JPS63307265A - スパッタリング・タ−ゲット - Google Patents

スパッタリング・タ−ゲット

Info

Publication number
JPS63307265A
JPS63307265A JP14059987A JP14059987A JPS63307265A JP S63307265 A JPS63307265 A JP S63307265A JP 14059987 A JP14059987 A JP 14059987A JP 14059987 A JP14059987 A JP 14059987A JP S63307265 A JPS63307265 A JP S63307265A
Authority
JP
Japan
Prior art keywords
target
pieces
sputtering
melting point
point metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14059987A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0414186B2 (enExample
Inventor
Tatsuzo Kawaguchi
川口　達三
Toshinari Yamazaki
山崎　登志成
Kenji Kumagai
熊谷　憲司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Tokuda Seisakusho Co Ltd
Original Assignee
Toshiba Corp
Tokuda Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokuda Seisakusho Co Ltd filed Critical Toshiba Corp
Priority to JP14059987A priority Critical patent/JPS63307265A/ja
Publication of JPS63307265A publication Critical patent/JPS63307265A/ja
Publication of JPH0414186B2 publication Critical patent/JPH0414186B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
JP14059987A 1987-06-04 1987-06-04 スパッタリング・タ−ゲット Granted JPS63307265A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14059987A JPS63307265A (ja) 1987-06-04 1987-06-04 スパッタリング・タ−ゲット

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14059987A JPS63307265A (ja) 1987-06-04 1987-06-04 スパッタリング・タ−ゲット

Publications (2)

Publication Number Publication Date
JPS63307265A true JPS63307265A (ja) 1988-12-14
JPH0414186B2 JPH0414186B2 (enExample) 1992-03-12

Family

ID=15272449

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14059987A Granted JPS63307265A (ja) 1987-06-04 1987-06-04 スパッタリング・タ−ゲット

Country Status (1)

Country Link
JP (1) JPS63307265A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0618306A3 (en) * 1988-05-16 1994-10-26 Toshiba Kk Sputtering target.

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6167768A (ja) * 1984-09-12 1986-04-07 Hitachi Ltd スパツタタ−ゲツト
JPS6342157U (enExample) * 1986-09-08 1988-03-19
JPS63183170A (ja) * 1987-01-27 1988-07-28 Shinku Zairyo Kk マグネトロンスパツタ用モザイクタ−ゲツト

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6167768A (ja) * 1984-09-12 1986-04-07 Hitachi Ltd スパツタタ−ゲツト
JPS6342157U (enExample) * 1986-09-08 1988-03-19
JPS63183170A (ja) * 1987-01-27 1988-07-28 Shinku Zairyo Kk マグネトロンスパツタ用モザイクタ−ゲツト

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0618306A3 (en) * 1988-05-16 1994-10-26 Toshiba Kk Sputtering target.

Also Published As

Publication number Publication date
JPH0414186B2 (enExample) 1992-03-12

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees