JPS6331548U - - Google Patents
Info
- Publication number
- JPS6331548U JPS6331548U JP12524686U JP12524686U JPS6331548U JP S6331548 U JPS6331548 U JP S6331548U JP 12524686 U JP12524686 U JP 12524686U JP 12524686 U JP12524686 U JP 12524686U JP S6331548 U JPS6331548 U JP S6331548U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- package body
- mounting flange
- package
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 6
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図ａ，ｂは本考案の一実施例の平面図及び
その正面図、第２図ａ，ｂは従来構造の平面図及
びその正面図である。
１，１１……取付用フランジ、２……接続用基
板、２ａ，２ｂ……導体膜、３，１３……中心導
体、４，１４……取付孔、５，１５……パツケー
ジ本体、６，１６……バイアス用ピン。
1A and 1B are a plan view and a front view of an embodiment of the present invention, and FIGS. 2A and 2B are a plan view and a front view of a conventional structure. 1, 11... Mounting flange, 2... Connection board, 2a, 2b... Conductor film, 3, 13... Center conductor, 4, 14... Mounting hole, 5, 15... Package body, 6, 16...Bias pin.
Claims (1)
心導体をパツケージ本体から突出形成してなる集
積回路パツケージにおいて、前記パツケージ本体
の取付用フランジに接続用基板を配設するととも
に、この接続用基板に前記中心導体を接続し、こ
の接続用基板と他の基板とをリボン導体等によつ
て電気接続可能に構成したことを特徴とする集積
回路パツケージ。 (2) 接続用基板を取付用フランジに半田付けし
、これに接続したリボン導体により取付用フラン
ジ及びパツケージ本体を接地接続してなる実用新
案登録請求の範囲第１項記載の集積回路パツケー
ジ。[Claims for Utility Model Registration] (1) In an integrated circuit package in which the center conductor of an integrated circuit housed within a package body is formed to protrude from the package body, a connection board is disposed on a mounting flange of the package body. An integrated circuit package characterized in that the center conductor is connected to the connecting board, and the connecting board and another board can be electrically connected to each other by a ribbon conductor or the like. (2) The integrated circuit package according to claim 1, wherein a connecting board is soldered to a mounting flange, and the mounting flange and the package body are grounded by a ribbon conductor connected thereto.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12524686U JPS6331548U (en) | 1986-08-18 | 1986-08-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12524686U JPS6331548U (en) | 1986-08-18 | 1986-08-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6331548U true JPS6331548U (en) | 1988-03-01 |
Family
ID=31017980
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12524686U Pending JPS6331548U (en) | 1986-08-18 | 1986-08-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6331548U (en) |
-
1986
- 1986-08-18 JP JP12524686U patent/JPS6331548U/ja active Pending