JPS63248578A - 被覆線の超音波ボンデイング方法 - Google Patents

被覆線の超音波ボンデイング方法

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Publication number
JPS63248578A
JPS63248578A JP62081213A JP8121387A JPS63248578A JP S63248578 A JPS63248578 A JP S63248578A JP 62081213 A JP62081213 A JP 62081213A JP 8121387 A JP8121387 A JP 8121387A JP S63248578 A JPS63248578 A JP S63248578A
Authority
JP
Japan
Prior art keywords
terminal
wire
ultrasonic
covered
rough
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62081213A
Other languages
English (en)
Inventor
Kazunori Hori
堀　和則
Minoru Taguchi
実 田口
Shigeo Hara
茂雄 原
Tokiyuki Sedou
瀬藤　時幸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Hitachi Information and Telecommunication Engineering Ltd
Original Assignee
Hitachi Computer Peripherals Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Computer Peripherals Co Ltd, Hitachi Ltd filed Critical Hitachi Computer Peripherals Co Ltd
Priority to JP62081213A priority Critical patent/JPS63248578A/ja
Priority to EP88105309A priority patent/EP0286031A2/en
Publication of JPS63248578A publication Critical patent/JPS63248578A/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
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    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
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  • Wire Bonding (AREA)
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  • Manufacturing Of Electrical Connectors (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 ［産業上の利用分野］ 本発明は、超音波ボンディング装置を利用して被覆線の
芯線を端子に接続する被覆線の超音波ボンディング方法
に係り、特にミクロンオーダの径の芯線をポリウレタン
等の樹脂で絶縁被覆してなる被覆線の超音波ボンディン
グ方法に関する。
［従来の技術］ 被覆線の芯線を端子に接続する方法としては、超音波方
式、熱圧着方式、熱圧着超音波併用方式のもの等、種々
のものが提案され、実用に供されている。
前記超音波方式のものは、第６図に示すように、超音波
ボンディング装置の超音波チップａにより被覆線すの芯
線Ｃを端子ｄに加振・加圧して接続するようにしており
、被覆線すから芯線Ｃを露出させる為には予め被覆線の
被覆部を除去しておく。
一方、熱圧着方式のものは、熱圧着ボンディング装置の
ボンダーが被覆線の被覆部を加熱し、溶かすことによっ
て除去し、その後露出した芯線を端子に接続するように
している。
他方、熱圧着超音波併用方式のものは、特公昭５７−５
９６８０号公報に示されるように、熱圧着方式により溶
接チップで被覆線の被覆部を加熱して溶かし、芯線が露
出すると、前記溶接チップが芯線を端子に加振・加圧さ
せることにより接続するようにしている。
［発明が解決しようとする問題点］ ところで、超音波方式のものは、超音波ボンディング装
置の超音波チップが被覆線の被覆部を加振・加圧したの
では被覆部と端子表面との間で空滑りを生じるので、予
め被覆部を除去しなければならないことが余儀なくされ
ている。
一方、熱圧着方式のものは、ボンディングに十分な容量
のボンダーを使うと、被覆線の被覆部が必要以上に溶け
すぎて裸部分が長くなり、そのため、裸部分が隣接する
他の導体部と接触してショートするおそれがある。
他方、熱圧着超音波併用方式のものは、チップに熱圧着
機能と超音波機能とを持たせるため、装置の構造が複雑
になる問題がある。
本発明の目的は、従来技術の問題点に鑑み、超音波ボン
ディング装置を用いても、被覆線の被覆部と端子間で空
滑りが生じるのを防ぎ、しかも被覆線の被覆部を簡単に
除去できるようにする被覆線の超音波ボンディング方法
を提供することにある。
［問題点を解決するための手段］ 本発明方法では、被覆線の被覆部と超音波チップとの何
れか一方の接触面に粗ら仕上部を設ける処理と、被覆線
の被覆部と端子との何れか一方の接触面を粗ら仕上部を
設ける処理と、超音波チップにより被覆線の被覆部を端
子に対し加振・加圧する処理とを有している。
［作用］ 超音波チップにより被覆線の被覆部を端子に加振・加圧
すると、被覆部と超音波チップとの何れか一方の接触面
