JPS63243856A - 半導体パッケージの熱特性測定方法 - Google Patents

半導体パッケージの熱特性測定方法

Info

Publication number
JPS63243856A
JPS63243856A JP63054725A JP5472588A JPS63243856A JP S63243856 A JPS63243856 A JP S63243856A JP 63054725 A JP63054725 A JP 63054725A JP 5472588 A JP5472588 A JP 5472588A JP S63243856 A JPS63243856 A JP S63243856A
Authority
JP
Japan
Prior art keywords
resistor
temperature
package
resistance value
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63054725A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0531102B2 (enExample
Inventor
ディー・ハミル・バイアド・ジュニア
マイケル・エイチ・ウイリアムス
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tektronix Inc
Original Assignee
Tektronix Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tektronix Inc filed Critical Tektronix Inc
Publication of JPS63243856A publication Critical patent/JPS63243856A/ja
Publication of JPH0531102B2 publication Critical patent/JPH0531102B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2896—Testing of IC packages; Test features related to IC packages
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/18—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer
    • G01K7/183—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer characterised by the use of the resistive element
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/18—Investigating or analyzing materials by the use of thermal means by investigating thermal conductivity
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Biochemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Analytical Chemistry (AREA)
  • General Engineering & Computer Science (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
JP63054725A 1987-03-09 1988-03-08 半導体パッケージの熱特性測定方法 Granted JPS63243856A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US23595 1987-03-09
US07/023,595 US4734641A (en) 1987-03-09 1987-03-09 Method for the thermal characterization of semiconductor packaging systems

Publications (2)

Publication Number Publication Date
JPS63243856A true JPS63243856A (ja) 1988-10-11
JPH0531102B2 JPH0531102B2 (enExample) 1993-05-11

Family

ID=21816093

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63054725A Granted JPS63243856A (ja) 1987-03-09 1988-03-08 半導体パッケージの熱特性測定方法

Country Status (3)

Country Link
US (1) US4734641A (enExample)
EP (1) EP0283778A1 (enExample)
JP (1) JPS63243856A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011151973A1 (ja) * 2010-06-03 2011-12-08 株式会社日立製作所 電子式制御装置及びその余寿命予測方法

