JPS63250828A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS63250828A
JPS63250828A JP62084758A JP8475887A JPS63250828A JP S63250828 A JPS63250828 A JP S63250828A JP 62084758 A JP62084758 A JP 62084758A JP 8475887 A JP8475887 A JP 8475887A JP S63250828 A JPS63250828 A JP S63250828A
Authority
JP
Japan
Prior art keywords
ball
bonding
wire
chip
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62084758A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0468777B2 (enExample
Inventor
Hitoshi Onuki
仁 大貫
Masahiro Koizumi
小泉　正博
Hitoshi Suzuki
斉 鈴木
Isao Araki
荒木　勲
Susumu Okikawa
進 沖川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP62084758A priority Critical patent/JPS63250828A/ja
Priority to US07/134,458 priority patent/US4976393A/en
Priority to DE8787311245T priority patent/DE3777384D1/de
Priority to EP87311245A priority patent/EP0276564B1/en
Priority to KR870014962A priority patent/KR880008437A/ko
Publication of JPS63250828A publication Critical patent/JPS63250828A/ja
Publication of JPH0468777B2 publication Critical patent/JPH0468777B2/ja
Priority to SG40094A priority patent/SG40094G/en
Priority to HK59294A priority patent/HK59294A/en
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45015—Cross-sectional shape being circular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H10W72/01551—
    • H10W72/07141—
    • H10W72/075—
    • H10W72/07511—
    • H10W72/07533—
    • H10W72/07541—
    • H10W72/07551—
    • H10W72/07555—
    • H10W72/50—
    • H10W72/536—
    • H10W72/551—
    • H10W72/5522—
    • H10W72/5525—
    • H10W72/59—
    • H10W72/952—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
JP62084758A 1986-12-26 1987-04-08 半導体装置 Granted JPS63250828A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP62084758A JPS63250828A (ja) 1987-04-08 1987-04-08 半導体装置
US07/134,458 US4976393A (en) 1986-12-26 1987-12-17 Semiconductor device and production process thereof, as well as wire bonding device used therefor
DE8787311245T DE3777384D1 (de) 1986-12-26 1987-12-21 Drahtverbindung.
EP87311245A EP0276564B1 (en) 1986-12-26 1987-12-21 Wire bonding
KR870014962A KR880008437A (ko) 1986-12-26 1987-12-26 반도체 장치 및 그 제조방법과 이에 사용하는 와이어 본딩장치
SG40094A SG40094G (en) 1986-12-26 1994-03-21 Wire bonding
HK59294A HK59294A (en) 1986-12-26 1994-06-23 Wire bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62084758A JPS63250828A (ja) 1987-04-08 1987-04-08 半導体装置

Publications (2)

Publication Number Publication Date
JPS63250828A true JPS63250828A (ja) 1988-10-18
JPH0468777B2 JPH0468777B2 (enExample) 1992-11-04

Family

ID=13839583

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62084758A Granted JPS63250828A (ja) 1986-12-26 1987-04-08 半導体装置

Country Status (1)

Country Link
JP (1) JPS63250828A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5116783A (en) * 1989-01-13 1992-05-26 Mitsubishi Denki Kabushiki Kaisha Method of producing semiconductor device
US5229646A (en) * 1989-01-13 1993-07-20 Mitsubishi Denki Kabushiki Kaisha Semiconductor device with a copper wires ball bonded to aluminum electrodes

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5116783A (en) * 1989-01-13 1992-05-26 Mitsubishi Denki Kabushiki Kaisha Method of producing semiconductor device
US5229646A (en) * 1989-01-13 1993-07-20 Mitsubishi Denki Kabushiki Kaisha Semiconductor device with a copper wires ball bonded to aluminum electrodes

Also Published As

Publication number Publication date
JPH0468777B2 (enExample) 1992-11-04

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