JPS6326543B2 - - Google Patents

Info

Publication number
JPS6326543B2
JPS6326543B2 JP56160209A JP16020981A JPS6326543B2 JP S6326543 B2 JPS6326543 B2 JP S6326543B2 JP 56160209 A JP56160209 A JP 56160209A JP 16020981 A JP16020981 A JP 16020981A JP S6326543 B2 JPS6326543 B2 JP S6326543B2
Authority
JP
Japan
Prior art keywords
metal substrate
insulating plate
sub
semiconductor chip
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56160209A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5861637A (ja
Inventor
Tatsuo Yamazaki
Noritoshi Kotsuji
Toshiki Kurosu
Yoichi Nakajima
Isao Kojima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Minebea Power Semiconductor Device Inc
Original Assignee
Hitachi Ltd
Hitachi Haramachi Electronics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Haramachi Electronics Ltd filed Critical Hitachi Ltd
Priority to JP56160209A priority Critical patent/JPS5861637A/ja
Publication of JPS5861637A publication Critical patent/JPS5861637A/ja
Publication of JPS6326543B2 publication Critical patent/JPS6326543B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/073—
    • H10W72/01308—
    • H10W72/07311—
    • H10W72/07337—
    • H10W72/354—
    • H10W72/381—
    • H10W72/5363—
    • H10W72/884—
    • H10W90/734—

Landscapes

  • Die Bonding (AREA)
JP56160209A 1981-10-09 1981-10-09 絶縁モ−ルド型半導体装置 Granted JPS5861637A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56160209A JPS5861637A (ja) 1981-10-09 1981-10-09 絶縁モ−ルド型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56160209A JPS5861637A (ja) 1981-10-09 1981-10-09 絶縁モ−ルド型半導体装置

Publications (2)

Publication Number Publication Date
JPS5861637A JPS5861637A (ja) 1983-04-12
JPS6326543B2 true JPS6326543B2 (enExample) 1988-05-30

Family

ID=15710109

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56160209A Granted JPS5861637A (ja) 1981-10-09 1981-10-09 絶縁モ−ルド型半導体装置

Country Status (1)

Country Link
JP (1) JPS5861637A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0429945U (enExample) * 1990-07-04 1992-03-10

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1146988C (zh) * 1997-12-08 2004-04-21 东芝株式会社 半导体功率器件的封装及其组装方法
DE19959248A1 (de) * 1999-12-08 2001-06-28 Daimler Chrysler Ag Isolationsverbesserung bei Hochleistungs-Halbleitermodulen

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0429945U (enExample) * 1990-07-04 1992-03-10

Also Published As

Publication number Publication date
JPS5861637A (ja) 1983-04-12

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