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FR2606887B1 (fr) * 1986-11-18 1989-01-13 Thomson Semiconducteurs Circuit de mesure des caracteristiques dynamiques d'un boitier pour circuit integre rapide, et procede de mesure de ces caracteristiques dynamiques
US4902139A (en) * 1988-04-13 1990-02-20 General Electric Company Apparatus and method for measuring the thermal performance of a heated or cooled component
US4944035A (en) * 1988-06-24 1990-07-24 Honeywell Inc. Measurement of thermal conductivity and specific heat
JP3151203B2 (ja) * 1988-11-23 2001-04-03 テキサス インスツルメンツ インコーポレイテツド 集積回路の自己検査装置
US5177696A (en) * 1989-12-28 1993-01-05 Honeywell Inc. Method of determination of gas properties at reference conditions
US5187674A (en) * 1989-12-28 1993-02-16 Honeywell Inc. Versatile, overpressure proof, absolute pressure sensor
US4994737A (en) * 1990-03-09 1991-02-19 Cascade Microtech, Inc. System for facilitating planar probe measurements of high-speed interconnect structures
US5263775A (en) * 1991-02-01 1993-11-23 Aetrium, Inc. Apparatus for handling devices under varying temperatures
CA2073899A1 (en) * 1991-07-19 1993-01-20 Tatsuya Hashinaga Burn-in apparatus and method
CA2073886A1 (en) * 1991-07-19 1993-01-20 Tatsuya Hashinaga Burn-in apparatus and method
CA2073916A1 (en) * 1991-07-19 1993-01-20 Tatsuya Hashinaga Burn-in apparatus and method
CA2073896A1 (en) * 1991-07-19 1993-01-20 Tatsuya Hashinaga Burn-in apparatus and method
US5302022A (en) * 1992-12-22 1994-04-12 Vlsi Technology, Inc. Technique for measuring thermal resistance of semiconductor packages and materials
GB9323417D0 (en) * 1993-11-12 1994-01-05 Univ Waterloo Non-intrusive state observation of vlsi circuits using thermal actuation
BE1008808A3 (nl) * 1994-10-19 1996-08-06 Imec Inter Uni Micro Electr Inrichting en werkwijze voor het evalueren van de thermische weerstand van een halfgeleider-component.
US5574109A (en) * 1995-02-01 1996-11-12 Bridgestone Corporation Aminoalkyllithium compounds containing cyclic amines and polymers therefrom
US6232789B1 (en) 1997-05-28 2001-05-15 Cascade Microtech, Inc. Probe holder for low current measurements
US6046433A (en) * 1998-09-11 2000-04-04 Linear Technology Corporation Monolithic integrated circuit die heater and methods for using same
US6203191B1 (en) * 1998-10-28 2001-03-20 Speculative Incorporated Method of junction temperature determination and control utilizing heat flow
US6590405B2 (en) * 1999-04-21 2003-07-08 Advantest, Corp CMOS integrated circuit and timing signal generator using same
US6433567B1 (en) * 1999-04-21 2002-08-13 Advantest Corp. CMOS integrated circuit and timing signal generator using same
DE20114544U1 (de) 2000-12-04 2002-02-21 Cascade Microtech, Inc., Beaverton, Oreg. Wafersonde
US6637930B2 (en) * 2001-10-02 2003-10-28 International Rectifier Corporation Method for calculating the temperature rise profile of a power MOSFET
EP1509776A4 (en) 2002-05-23 2010-08-18 Cascade Microtech Inc PROBE TO TEST ANY TESTING EQUIPMENT
US6984064B1 (en) * 2002-07-31 2006-01-10 Advanced Micro Devices, Inc. Thermal transfer measurement of an integrated circuit
US6724205B1 (en) 2002-11-13 2004-04-20 Cascade Microtech, Inc. Probe for combined signals
US7057404B2 (en) 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
DE112004002554T5 (de) 2003-12-24 2006-11-23 Cascade Microtech, Inc., Beaverton Active wafer probe
DE202005021435U1 (de) 2004-09-13 2008-02-28 Cascade Microtech, Inc., Beaverton Doppelseitige Prüfaufbauten
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US7449899B2 (en) 2005-06-08 2008-11-11 Cascade Microtech, Inc. Probe for high frequency signals
WO2006137979A2 (en) 2005-06-13 2006-12-28 Cascade Microtech, Inc. Wideband active-passive differential signal probe
US7327150B2 (en) * 2005-10-11 2008-02-05 Intel Corporation Integrated circuit package resistance measurement
DE112007001399T5 (de) 2006-06-09 2009-05-07 Cascade Microtech, Inc., Beaverton Messfühler für differentielle Signale mit integrierter Symmetrieschaltung
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
US7443186B2 (en) 2006-06-12 2008-10-28 Cascade Microtech, Inc. On-wafer test structures for differential signals
US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
CN102207534B (zh) * 2011-03-18 2013-04-17 华南师范大学 利用pn结测量LED热阻的方法及其装置
KR101900378B1 (ko) * 2012-05-25 2018-11-02 에스케이하이닉스 주식회사 리프레쉬회로
CN105004752B (zh) * 2015-08-12 2017-06-27 中国电子科技集团公司第四十七研究所 多管芯器件热阻测试方法

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US3982218A (en) * 1974-09-19 1976-09-21 Corning Glass Works Temperature sensing device and method
US4186368A (en) * 1978-05-30 1980-01-29 Tektronix, Inc. Wide range, quick response temperature probe sensor
JPS56161649A (en) * 1980-05-16 1981-12-12 Fujitsu Ltd Measuring method of thermal resistance of semiconductor package
JPS5958828A (ja) * 1982-09-28 1984-04-04 Fujitsu Ltd 樹脂封止型半導体装置のスクリ−ニング法
US4695578A (en) * 1984-01-25 1987-09-22 Glaxo Group Limited 1,2,3,9-tetrahydro-3-imidazol-1-ylmethyl-4H-carbazol-4-ones, composition containing them, and method of using them to treat neuronal 5HT function disturbances
IN165267B (enExample) * 1984-07-31 1989-09-09 Rosemount Inc
JPS61181103A (ja) * 1985-02-06 1986-08-13 シャープ株式会社 白金測温抵抗体
JPS61188901A (ja) * 1985-02-16 1986-08-22 株式会社日本自動車部品総合研究所 流量センサ用膜式抵抗
US4684884A (en) * 1985-07-02 1987-08-04 Gte Communication Systems Corporation Universal test circuit for integrated circuit packages

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011151973A1 (ja) * 2010-06-03 2011-12-08 株式会社日立製作所 電子式制御装置及びその余寿命予測方法

Also Published As

Publication number Publication date
JPH0531102B2 (enExample) 1993-05-11
US4734641A (en) 1988-03-29
EP0283778A1 (en) 1988-09-28

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