JP3240830B2 - Surface mount component and method of manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount component,
In particular, the present invention relates to a wiring electrode connected to an end face electrode of a substrate.

[0002]

2. Description of the Related Art Conventional surface mount components are shown in FIGS.
This will be described with reference to FIG. 5 and 6, reference numeral 11 denotes a substrate made of, for example, resin or ceramic on which a desired circuit (not shown) is formed. The substrate 11 is drawn from the circuit to the edge of the substrate 11 on the surface of the substrate 11. A wiring electrode 12 is formed, and an end face electrode 13 is formed from the end surface of the substrate 11 to the end of the back surface and the surface of the end of the wiring electrode 12 on the front surface,
The surface mount component 15 is configured.

A method of manufacturing the surface mount component 15 is shown in FIG.
As shown in FIG. 5, after a plurality of wiring electrodes 12 made of, for example, Au or Ag are formed on the surface of a mother substrate 16 having a surface area larger than the surface area of the substrate 11 by vapor deposition, sputtering, plating, or the like, the wiring electrodes 12 are formed. The mother substrate 16 is cut through a cutting line 16a by a dicer or the like through the substrate 12, and a plurality of substrates 11 are obtained. At this time, the end of the wiring electrode 12 is exposed on the cut surface of the substrate 11. afterwards,
From the end surface of the substrate 11 to the end of the back surface and the upper surface of the end of the wiring electrode 12, the end surface electrode 13 is printed and fired with a thick film material such as Ag, Cu or AgPd, and the surface mount component 15 is obtained.

However, the wiring electrode 12 on the cut surface of the substrate 11
As shown in FIG. 8, when the substrate 11 is cut, a burr-like sharp projection 12a is generated at the end of the projection 11a.
Due to 2a, the end face electrode 13 attached to the end of the wiring electrode 12 may be cracked, and the conduction between the wiring electrode 12 and the end face electrode 13 may not be obtained.

For this reason, as shown in FIG. 9, the edge of the substrate 11 and the projections 12a of the wiring electrodes 12 are removed by barrel polishing, or as shown in FIG.
6, a V-groove 17 is formed, the mother substrate 16 is divided from the V-groove 17 by a cutting line 16a, and a method of preventing the projection 12a of the wiring electrode 12 from being generated has been used.

[0006]

However, in the above-mentioned conventional surface mount component 15, the end face electrode 13 is baked, so that the adhesion strength to the substrate 11 and the wiring electrode 12 is high, but the wiring electrode 12 is deposited. Because it is attached to the substrate 11 by sputtering or plating,
The adhesion strength between the substrate 11 and the wiring electrode 12 is low.

Therefore, when a temperature change occurs in the surface-mounted component 15, a difference in the thermal expansion coefficients of the substrate 11, the wiring electrode 12, and the end surface electrode 13 causes the surface-mounted component 15 to change.
Thermal stress occurs in each part of the
When the bonding surface between the substrate 11 and the end surface electrode 13 is to be separated in a direction perpendicular to the end surface of the substrate 11 (the direction of the arrow in FIG. 6), the separation surface is separated from the boundary X between the substrate 11 and the wiring electrode 12 having low adhesion strength. The end face electrode 13 against heat stress.
Peel strength was low.

Further, in the method of barrel polishing the substrate 11 in the manufacturing method, the surface protection step of the circuit and the wiring electrode 12 is performed so that the circuit and the wiring electrode 12 on the surface of the substrate 11 are not removed during the barrel polishing. You need more. In the method of forming the V-groove 17, when the wiring electrodes 12 are formed on both the front and back surfaces of the substrate 11, the V-groove 1 is formed.
7 cannot be simultaneously formed on both the front and back surfaces of the mother substrate 16, it is necessary to form the V-groove 17 on one of the surfaces and then reverse the mother substrate 16 to form the V-groove 17 on the other surface again. Yes, the process was complicated. Further, both methods have a problem that the number of processing steps increases.

SUMMARY OF THE INVENTION The present invention has been made to solve such a problem. A substrate exposure portion is provided between an edge portion of a substrate and an end portion of a wiring electrode so that the wiring electrode is cut when the substrate is cut. An object of the present invention is to provide a surface-mounted component in which continuity between a wiring electrode and an end surface electrode is ensured by preventing the occurrence of a projection, the peel strength of the end surface electrode is increased, and a processing step is simplified, and a method for manufacturing the same. It is.

