JPS6324697A - Manufacture of wiring board - Google Patents
Manufacture of wiring boardInfo
- Publication number
- JPS6324697A JPS6324697A JP16840086A JP16840086A JPS6324697A JP S6324697 A JPS6324697 A JP S6324697A JP 16840086 A JP16840086 A JP 16840086A JP 16840086 A JP16840086 A JP 16840086A JP S6324697 A JPS6324697 A JP S6324697A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- hole
- metal plate
- metal layer
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 24
- 239000002184 metal Substances 0.000 claims description 24
- 238000005553 drilling Methods 0.000 claims description 9
- 238000005530 etching Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 7
- 238000007747 plating Methods 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- UZIJLTBYAYIURJ-JAIQZWGSSA-N 2-[(z)-(9-hydroxy-10-methoxy-2,2,4-trimethyl-1h-chromeno[3,4-f]quinolin-5-ylidene)methyl]thiophene-3-carbonitrile Chemical compound C1=CC=2NC(C)(C)C=C(C)C=2C2=C1C=1C(OC)=C(O)C=CC=1O\C2=C/C=1SC=CC=1C#N UZIJLTBYAYIURJ-JAIQZWGSSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010291 electrical method Methods 0.000 description 1
- 238000002848 electrochemical method Methods 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は内層に金属層を形成した配線板の製造方法に関
する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method of manufacturing a wiring board in which a metal layer is formed as an inner layer.
従来の技術
従来は、金属板に対し、あらかじめ孔明けを行い、プリ
プレグを介して銅張り積層板を加圧成形して一体化した
後、基板を貫通する孔明けを行いスルーホールめっきを
行って配線板を！！ｊ 造していた。Conventional technology Conventionally, holes are drilled in a metal plate in advance, and a copper-clad laminate is pressure-formed and integrated via prepreg, and then a hole is drilled through the board and through-hole plating is performed. Wiring board! ! j was building.
発明が解決しようとする問題点
従来の方法は、プリプレグを用いて成形する作業や孔明
けを２回行わねばならない等作業工程が複雑で面倒であ
った。Problems to be Solved by the Invention In the conventional method, the work steps were complicated and troublesome, such as molding using prepreg and drilling the holes twice.
問題点を解決するための手段
本発明は内層として金属板を用い、この金属板の両面に
絶縁層を設け、この上に導電回路が形成された印刷配線
板を用い、この配線板を貫通する孔明けを行い、導電回
路と内層金属板との接、続を望まない金属板の孔壁面部
をエツチング処理した後、スルーホールめっきを行って
配線板を％ｌＪ Ｑする。Means for Solving the Problems The present invention uses a metal plate as an inner layer, an insulating layer is provided on both sides of this metal plate, and a printed wiring board is used on which a conductive circuit is formed, and a conductive circuit is passed through this wiring board. After drilling holes and etching the hole wall portions of the metal plate where connection between the conductive circuit and the inner layer metal plate is not desired, through-hole plating is performed to complete the wiring board.
作用
本発明の配線板は、内層金属板、絶縁層及び表面導電回
路層を印刷法及びめっき法で形成した後、所望する箇所
に後からドリルで孔明けを行い、内層の金属板と外層導
電部と接続を望まない箇所については、金属層の孔壁面
部をエツチング処理し。Function The wiring board of the present invention is manufactured by forming an inner metal plate, an insulating layer, and a surface conductive circuit layer by a printing method and a plating method, and then drilling holes at desired locations to connect the inner metal plate and the outer conductive layer. For areas where connection is not desired, the hole wall surface of the metal layer is etched.
この後化学めっきを行ってスルーホールを形成するので
、作業工程が簡単な製造方法である。After this, chemical plating is performed to form through-holes, so the manufacturing process is simple.
実施例
鉄、アルミ等の金属板１を用い、この金属板１の表裏面
に絶縁層３，４を介して導電回路６，７を形成した印刷
配線板１ｏに対し、所望箇所に貫通する孔をドリル１２
で孔明け１４．１５を行う。Example A printed wiring board 1o using a metal plate 1 made of iron, aluminum, etc., and having conductive circuits 6, 7 formed on the front and back surfaces of the metal plate 1 via insulating layers 3, 4, is provided with holes penetrating at desired locations. drill 12
Perform hole drilling at 14.15.
この孔明け１４のうち金属板１と回路６，７との接続を
望まない箇所については、ドリル１２と金属板１との間
に電圧を印加しておくとよい。It is advisable to apply a voltage between the drill 12 and the metal plate 1 in the portions of the drilling 14 where connection between the metal plate 1 and the circuits 6 and 7 is not desired.
孔明け１４のうち、金属板１の孔壁面１６のエツチング
を行う手段として電気的な方法としては、電極１７を孔
１４に挿入し、金属板１との内に電圧を印加し孔壁面１
６の端部をエツチングする。An electrical method for etching the hole wall surface 16 of the metal plate 1 in the hole drilling 14 is to insert the electrode 17 into the hole 14 and apply a voltage between the hole wall surface 1 and the metal plate 1.
