JPS6330797B2 - - Google Patents

Info

Publication number
JPS6330797B2
JPS6330797B2 JP54060555A JP6055579A JPS6330797B2 JP S6330797 B2 JPS6330797 B2 JP S6330797B2 JP 54060555 A JP54060555 A JP 54060555A JP 6055579 A JP6055579 A JP 6055579A JP S6330797 B2 JPS6330797 B2 JP S6330797B2
Authority
JP
Japan
Prior art keywords
adhesive
resin
metal foil
heat
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54060555A
Other languages
English (en)
Japanese (ja)
Other versions
JPS55153393A (en
Inventor
Setsuo Suzuki
Yasuo Matsui
Junko Takeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP6055579A priority Critical patent/JPS55153393A/ja
Publication of JPS55153393A publication Critical patent/JPS55153393A/ja
Publication of JPS6330797B2 publication Critical patent/JPS6330797B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP6055579A 1979-05-18 1979-05-18 Method of fabricating circuit board Granted JPS55153393A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6055579A JPS55153393A (en) 1979-05-18 1979-05-18 Method of fabricating circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6055579A JPS55153393A (en) 1979-05-18 1979-05-18 Method of fabricating circuit board

Publications (2)

Publication Number Publication Date
JPS55153393A JPS55153393A (en) 1980-11-29
JPS6330797B2 true JPS6330797B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1988-06-21

Family

ID=13145641

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6055579A Granted JPS55153393A (en) 1979-05-18 1979-05-18 Method of fabricating circuit board

Country Status (1)

Country Link
JP (1) JPS55153393A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007115722A (ja) * 2005-10-17 2007-05-10 Tdk Corp 可撓性配線板及び電子部品

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100505980C (zh) 2003-09-10 2009-06-24 尤尼吉可株式会社 柔性印刷线路板用的基板及其制造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5144947Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1971-04-19 1976-10-30
JPS4936941A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1972-08-24 1974-04-05
JPS4943160A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1972-09-01 1974-04-23
JPS5434140B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1972-11-07 1979-10-25
JPS556316B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1973-03-30 1980-02-15

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007115722A (ja) * 2005-10-17 2007-05-10 Tdk Corp 可撓性配線板及び電子部品

Also Published As

Publication number Publication date
JPS55153393A (en) 1980-11-29

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