JPS6323661B2 - - Google Patents

Info

Publication number
JPS6323661B2
JPS6323661B2 JP542279A JP542279A JPS6323661B2 JP S6323661 B2 JPS6323661 B2 JP S6323661B2 JP 542279 A JP542279 A JP 542279A JP 542279 A JP542279 A JP 542279A JP S6323661 B2 JPS6323661 B2 JP S6323661B2
Authority
JP
Japan
Prior art keywords
groove
substrate
solder
region
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP542279A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5596666A (en
Inventor
Toshiaki Shinohara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP542279A priority Critical patent/JPS5596666A/ja
Publication of JPS5596666A publication Critical patent/JPS5596666A/ja
Publication of JPS6323661B2 publication Critical patent/JPS6323661B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/457—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H10W72/01308—
    • H10W72/07311—
    • H10W72/075—
    • H10W72/07551—
    • H10W72/387—
    • H10W72/50—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5473—
    • H10W72/884—
    • H10W72/931—
    • H10W72/952—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP542279A 1979-01-18 1979-01-18 Method of fabricating semiconductor device substrate Granted JPS5596666A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP542279A JPS5596666A (en) 1979-01-18 1979-01-18 Method of fabricating semiconductor device substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP542279A JPS5596666A (en) 1979-01-18 1979-01-18 Method of fabricating semiconductor device substrate

Publications (2)

Publication Number Publication Date
JPS5596666A JPS5596666A (en) 1980-07-23
JPS6323661B2 true JPS6323661B2 (index.php) 1988-05-17

Family

ID=11610718

Family Applications (1)

Application Number Title Priority Date Filing Date
JP542279A Granted JPS5596666A (en) 1979-01-18 1979-01-18 Method of fabricating semiconductor device substrate

Country Status (1)

Country Link
JP (1) JPS5596666A (index.php)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01128166U (index.php) * 1988-02-26 1989-09-01
JP2004071898A (ja) * 2002-08-07 2004-03-04 Sanyo Electric Co Ltd 回路装置およびその製造方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62178544U (index.php) * 1986-04-30 1987-11-12
JPS62178543U (index.php) * 1986-04-30 1987-11-12
CN102484083A (zh) 2009-09-11 2012-05-30 罗姆股份有限公司 半导体装置及其制造方法
WO2015079834A1 (ja) * 2013-11-29 2015-06-04 シャープ株式会社 半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01128166U (index.php) * 1988-02-26 1989-09-01
JP2004071898A (ja) * 2002-08-07 2004-03-04 Sanyo Electric Co Ltd 回路装置およびその製造方法

Also Published As

Publication number Publication date
JPS5596666A (en) 1980-07-23

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