[0010]

In order to achieve the above object, according to the present invention, a substrate is formed by vapor deposition, sputtering or plating on at least the front or back surface of the substrate.
In a surface mount component having a wiring electrode formed from the above , and an end surface electrode formed of a thick film material covering the end surface of the substrate and the end portion of the wiring electrode, the edge portion of the substrate and the end portion of the wiring electrode An exposed portion of the substrate is provided therebetween, and the end surface electrode is formed from an end surface of the substrate to an end portion of the wiring electrode via the exposed portion of the substrate.

A step of forming a circuit on the mother substrate; and providing a substrate exposed portion of the mother substrate from a cutting line for cutting the mother substrate into a plurality at least on a front surface or a back surface of the mother substrate. A step of forming a wiring electrode connected to a circuit by vapor deposition, sputtering or plating ; a step of cutting the mother substrate into a plurality of substrates by a cutting line of the mother substrate; and a step of exposing the substrate from a cut surface of the plurality of substrates. Forming an end face electrode of a thick film material to the end of the wiring electrode through the step ( c ).

[0012]

According to the above arrangement, since the substrate exposing portion is provided between the edge of the substrate and the end of the wiring electrode, the end surface electrode is exposed to the substrate at the end of the substrate in addition to the end surface of the substrate. It is also joined to the part. Further, since the substrate exposed portion is provided between the cutting line of the mother substrate and the end of the wiring electrode, the wiring electrode is not cut when the mother substrate is cut, and a sharp edge is formed on the end of the wiring electrode. No protrusion occurs. Therefore, no crack occurs in the end face electrode connected to the end of the wiring electrode.

[0013]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a surface mount component and a method of manufacturing the same according to the present invention. 1 and 2
2 shows a partial perspective view and a sectional view of a surface mount component according to a first embodiment of the present invention. FIG. 3 is a sectional view of a surface mount component according to a second embodiment of the present invention.

In FIGS. 1 and 2, reference numeral 1 denotes a substrate made of, for example, resin or ceramic on which a desired circuit (not shown) is formed.
wiring electrodes 2 made of g etc., evaporation, more sputtering or <br/> message key is formed is drawn from the circuit to an edge direction of the substrate 1, and the edge of the substrate 1 and the end portion of the wiring electrodes 2 The substrate exposure part 1a is provided between them. And the substrate 1
To cover the surface of the end of the wiring electrode 2 through the end of the back surface and the exposed portion 1a of the front surface, for example, Ag, Cu
Alternatively, the end face electrode 3 is printed and fired with a thick film material such as AgPd, and the surface mount component 5 is formed.

Further, as shown in FIG. 3, even in the case where the wiring electrodes 2 and 2 are formed on the front and back surfaces of the substrate 1, between the edge of the substrate 1 and the ends of the wiring electrodes 2 and 2, And substrate exposed portions 1a, 1a are provided, and end surface electrodes 3 are formed to cover the surfaces of the ends of the wiring electrodes 2, 2 from the end surfaces of the substrate 1 via the substrate exposed portions 1a, 1a on the front and back surfaces, and surface mounting is performed. A part 6 is formed.

The surface mount components 5 and 6 configured as described above
Since the end face electrode 3 is bonded not only to the end face of the substrate 1 but also to the substrate exposed portion 1a at the end of the substrate 1, the peel strength of the end face electrode 3 due to thermal stress is improved.

Next, a method of manufacturing the surface mount component 5 is shown in FIG. First, a mother substrate 7 having a surface area larger than the surface area of the substrate 1 is prepared. Then, a desired circuit (not shown) is formed on the mother substrate 7, and a substrate exposing portion 1 a is provided on both sides of a cutting line 7 a for cutting the mother substrate 7 into a plurality of substrates 1. On the surface of 7,
For example wiring electrodes 2 made of Au or Ag or the like, is more formed on evaporation or sputtering or plating key.

The mother substrate 7 on which the circuit and wiring electrodes 2 are formed is cut into a plurality of substrates 1 along cutting lines 7a. Thereafter, the end surface of the wiring electrode 2 is covered with a thick film material such as Ag, Cu, or AgPd to cover the end surface of the wiring electrode 2 from the stepped surface of the substrate 1 through the end of the back surface and the exposed portion 1a of the front surface. Are printed and fired to form the surface-mounted component 5.

