JPS6325744Y2 - - Google Patents
Info
- Publication number
- JPS6325744Y2 JPS6325744Y2 JP7163683U JP7163683U JPS6325744Y2 JP S6325744 Y2 JPS6325744 Y2 JP S6325744Y2 JP 7163683 U JP7163683 U JP 7163683U JP 7163683 U JP7163683 U JP 7163683U JP S6325744 Y2 JPS6325744 Y2 JP S6325744Y2
- Authority
- JP
- Japan
- Prior art keywords
- holes
- heat dissipation
- heat
- insulating plate
- cylindrical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000017525 heat dissipation Effects 0.000 claims description 18
- 239000004065 semiconductor Substances 0.000 claims description 8
- 238000009413 insulation Methods 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000010445 mica Substances 0.000 description 4
- 229910052618 mica group Inorganic materials 0.000 description 4
- 230000015556 catabolic process Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7163683U JPS59177954U (ja) | 1983-05-16 | 1983-05-16 | 半導体素子の取付装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7163683U JPS59177954U (ja) | 1983-05-16 | 1983-05-16 | 半導体素子の取付装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59177954U JPS59177954U (ja) | 1984-11-28 |
JPS6325744Y2 true JPS6325744Y2 (zh) | 1988-07-13 |
Family
ID=30201787
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7163683U Granted JPS59177954U (ja) | 1983-05-16 | 1983-05-16 | 半導体素子の取付装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59177954U (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0755187B2 (ja) * | 1988-11-15 | 1995-06-14 | 松下電器産業株式会社 | 調理器 |
JP4494398B2 (ja) * | 2006-12-28 | 2010-06-30 | Tdkラムダ株式会社 | 放熱構造 |
-
1983
- 1983-05-16 JP JP7163683U patent/JPS59177954U/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS59177954U (ja) | 1984-11-28 |
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