JPS6325498B2 - - Google Patents

Info

Publication number
JPS6325498B2
JPS6325498B2 JP54092266A JP9226679A JPS6325498B2 JP S6325498 B2 JPS6325498 B2 JP S6325498B2 JP 54092266 A JP54092266 A JP 54092266A JP 9226679 A JP9226679 A JP 9226679A JP S6325498 B2 JPS6325498 B2 JP S6325498B2
Authority
JP
Japan
Prior art keywords
substrate
bubble
processing
etching
processed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54092266A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5617021A (en
Inventor
Soji Oomura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP9226679A priority Critical patent/JPS5617021A/ja
Publication of JPS5617021A publication Critical patent/JPS5617021A/ja
Publication of JPS6325498B2 publication Critical patent/JPS6325498B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3046—Mechanical treatment, e.g. grinding, polishing, cutting using blasting, e.g. sand-blasting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP9226679A 1979-07-20 1979-07-20 Surface treatment of substrate Granted JPS5617021A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9226679A JPS5617021A (en) 1979-07-20 1979-07-20 Surface treatment of substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9226679A JPS5617021A (en) 1979-07-20 1979-07-20 Surface treatment of substrate

Publications (2)

Publication Number Publication Date
JPS5617021A JPS5617021A (en) 1981-02-18
JPS6325498B2 true JPS6325498B2 (enrdf_load_stackoverflow) 1988-05-25

Family

ID=14049587

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9226679A Granted JPS5617021A (en) 1979-07-20 1979-07-20 Surface treatment of substrate

Country Status (1)

Country Link
JP (1) JPS5617021A (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58123730A (ja) * 1982-01-18 1983-07-23 Toshiba Corp 半導体ウエハ−エツチング装置
JPS6386525A (ja) * 1986-09-30 1988-04-16 Kyushu Denshi Kinzoku Kk 半導体シリコンウエ−ハのエツチング装置
JPH0160532U (enrdf_load_stackoverflow) * 1987-10-13 1989-04-17
US7648584B2 (en) * 2003-06-27 2010-01-19 Lam Research Corporation Method and apparatus for removing contamination from substrate
CN103377878A (zh) * 2012-04-18 2013-10-30 三菱电机株式会社 凹凸化硅基板的制造方法、处理装置和太阳能电池元件的制造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE823525A (fr) * 1973-12-19 1975-06-18 Traitement de galettes de semi-conducteurs
JPS5110770A (ja) * 1974-07-16 1976-01-28 Matsushita Electric Ind Co Ltd Etsuchinguhoho
JPS5115977A (en) * 1974-07-31 1976-02-07 Hitachi Ltd Banjobutsuno keishaetsuchinguho

Also Published As

Publication number Publication date
JPS5617021A (en) 1981-02-18

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