に設けた粗ら仕上部により、超音波チップ及び被覆部間
の摩擦抵抗が増大して両者間に空滑りが発生せず、かつ
被覆部と端子との何れか一方の接触面に設けた粗ら仕上
部により、被覆部及び端子間の摩擦抵抗が増大して両者
間にも空滑りが発生しないので、第１．第２の粗ら仕上
部により被覆部が削り取られて芯線を露出させ、露出し
た芯線を端子にボンディングする。
その結果、従来の超音波ボンディングタイプに比較する
と、被覆線の芯線を露出すべく被覆部を除去することが
不要になるので、簡単かつ確実に超音波ボンディングで
き、それだけ生産性を高め得る効果がある。
［実施例］ 以下、本発明の実施例を第１図乃至第５図について説明
する。第１図は本発明方法を磁気ディスク装置のコアス
ライダに適用した第１の実施例を示１、　　　　　　　
−　　　斜視図、第２図は被覆線とコアスライダの端子
の位置決め状態を示す斜視図、第３図は超音波ボンディ
ング装置の動作時を示す断面図、第４図は被覆線とコア
スライダの端子との接続状態を示す斜視図、第５図は被
覆線及び端子の接続に要する時間と端子表面粗らさとの
関係を示す説明図である。
実施例の被覆線の超音波ボンディング方法は、磁気ディ
スク装置に使用されるコアスライダ１に利用さ、れてお
り、コアスライダ１の端子２に対し被覆線としてのリー
ド線３を、超音波ボンディング装置の超音波チップ１０
によって加振・加圧することによりボンディングするよ
うにしている。
具体的に述べると、実施例の超音波ボンディング方法は
、予め、超音波ボンディング装置の超音波チップ１０に
おけるリード線３の被覆部４との接触面に第１の粗ら仕
上部１１が設けられると共に、コアスライダ１の端子２
におけるリード線３の被覆部４との接触面に第２の粗ら
仕上部５が設けられている。
前記第１の粗ら仕上部１１は、超音波チップ１０の先端
面にローレット加工等によって目の細かいノコギリ形状
に形成され、後述するように超音波チップ１０がリード
線３を端子２に加振・加圧動作させたとき、リード線３
の被覆部４に喰い込む如く該被覆部４と超音波チップ１
０間の摩擦抵抗を増大させることによって超音波チップ
１０と被覆部４間に空滑りが生じないようにしている。
第２の粗ら仕上部５は端子２の表面に第１の粗ら仕上部
１１と同様に形成され、リード線３の被覆部４に喰い込
む如く該被覆部４と端子２間の摩擦抵抗を増大させるこ
とによって被覆部４と端子２間に空滑りが生じないよう
にしている。
そして、第２図に示すようにリード線３の被覆部４とコ
アスライダ１の端子２とを超音波ボンディング装置のボ
ンディング台（図示せず）にセットした後、第３図に示
すように、超音波チップ１０により被覆部４を端子２に
対し加振・加圧する。
このようにして超音波チップ１０で加振・加圧すると、
超音波チップ１０に設けられた第１の粗ら仕上部１１に
よって超音波チップＩＯとリード線３の被覆部４間に空
滑りが発生せず、端子２に設けられた第２の粗ら仕上部
５によって被覆部４と端子２間に空滑りが発生しないの
で、第１．第２の粗ら仕上部１１，５により被覆部４が
削り取られて芯線６を露出させ、露出した芯線６を端子
２にボンディングすることができる。
その場合、第１．第２の粗ら仕上部１１，５の目の粗ら
さＲｍａｘとしては、第５図に示すように、細かいと、
空滑りの発生によってボンディング不良が生じ、また荒
くとも、被覆部４を巻き込んでボンディング不良が生じ
るので、およそ０．０５〜５μｍ程度にすれば、良好な
ボンディング状態を得ることができる。
その結果、従来の超音波ボンディングタイプに比較する
と、リード線３の被覆部４を予め除去しておくことが不
要になり、また熱圧着ボンディングタイプに比較すると
、被覆部４の不要な部分まで溶かすことがないのでショ
ートするおそれがなく、さらに熱圧着超音波併用ボンデ
ィングタイプに比較すると、実施するための装置の構造
を簡素化・できる。
°なお図示実施例では、第１の粗ら仕上部１１が超音波
チップ１０に、第２の粗ら仕上部５が端子２に設けられ
た例を示したが、本発明方法においては必ずしもそれに
限定されるものではなく、例えば第１の粗ら仕上部１１
が超音波チップ１０と被覆部４との何れか一方の接触面
に、かつ第２の粗ら仕上部５が被覆部４と端子２との何
れか一方の接触面に設けても、超音波チップ１０と被覆
部４間、該被覆部４と端子間で空滑りの発生を防ぎ得る
ので、所期の効果を得ることができる。
［発明の効果］ 以上述べたように、本発明方法によれば、被覆線の被覆
部と超音波チップとの何れか一方の接触面に第１の粗ら
仕上部を設ける手順と、被覆線の被覆部と端子との何れ
か一方の接触面に第１の粗ら仕上部を設ける手順と、超
音波チップにより被覆線の被覆部を端子に対し加振・加
圧する処理とを有し、超音波チップにより被覆線の被覆
部を加振・加圧処理したとき、第１の粗ら仕上部によっ
て超音波チップと被覆部間に空滑りが発生するのを防ぐ
と共に、第２の粗ら仕上部によって被覆部と端子間に空
滑りが発生するのを防ぎ、被覆部を削り取って被覆部の
露出した芯線を端子にボンディングするようにしたので
、超音波ボンディングタイプであっても、被覆線の被覆
部を予め除去しておくことが不要になる結果、簡単かつ
確実に超音波ボンディングでき、生産性を高め得る効果
がある。
【図面の簡単な説明】
第１図は本発明方法を磁気ディスク装置のコアスライダ
に適用した第１の実施例を示す斜視図。 第２図は被覆線とコアスライダの端子の位置決め状態を
示す斜視図、第３図は超音波ボンディング装置の動作時
を示す断面図、第４図は被覆線と端子との接続状態を示
す斜視図、第５図は被覆線及び端子の接続に要する時間
と端子の表面粗さとの関係を示す説明図、第６図は従来
の被覆線の超音波ボンディング方法を示す斜視図である
。 ２・・・端子、３・・・リード線、４・・・被覆部、５
・・・端子に設けた粗ら仕上部、１０・・・超音波チッ
プ、１１・・・超音波に設けた粗ら仕上部。 代理人　弁理士　　秋　本　正　実 第１図 第２図 第３図 第４図