Also, in the surface-mounted component 6 having the wiring electrodes 2 and 2 formed on the front and back surfaces of the substrate 1, the substrate exposed portions 1a are provided on both sides of the cutting line 7a on the front and back surfaces of the mother substrate 7, respectively. 2 are formed and cut into a plurality of substrates 1 along a cutting line 7a.
An end face electrode 3 is formed to cover the surfaces of the ends of the wiring electrodes 2 and 2 via a, and a surface mount component 6 is formed.

The surface mounting components 5 and 6 thus configured
In the manufacturing method of (1), since the substrate exposed portion 1a is provided between the cutting line of the mother substrate 7 and the end of the wiring electrode 2, the wiring electrode 2 is not cut when the mother substrate 7 is cut. In addition, no sharp protrusion is generated at the end of the wiring electrode 2. Therefore, no crack occurs in the end face electrode 3 provided at the end of the substrate 1 and connected to the end of the wiring electrode 2.

[0021]

As described above, according to the surface-mounted component and the method of manufacturing the same according to the present invention, the substrate exposed portion is provided between the edge of the substrate and the end of the wiring electrode, and the end surface electrode is formed on the substrate. In addition to the end surface, the substrate is also joined to the exposed portion of the end of the substrate, so that the peel strength due to the thermal stress of the end surface electrode is improved. Further, since the substrate exposed portion is provided between the cutting line of the mother substrate and the end of the wiring electrode, the wiring electrode is not cut when the mother substrate is cut, and a sharp projection is formed on the end of the wiring electrode. Does not occur. Therefore, no crack occurs in the end face electrode provided at the end of the substrate and connected to the end of the wiring electrode,
Conduction between the wiring electrode and the end face electrode can be reliably performed.

Furthermore, the step of protecting the surface of the circuit and the wiring electrode and the step of polishing the barrel become unnecessary, and the processing step can be simplified since the front and back surfaces can be processed simultaneously even when the wiring electrodes are provided on the front and back surfaces of the substrate. can do.

[Brief description of the drawings]

FIG. 1 is a partial perspective view of a surface mount component according to a first embodiment of the present invention.

FIG. 2 is a sectional view taken along line AA of FIG.

FIG. 3 is a partial cross-sectional view of a surface mount component according to a second embodiment of the present invention.

FIG. 4 is a cross-sectional view illustrating a method of manufacturing the surface mount component according to the first embodiment of the present invention.

FIG. 5 is a partial perspective view of a conventional surface mount component.

FIG. 6 is a sectional view taken along line BB of FIG. 5;

FIG. 7 is a sectional view of a mother board of a conventional surface mount component.

FIG. 8 is a cross-sectional view showing a projection of a wiring electrode of a conventional surface mount component.

FIG. 9 is a sectional view of a conventional surface mount component after barrel polishing.

FIG. 10 is a cross-sectional view of a mother board, illustrating a second conventional method for manufacturing a surface mount component.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 1a Substrate exposed part 2 Wiring electrode 3 End surface electrode 5,6 Surface mount component 7 Mother substrate 7a Cutting line

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Claims (2)

(57) [Claims] 1. A substrate, a wiring electrode formed by vapor deposition, sputtering or plating on at least the front or back surface of the substrate, and an end electrode formed of a thick film material covering an end surface of the substrate and an end of the wiring electrode. Wherein a substrate exposed portion is provided between an edge of the substrate and an end of a wiring electrode, and the end surface electrode is connected to an end of the wiring electrode from the end surface of the substrate via the substrate exposed portion. A surface mount component characterized by being formed over a part. 2. A step of forming a circuit on a mother substrate, and providing a substrate exposed portion of the mother substrate from a cutting line for cutting the mother substrate into a plurality of pieces on at least a front surface or a back surface of the mother substrate; Wiring electrodes connected to the circuit
A step of forming by vapor deposition, sputtering or plating, a step of cutting the mother substrate into a plurality of substrates with a cutting line of the mother substrate, and a step of cutting the plurality of substrates from the cut surface of the plurality of substrates through the substrate exposed portions of the wiring electrodes. Forming the end surface electrode from a thick film material to the end portion.