JPS63239998A - 配線材料の製造方法 - Google Patents

配線材料の製造方法

Info

Publication number
JPS63239998A
JPS63239998A JP7170787A JP7170787A JPS63239998A JP S63239998 A JPS63239998 A JP S63239998A JP 7170787 A JP7170787 A JP 7170787A JP 7170787 A JP7170787 A JP 7170787A JP S63239998 A JPS63239998 A JP S63239998A
Authority
JP
Japan
Prior art keywords
formula
wiring material
formulas
group
bis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7170787A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0543314B2 (enrdf_load_stackoverflow
Inventor
尚 渡辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Chemical and Materials Co Ltd
Original Assignee
Nippon Steel Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Chemical Co Ltd filed Critical Nippon Steel Chemical Co Ltd
Priority to JP7170787A priority Critical patent/JPS63239998A/ja
Publication of JPS63239998A publication Critical patent/JPS63239998A/ja
Publication of JPH0543314B2 publication Critical patent/JPH0543314B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions

Landscapes

  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP7170787A 1987-03-27 1987-03-27 配線材料の製造方法 Granted JPS63239998A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7170787A JPS63239998A (ja) 1987-03-27 1987-03-27 配線材料の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7170787A JPS63239998A (ja) 1987-03-27 1987-03-27 配線材料の製造方法

Publications (2)

Publication Number Publication Date
JPS63239998A true JPS63239998A (ja) 1988-10-05
JPH0543314B2 JPH0543314B2 (enrdf_load_stackoverflow) 1993-07-01

Family

ID=13468279

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7170787A Granted JPS63239998A (ja) 1987-03-27 1987-03-27 配線材料の製造方法

Country Status (1)

Country Link
JP (1) JPS63239998A (enrdf_load_stackoverflow)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02150452A (ja) * 1988-12-01 1990-06-08 Sumitomo Bakelite Co Ltd 低熱膨張ポリイミドフィルム
JPH03149227A (ja) * 1989-11-06 1991-06-25 Sumitomo Bakelite Co Ltd 樹脂組成物
US6344308B1 (en) 1998-11-20 2002-02-05 Sony Chemicals Corp. Method of manufacturing a flexible circuit board
US6346298B1 (en) 1998-12-21 2002-02-12 Sony Chemicals Corp. Flexible board
US6658722B1 (en) 1998-12-28 2003-12-09 Sony Chemicals Corporation Process for producing magnetic head suspension
US6705007B1 (en) 1998-12-28 2004-03-16 Sony Chemicals Corp. Method for manufacturing double-sided flexible printed board
JP2010150379A (ja) * 2008-12-25 2010-07-08 Jsr Corp ポリイミド系材料、フィルム及び組成物、並びにその製造方法
JP2010180292A (ja) * 2009-02-04 2010-08-19 Jsr Corp 芳香族ジアミン化合物、ポリイミド系材料、フィルム及びその製造方法

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02150452A (ja) * 1988-12-01 1990-06-08 Sumitomo Bakelite Co Ltd 低熱膨張ポリイミドフィルム
JPH03149227A (ja) * 1989-11-06 1991-06-25 Sumitomo Bakelite Co Ltd 樹脂組成物
US6344308B1 (en) 1998-11-20 2002-02-05 Sony Chemicals Corp. Method of manufacturing a flexible circuit board
US6346298B1 (en) 1998-12-21 2002-02-12 Sony Chemicals Corp. Flexible board
US6658722B1 (en) 1998-12-28 2003-12-09 Sony Chemicals Corporation Process for producing magnetic head suspension
US6705007B1 (en) 1998-12-28 2004-03-16 Sony Chemicals Corp. Method for manufacturing double-sided flexible printed board
US7213334B2 (en) 1998-12-28 2007-05-08 Sony Corporation Method for manufacturing double-sided flexible printed board
JP2010150379A (ja) * 2008-12-25 2010-07-08 Jsr Corp ポリイミド系材料、フィルム及び組成物、並びにその製造方法
JP2010180292A (ja) * 2009-02-04 2010-08-19 Jsr Corp 芳香族ジアミン化合物、ポリイミド系材料、フィルム及びその製造方法

Also Published As

Publication number Publication date
JPH0543314B2 (enrdf_load_stackoverflow) 1993-07-01

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