Claims (1)

    【特許請求の範囲】
  1. １、被覆線の被覆部と超音波チップとの何れか一方の接
    触面を粗ら仕上加工する処理と、被覆線の被覆部と端子
    との何れか一方の接触面を粗ら仕上加工する処理と、超
    音波チップにより被覆線の被覆部を端子に対し加振・加
    圧する処理とを有することを特徴とする被覆線の超音波
    ボンディング方法。
JP62081213A 1987-04-03 1987-04-03 被覆線の超音波ボンデイング方法 Pending JPS63248578A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP62081213A JPS63248578A (ja) 1987-04-03 1987-04-03 被覆線の超音波ボンデイング方法
EP88105309A EP0286031A2 (en) 1987-04-03 1988-03-31 Ultrasonic wire bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62081213A JPS63248578A (ja) 1987-04-03 1987-04-03 被覆線の超音波ボンデイング方法

Publications (1)

Publication Number Publication Date
JPS63248578A true JPS63248578A (ja) 1988-10-14

Family

ID=13740204

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62081213A Pending JPS63248578A (ja) 1987-04-03 1987-04-03 被覆線の超音波ボンデイング方法

Country Status (2)

Country Link
EP (1) EP0286031A2 (ja)
JP (1) JPS63248578A (ja)

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JP2005183451A (ja) * 2003-12-16 2005-07-07 Fujikura Ltd 接合体およびその製造方法
JP2005183588A (ja) * 2003-12-18 2005-07-07 Fujikura Ltd 接合体およびその製造方法
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US5104028A (en) * 1989-12-28 1992-04-14 Electric Power Research Institute, Inc. Method for joining transformer coil conductors
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US5971251A (en) * 1997-10-27 1999-10-26 Lear Automotive Dearborn, Inc. Method of welding a terminal to a flat flexible cable
US6588646B2 (en) * 2001-11-24 2003-07-08 Delphi Technologies, Inc. Ultrasonic welding of wires through the insulation jacket thereof
US6837751B2 (en) 2002-07-25 2005-01-04 Delphi Technologies, Inc. Electrical connector incorporating terminals having ultrasonically welded wires
US8610274B2 (en) 2010-09-14 2013-12-17 Infineon Technologies Ag Die structure, die arrangement and method of processing a die
US9306381B2 (en) 2013-11-15 2016-04-05 Yazaki North America, Inc. Electrical device having busbar with flexible weld crimp
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JP4729795B2 (ja) * 2000-02-10 2011-07-20 株式会社村田製作所 電子デバイス素子の実装方法
JP2005183451A (ja) * 2003-12-16 2005-07-07 Fujikura Ltd 接合体およびその製造方法
JP4526813B2 (ja) * 2003-12-16 2010-08-18 株式会社フジクラ 接合体の製造方法
JP2005183588A (ja) * 2003-12-18 2005-07-07 Fujikura Ltd 接合体およびその製造方法
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WO2020208850A1 (ja) * 2019-04-09 2020-10-15 株式会社カイジョー 絶縁被覆線の接合方法、接続構造、絶縁被覆線の剥離方法及びボンディング装置
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