JPS63300546A - High-frequency hybrid integrated circuit device - Google Patents

Abstract

PURPOSE:To form an earth terminal which can be applied to a circuit device of an existing product by attaching an earth plate made of metal to a heat sink plate, and integrally forming a plurality of earth terminals disposed in parallel between lead terminals. CONSTITUTION:After an earth plate 11 is mounted on a heat sink plate 32 by inserting it from the side of lead terminals 33,... of a circuit device 10, the cutouts 13a, 13b of mounts 13, 13 are clamped and connected together by a bolt inserted to the cutouts 32a, 32b of the plate 32, and mounted on a metal chassis. The ends of the earth terminals 15,... of the device 10 and the outer ends of the lead terminals 33,... arranged on the chassis are respectively electrically connected to circuit wirings of a printed circuit substrate arranged on the same chassis.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a high frequency hybrid integrated circuit device equipped with a heat sink, and more particularly to a ground terminal mounting structure thereof.

[Conventional technology]

Conventionally, this kind of high frequency hybrid integrated circuit bag! As a circuit device (hereinafter referred to as a circuit device), one shown in the perspective view of FIG. 3 is known. This circuit device 30 includes an integrated circuit element (not shown) arranged in a camp 31 made of resin or the like, and a planar rectangular heat sink 32 made of a copper-based metal material. The integrated circuit element is composed of a ceramic substrate on which a high frequency hybrid integrated circuit is formed and necessary electronic components.

An example part of this integrated circuit element includes a plurality of (four in the figure) lead terminals 33 as input/output leads and power supply leads. ... are provided in parallel, and these lead terminals 33. The outer ends of ... are drawn out to the outside of the camp 31. Further, the integrated circuit element and the heat sink 32 are integrally joined by soldering via a ground electrode portion formed on the back surface of the ceramic substrate, and the heat sink 32 is also used as a ground for the integrated circuit element. There is.

Further, this circuit device 30 is mounted on a metal chassis (not shown) by bolts inserted into notches 32a, 32a formed at both ends of the heat sink 320, and the lead terminals 33. By electrically connecting each of these to circuit wiring such as a printed wiring board (not shown) arranged on the same chassis, high-frequency electronic equipment such as a transceiver is constructed. There is.

[Problem that the invention seeks to solve]

By the way, in order to obtain the required good electrical characteristics in the circuit device 30 used in a high frequency circuit, the quality of the ground connection is very important, and if this connection is insufficient, oscillation and gain may occur. There is a problem in that inconveniences such as low φ of φ are caused. Furthermore, in the circuit device 30, there is a problem in that stray capacitance coupling occurs between the lead terminals 33, . . . of the integrated circuit element.

Therefore, in order to obtain even better electrical characteristics, in addition to the ground extraction via the heat sink 32, which is generally done as described above, the wiring pattern of the ceramic substrate constituting the integrated circuit element is It has been considered to provide ground terminals and connect these terminals directly to the printed wiring board. However, this has the following problems. In other words, if the integration density of electronic components mounted on a ceramic substrate is low and there is a margin, a ground terminal can be provided, but in response to recent strong demands, high density and high packaging integrated circuit elements Because there is not enough space, it is not possible to provide a ground terminal.

Furthermore, the already manufactured circuit device 30 has a conventional structure.
In other words, it is sometimes desired to improve the electrical characteristics of an existing product by providing a ground terminal as described above on the ceramic substrate. However, in order to meet such demands, there is no choice but to newly manufacture the circuit device 30 itself, which requires extra effort and cost.

This invention was devised to solve the above-mentioned problems, and aims to further improve the electrical characteristics of a high-frequency hybrid integrated circuit device, as well as to improve the electrical characteristics of a ready-made circuit device. The purpose is to provide a grounding terminal that can also be applied.

[Means for solving problems]

In order to achieve such an object, the present invention provides a high frequency hybrid integrated circuit device comprising an integrated circuit element having a plurality of lead terminals and a heat sink, in which a ground plate made of metal is attached to the heat sink. In addition, the earth plate is characterized in that a plurality of earth terminals arranged in parallel between the lead terminals are integrally formed.

[Effect]

According to the above configuration, the ground plate is attached to the heat dissipation plate outside the cap by so-called external attachment without making any changes to the integrated circuit element disposed inside the cap of the circuit device. each will be placed between the lead terminals of the integrated circuit element.

Therefore, regardless of the level of integration density of the integrated circuit elements, the ground plate can be easily attached to the heat sink, and these ground terminals can be directly connected to the printed wiring board.

(Example〕 Hereinafter, one embodiment of the present invention will be described based on the drawings.

FIG. 1 is a perspective view showing the overall configuration of a high frequency hybrid integrated circuit device, and FIG. 2 is a perspective view showing the ground plate thereof.

In this embodiment, there is nothing different from the conventional example shown in FIG. 3 other than the provision of a grounding plate, so parts and components in FIG. 1 that correspond to those in FIG. 3 are given the same reference numerals. The explanation here will be omitted.

