JPS6328620Y2 - - Google Patents
Info
- Publication number
- JPS6328620Y2 JPS6328620Y2 JP14185582U JP14185582U JPS6328620Y2 JP S6328620 Y2 JPS6328620 Y2 JP S6328620Y2 JP 14185582 U JP14185582 U JP 14185582U JP 14185582 U JP14185582 U JP 14185582U JP S6328620 Y2 JPS6328620 Y2 JP S6328620Y2
- Authority
- JP
- Japan
- Prior art keywords
- interlocking
- members
- lead
- suction member
- heater chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14185582U JPS5948100U (ja) | 1982-09-21 | 1982-09-21 | ボンデイング装置におけるヒ−タチツプの連動構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14185582U JPS5948100U (ja) | 1982-09-21 | 1982-09-21 | ボンデイング装置におけるヒ−タチツプの連動構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5948100U JPS5948100U (ja) | 1984-03-30 |
| JPS6328620Y2 true JPS6328620Y2 (enrdf_load_stackoverflow) | 1988-08-02 |
Family
ID=30317142
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14185582U Granted JPS5948100U (ja) | 1982-09-21 | 1982-09-21 | ボンデイング装置におけるヒ−タチツプの連動構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5948100U (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2817198B2 (ja) * | 1989-05-22 | 1998-10-27 | 松下電器産業株式会社 | デバイスのボンディングヘッド及びボンディング方法 |
| JP2717353B2 (ja) * | 1994-03-04 | 1998-02-18 | デンオン機器株式会社 | はんだ付け部品取り外し装置 |
-
1982
- 1982-09-21 JP JP14185582U patent/JPS5948100U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5948100U (ja) | 1984-03-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5518410A (en) | Contact pin device for IC sockets | |
| EP1266230B1 (en) | Method and apparatus for planarizing a semiconductor substrate in a probe card assembly | |
| TWM275561U (en) | Electrical connector | |
| JP2672450B2 (ja) | 電気接触子 | |
| JPS6328620Y2 (enrdf_load_stackoverflow) | ||
| JPS62256441A (ja) | ダイボンデイング装置 | |
| JP2002367747A (ja) | Ｉｃソケット | |
| JP2003202352A (ja) | チップに実装された接触スプリング | |
| JPH07122624A (ja) | ウェハのプリアライメント装置 | |
| US6620285B2 (en) | Method for bonding substrates | |
| JP2009115664A (ja) | 電子部品とプローブカードの接触におけるセルフアライメント機構 | |
| JP3854322B2 (ja) | ヘッドテスターの磁気ヘッド装着方法および装着機構 | |
| JPH0173927U (enrdf_load_stackoverflow) | ||
| JP2868029B2 (ja) | 精密平面調芯機構 | |
| JP3073936B2 (ja) | コネクタ | |
| JPS59228720A (ja) | 整合装置 | |
| JPS58183642U (ja) | 角度調整装置 | |
| JPH0414931Y2 (enrdf_load_stackoverflow) | ||
| JPH02139814A (ja) | リード端子のクランプ機構 | |
| JP3497793B2 (ja) | 磁気ヘッド | |
| JPS5987605U (ja) | 接触式プロ−ブ装置 | |
| JP3347025B2 (ja) | バンプボンディング装置及び方法 | |
| JP2524502B2 (ja) | 半導体素子のピックアップ装置 | |
| JPH06635A (ja) | はんだこて | |
| JPH0630863B2 (ja) | 吸着ノズルの回り留め装置 |