Etch the ends of 6.
また電気化学的方法としては電解液１８中に配線板１０
を投入しエツチング処理する。さらにエツチング液１９
に配線板１０を浸漬して化学的にエツチングしてもよい
。このときに金属板１と外部回路６．７との接続を行う
箇所の孔１５にはエツチング液１９が侵入しないよう保
護フィルム２０を付着しておくとよい。Further, as an electrochemical method, a wiring board 10 is placed in an electrolytic solution 18.
and etching process. Furthermore, etching liquid 19
The wiring board 10 may also be chemically etched by immersing it in the etching process. At this time, it is preferable to attach a protective film 20 to the hole 15 where the metal plate 1 is connected to the external circuit 6.7 to prevent the etching liquid 19 from entering.
配線板１０をエツチング処理して欠落した欠落部２２に
絶縁樹脂２４を充填しておくとよい。It is preferable that the wiring board 10 is etched and the missing parts 22 are filled with an insulating resin 24.
この後、スルーホールめっきを行ってスルーホール２６
．２７を形成する。スルーホール２６は導電回路６．７
と内層金属板１と接続され、スルーホール２７は外部導
電回路６，７間のみが電気的に接続される。After this, through-hole plating is performed to form the through-hole 26.
．． form 27. Through hole 26 is conductive circuit 6.7
and the inner layer metal plate 1, and the through hole 27 is electrically connected only between the external conductive circuits 6 and 7.
発明の効果
本発明の配線板の製造方法は以上に述べた如きもので、
配線板の全ての箇所に最初孔明けを行い、必要な箇所の
みエツチング処理して、内層金属板に欠落部を形成すれ
ばよく、このエツチング処理も電気的方法、化学的方法
、及び電気化学的な方法等選択応用範囲が広く、実用上
価値が大なる発明である。Effects of the Invention The method for manufacturing a wiring board of the present invention is as described above,
All you need to do is to first drill holes in all parts of the wiring board and then perform etching only in the necessary parts to form the missing parts in the inner layer metal plate. This invention has a wide range of selective applications, including various methods, and is of great practical value.
第１図は本発明の断面図、第２図はドリルで孔明けして
いる断面図、第３図乃至第５図はエツチングの方法を示
す断面図、第６図は絶縁４ｉｉ１脂が充填された断面図
である。
図面において、
１：金属板、 ３．４：絶縁層、
６．７：導電回路、 １０：配線板、
１２ニトリル、 １４．１５孔明け、
１６：孔壁面、 ２６．２７：スルーホール。Fig. 1 is a sectional view of the present invention, Fig. 2 is a sectional view of drilling holes, Figs. FIG. In the drawings, 1: metal plate, 3.4: insulating layer, 6.7: conductive circuit, 10: wiring board, 12 nitrile, 14. 15 hole drilling, 16: hole wall surface, 26. 27: through hole.
Claims (2)
縁層を介して導電回路が形成された印刷配線板を用い、
貫通する孔明けを行い、導電回路と内層の金属層との接
続を望まない金属層の孔壁面部を電気的又は電気化学的
にエッチング処理し、スルーホールめっきを行うことを
特徴とする配線板の製造方法。(1) Using a printed wiring board that has a metal layer as an inner layer and conductive circuits are formed on both sides of this metal layer via an insulating layer,
A wiring board characterized by drilling a through hole, electrically or electrochemically etching the hole wall portion of the metal layer where connection between the conductive circuit and the inner metal layer is not desired, and performing through hole plating. manufacturing method.
脂を充填硬化した特許請求の範囲第１項記載の配線板の
製造方法。(2) The method for manufacturing a wiring board according to claim 1, wherein the etched portions of the hole wall surface of the metal layer are filled with a resin and hardened.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16840086A JPS6324697A (en) | 1986-07-17 | 1986-07-17 | Manufacture of wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16840086A JPS6324697A (en) | 1986-07-17 | 1986-07-17 | Manufacture of wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6324697A true JPS6324697A (en) | 1988-02-02 |
Family
ID=15867414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16840086A Pending JPS6324697A (en) | 1986-07-17 | 1986-07-17 | Manufacture of wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6324697A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5756996A (en) * | 1980-09-19 | 1982-04-05 | Hitachi Chemical Co Ltd | Method of producing multilayer printed circuit board |
| JPS59175797A (en) * | 1983-03-25 | 1984-10-04 | 富士通株式会社 | Method of producing multilayer printed plate |
-
1986
- 1986-07-17 JP JP16840086A patent/JPS6324697A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5756996A (en) * | 1980-09-19 | 1982-04-05 | Hitachi Chemical Co Ltd | Method of producing multilayer printed circuit board |
| JPS59175797A (en) * | 1983-03-25 | 1984-10-04 | 富士通株式会社 | Method of producing multilayer printed plate |
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