Reference numeral 10 in FIG. 1 is a high frequency hybrid integrated circuit device, and a ground plate 11 having a shape shown in FIG. 2 is disposed on a heat sink 32 of this circuit device 10.

This ground plate 11 is made of a copper-based metal plate having a thickness of 0.5 m or less, and is formed by, for example, press punching. The thickness and material of the ground plate 11 may be selected in consideration of its workability and conductivity, and are not limited to the thickness and material described above.

This grounding plate 11 is provided with a pair of mounting parts 13.13 facing each other with a notch 12 of a size corresponding to the outer shape of the cap 31 in the longitudinal direction of the heat sink 32, and these mounting parts 13.13 are They are each formed to have the same substantially rectangular shape and narrower than the heat sink 32 . Each outer end portion is provided with a semicircular cutout portion 13a on the inner end side, the size of which matches the bolt attachment notches 32a formed in the heat sink 32.

13a is formed.

Further, from each one end side along the longitudinal direction of the heat sink 32 in these mounting portions 13.13, a connecting portion 14 that connects these together in the longitudinal direction is pulled out, and this connecting portion 14 connects the heat sink 32. One end surface 32b along the long side direction of
It is bent to the side.

Further, on one side (the upper side in the figure) of this connection portion 14, lead terminals 33. ...Multiple wires arranged in parallel between them (three wires in the figure)
Ground terminal 15. ... are formed integrally with the connecting portion 14 and spaced apart from each other by a predetermined distance of +8'+m.

These ground terminals15. . . . First, the connection part 14
After being bent from the upper side of the cap to an outward position where the cap 31 can be avoided, it is bent upward along the outer surface of the cap 31. The tips of these ground terminals 15°... are connected to the lead terminals 33. of the integrated circuit element. ... Extends along the pull-out direction of the outer end.

Note that such a ground terminal 15. It goes without saying that the shapes of the tips of these can be changed as appropriate depending on the position of the circuit wiring on the printed wiring board to which they are to be connected.

This ground plate 11 is connected to the lead terminal 33 of the circuit device 10 which has the same structure as the conventional example. After being mounted on the heat sink 32 by inserting it from the side, the notches 13a, 13a of the mounting portion 13.13 are connected together by bolts etc. inserted into the notches 32a, 32a of the heat sink 32, respectively. It is tightened and mounted on a metal chassis (not shown). That is, the ground plate 11 is electrically connected to the heat sink 32 as a ground of the circuit device 10 by co-tightening with bolts. However, the electrical connection between the two is not limited to this (for example, earth v
ill and the heat sink 32 may be connected by mechanically integrating them by soldering or bonding with a conductive adhesive. In addition, in such a case, it is not necessary to form the notches 13a, 13a in the attachment part 13.13 of the ground plate 11. A ground terminal 15 of the circuit device 10 disposed on the metal chassis. ... and the lead terminal 33. ... are electrically connected to circuit wiring such as a printed wiring board (not shown) disposed on the same chassis.

As explained above, in this embodiment, the ground plate 11 can be attached to the heat sink 32 by so-called external attachment without making any changes to the integrated circuit element disposed in the cap 31 of the circuit device IO. This also results in a ground terminal 15 formed integrally with the ground plate 11. . . are lead terminals 33. of the integrated circuit element. ...will be placed in between.

〔Effect of the invention〕

According to this invention, a metal grounding plate is attached to the heat sink of the high frequency hybrid integrated circuit device, and a grounding terminal is formed on this grounding plate, so that the 4J integrated circuit placed in the cap of the circuit device The ground plate can be attached to the heat sink by so-called external attachment, regardless of the element. Also, by this, each of the ground terminals is arranged in parallel between the lead terminals of the integrated circuit element.

Therefore, it does not matter whether the integration density of integrated circuit elements is high or low, or whether the circuit device is an off-the-shelf product or not.
, the ground plate can be easily attached to the heat sink.

Furthermore, not only can the ground terminal formed on this ground plate be directly connected to the circuit wiring on the printed wiring board, but this ground terminal also reliably prevents inconveniences such as stray capacitance coupling that occurs between lead terminals. can do.

[Brief explanation of drawings]

1 and 2 show an embodiment of the present invention, with FIG. 1 being a perspective view of a high frequency hybrid integrated circuit device, and FIG. 2 being a perspective view of its ground plate. Moreover, FIG. 3 shows a perspective view of a circuit device according to a conventional example. In these figures, reference numerals 10 and 30 indicate a high frequency hybrid integrated circuit device, 11 a ground plate, 15 a ground terminal, 32 a heat sink, and 33 a lead terminal of an integrated circuit element. Note that the same reference numerals in the figures indicate the same or equivalent parts.

Claims (1)

[Claims] (1) In a high frequency hybrid integrated circuit device comprising an integrated circuit element having a plurality of lead terminals and a heat sink, a ground plate made of metal is attached to the heat sink, and the ground plate is provided with the lead terminals. A high frequency hybrid integrated circuit device characterized by integrally forming a plurality of ground terminals arranged in parallel between them.