JPS6328985B2 - - Google Patents

Info

Publication number
JPS6328985B2
JPS6328985B2 JP55056316A JP5631680A JPS6328985B2 JP S6328985 B2 JPS6328985 B2 JP S6328985B2 JP 55056316 A JP55056316 A JP 55056316A JP 5631680 A JP5631680 A JP 5631680A JP S6328985 B2 JPS6328985 B2 JP S6328985B2
Authority
JP
Japan
Prior art keywords
target
target electrode
sputtering
thickness distribution
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55056316A
Other languages
English (en)
Japanese (ja)
Other versions
JPS56152963A (en
Inventor
Hide Kobayashi
Katsuo Abe
Tsuneaki Kamei
Tokio Isogai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP5631680A priority Critical patent/JPS56152963A/ja
Publication of JPS56152963A publication Critical patent/JPS56152963A/ja
Publication of JPS6328985B2 publication Critical patent/JPS6328985B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Physical Vapour Deposition (AREA)
JP5631680A 1980-04-30 1980-04-30 Sputtering apparatus Granted JPS56152963A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5631680A JPS56152963A (en) 1980-04-30 1980-04-30 Sputtering apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5631680A JPS56152963A (en) 1980-04-30 1980-04-30 Sputtering apparatus

Publications (2)

Publication Number Publication Date
JPS56152963A JPS56152963A (en) 1981-11-26
JPS6328985B2 true JPS6328985B2 (en, 2012) 1988-06-10

Family

ID=13023744

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5631680A Granted JPS56152963A (en) 1980-04-30 1980-04-30 Sputtering apparatus

Country Status (1)

Country Link
JP (1) JPS56152963A (en, 2012)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0399291U (en, 2012) * 1990-01-31 1991-10-16

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0699801B2 (ja) * 1985-04-26 1994-12-07 松下電器産業株式会社 多成分薄膜の製造方法
US4957605A (en) * 1989-04-17 1990-09-18 Materials Research Corporation Method and apparatus for sputter coating stepped wafers
US7837836B2 (en) * 2004-02-12 2010-11-23 Seagate Technology Llc Method and apparatus for multi-stage sputter deposition of uniform thickness layers

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5239851U (en, 2012) * 1975-09-11 1977-03-22
JPS559634Y2 (en, 2012) * 1976-02-20 1980-03-03

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0399291U (en, 2012) * 1990-01-31 1991-10-16

Also Published As

Publication number Publication date
JPS56152963A (en) 1981-11-26

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