members 101 are soldered to a backing plate 103 with solder 102 to form a single plate, the joining surfaces 104 of the target members 101 of Fe or the like are treated by Ti vapor deposition or other method so as to reduce the adhesive strength of the solder 102 contg. In or the like to the surfaces 104. Thus, the rise and penetration of the solder 102 into formed joints are inhibited and a split joined target in which the solder 102 and the backing plate 103 are not sputtered during the sputtering of the target can be obtd.

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to the structure of a sputtering target.

[Conventional technology]

Nowadays, mass production of thin films by sputtering is increasingly performed. In order to carry out such mass production, sputtering I! Furthermore, sputtering targets are also becoming larger. When the target material for sputtering is a brittle material such as ceramics or intermetallic compounds, it is difficult to make a single target material, and as a means of increasing the target size, multiple pieces of target material are divided into one sheet. The method used is to join the backing plate and solder it.

FIG. 2 shows an example of a target using splicing, in which three target materials 201 are soldered to one backing plate 202.

[What the invention attempts to solve! 41! lI point] However,
The above-mentioned conventional technology has a problem in that the solder material is sucked up by capillary action when the target material blinks, and the solder material is mixed into the thin film formed by sputtering.

Figure 3 shows 1. A target material 30 is placed on a backing plate 303, showing a main cross-sectional view of a seam according to the prior art.
1 are connected via solder material 302. Solder material is rising to the joint portion 304 of the target material due to capillary action.

Regarding the above-mentioned problem, if the spacing between the target materials is wide, the capillary phenomenon will not occur (but in this case, the erosion at the joint will progress faster than the other two lotions, and the erosion will occur through the gap at the joint). A new problem arises in that the solder material or the backing plate material is frayed.

Therefore, the present invention aims to solve these problems.
The purpose is to provide a splitting and splicing target in which solder material and puffing plate material are not blown away during sputtering.

[Means for solving problems]

The sputtering target of the present invention is a type in which a plurality of divided target materials are soldered to the same backing plate to form a single plate.
It is characterized in that the contact surface of the joint part where the part contacts another part of the target material is treated so that the adhesion tension of the solder material is reduced.

[Effect]

According to the above features of the present invention, if the adhesion tension becomes low,
The capillary rise height also decreases proportionally.

〔Example〕

FIG. 1 is a main sectional view of a cutting edge in an embodiment of the present invention. Target material 101 is soldered to puffing plate 103 via solder material 102.

In this example, an Fe target is used as the target material 101, and on the contact surface 104 of the joint part, (1) Al is evaporated, (2) Cr is evaporated, (3) Ti is 171f, (4
) Na evaporation, and 5) nothing else. After performing the above five types of surface treatment, heat soldering was performed in a vacuum atmosphere without using flux, using copper as the Inx backing plate as the solder material. Vacuum degree is 2X10-'T
The orr1 heat treatment condition was to keep the temperature at 220° C. for 20 minutes and then slowly cool it in a vacuum atmosphere. The capillary rise height is inversely proportional to the length of the gap at the joint, but in this example, a jig was used to push the target material from the left and right so that there was no gap. However, in reality, due to processing accuracy, there is a variation in the gap of about 0 to 1 mm.

Destroy the joint part of the target of the above 6 levels and face 10
The height of capillary rise based on the height of No. 6 is shown in table fi1.

From the results shown in Table 1 and above, the effect of surface treatment is clearly recognized. All of the above effects are thought to be due to the fact that the deposited metal forms oxides or hydroxides, which lowers the adhesion tension. For this reason, it is also effective to oxidize the surface of the target itself.

〔Effect of the invention〕

As described above, according to the present invention, in a sputtering target in which a plurality of divided target materials are soldered to the same packing plate to form a single plate, one part of the target material is other than the target material. By treating the contact surface of the joint part that is in contact with a portion of the joint part so that the adhesion tension of the solder material is low, the solder material rises up the joint part and has the effect of not seeping out.

[Brief explanation of the drawing]

FIG. 1 is a main cross-sectional view of the joint portion of the target of the present invention. Figure 2 shows an example of a target using splicing. Figure 3 is a main sectional view of the spliced part of a conventional target. ／・ ゛

Claims (1)

[Claims] In a sputtering target in which a plurality of divided target materials are soldered to the same backing plate to form a single plate, the contact surface of the joint where one part of the target material contacts another part of the target material is soldered. A sputtering target characterized by being treated to reduce adhesion.