JPS6330778B2 - - Google Patents

Info

Publication number
JPS6330778B2
JPS6330778B2 JP53144180A JP14418078A JPS6330778B2 JP S6330778 B2 JPS6330778 B2 JP S6330778B2 JP 53144180 A JP53144180 A JP 53144180A JP 14418078 A JP14418078 A JP 14418078A JP S6330778 B2 JPS6330778 B2 JP S6330778B2
Authority
JP
Japan
Prior art keywords
air supply
processed
vacuum container
objects
exhaust
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP53144180A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5571027A (en
Inventor
Hideo Sakai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP14418078A priority Critical patent/JPS5571027A/ja
Publication of JPS5571027A publication Critical patent/JPS5571027A/ja
Publication of JPS6330778B2 publication Critical patent/JPS6330778B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Drying Of Semiconductors (AREA)
JP14418078A 1978-11-24 1978-11-24 Continuous surface treatment apparatus Granted JPS5571027A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14418078A JPS5571027A (en) 1978-11-24 1978-11-24 Continuous surface treatment apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14418078A JPS5571027A (en) 1978-11-24 1978-11-24 Continuous surface treatment apparatus

Publications (2)

Publication Number Publication Date
JPS5571027A JPS5571027A (en) 1980-05-28
JPS6330778B2 true JPS6330778B2 (cg-RX-API-DMAC10.html) 1988-06-21

Family

ID=15356050

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14418078A Granted JPS5571027A (en) 1978-11-24 1978-11-24 Continuous surface treatment apparatus

Country Status (1)

Country Link
JP (1) JPS5571027A (cg-RX-API-DMAC10.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61168922A (ja) * 1985-01-17 1986-07-30 インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション プラズマ・エツチング装置
JPH0810688B2 (ja) * 1986-11-17 1996-01-31 東京エレクトロン株式会社 アッシング装置
JPH0810689B2 (ja) * 1986-12-22 1996-01-31 東京エレクトロン株式会社 アッシング処理装置
JPH0225577A (ja) * 1988-07-15 1990-01-29 Mitsubishi Electric Corp 薄膜形成装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5617952Y2 (cg-RX-API-DMAC10.html) * 1975-02-24 1981-04-27
US4341592A (en) * 1975-08-04 1982-07-27 Texas Instruments Incorporated Method for removing photoresist layer from substrate by ozone treatment
JPS5378170A (en) * 1976-12-22 1978-07-11 Toshiba Corp Continuous processor for gas plasma etching
JPS5827656B2 (ja) * 1976-11-17 1983-06-10 株式会社東芝 プラズマcvd装置
JPS5374372A (en) * 1976-12-15 1978-07-01 Hitachi Ltd Plasma cvd device
JPS5512733A (en) * 1978-07-14 1980-01-29 Anelva Corp Dry process etching device

Also Published As

Publication number Publication date
JPS5571027A (en) 1980-05-28

Similar Documents

Publication Publication Date Title
KR950034488A (ko) 반도체 제조장치 및 반도체장치의 제조방법과 반도체장치
KR970072182A (ko) 플라즈마 처리방법 및 그 장치
US20070054064A1 (en) Microwave plasma processing method, microwave plasma processing apparatus, and its plasma head
GB2115334A (en) Wafer support system
US11495442B2 (en) Batch type substrate processing apparatus
JPS6330778B2 (cg-RX-API-DMAC10.html)
JPS55166926A (en) Dry etching apparatus
JP6348321B2 (ja) エッチング装置
KR100725785B1 (ko) 플라스마 에칭 장치
JP2006005007A (ja) アモルファスシリコン層の形成方法及び形成装置
JPS6056793B2 (ja) プラズマ表面処理装置
JP4504723B2 (ja) 放電プラズマ処理装置及び放電プラズマ処理方法
JP2006049367A (ja) プラズマ処理装置
JPS6059078A (ja) ドライエツチング装置
JPS62221116A (ja) プラズマ処理装置
JP2005268709A (ja) 表面処理装置及び表面処理方法
KR100683255B1 (ko) 플라즈마 처리 장치 및 배기 장치
JPH1140395A (ja) プラズマ処理装置
JPH043927A (ja) 半導体処理装置
JP2791795B2 (ja) エッチング装置
JPS5964779A (ja) 多チヤンバ−ドライエツチング装置
JPS5826429B2 (ja) プラズマ表面処理装置
JPH05335281A (ja) ドライエッチング装置
JPS6223087Y2 (cg-RX-API-DMAC10.html)
JPH0551952U (ja) プラズマ処理装置