JPS6322697Y2 - - Google Patents
Info
- Publication number
- JPS6322697Y2 JPS6322697Y2 JP18709182U JP18709182U JPS6322697Y2 JP S6322697 Y2 JPS6322697 Y2 JP S6322697Y2 JP 18709182 U JP18709182 U JP 18709182U JP 18709182 U JP18709182 U JP 18709182U JP S6322697 Y2 JPS6322697 Y2 JP S6322697Y2
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- terminals
- board
- circuit board
- test
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000012360 testing method Methods 0.000 claims description 44
- 238000007689 inspection Methods 0.000 claims description 13
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 229920000728 polyester Polymers 0.000 description 6
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 239000012943 hotmelt Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 238000003475 lamination Methods 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
Landscapes
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Tests Of Electronic Circuits (AREA)
- Calculators And Similar Devices (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18709182U JPS5991771U (ja) | 1982-12-13 | 1982-12-13 | 基板回路の検査用端子のア−ス構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18709182U JPS5991771U (ja) | 1982-12-13 | 1982-12-13 | 基板回路の検査用端子のア−ス構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5991771U JPS5991771U (ja) | 1984-06-21 |
| JPS6322697Y2 true JPS6322697Y2 (ko) | 1988-06-22 |
Family
ID=30403939
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18709182U Granted JPS5991771U (ja) | 1982-12-13 | 1982-12-13 | 基板回路の検査用端子のア−ス構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5991771U (ko) |
-
1982
- 1982-12-13 JP JP18709182U patent/JPS5991771U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5991771U (ja) | 1984-06-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6659356B2 (en) | Hybrid IC card | |
| JPH025375A (ja) | 電子部品の実装方法 | |
| KR100545881B1 (ko) | 반도체 칩의 실장 구조체, 액정장치 및 전자기기 | |
| JPH06310839A (ja) | フレキシブル印刷回路板への電子部品の実装方法 | |
| JPS6362014B2 (ko) | ||
| JPS6322697Y2 (ko) | ||
| JPH11112150A (ja) | 多層基板とその製造方法 | |
| JPH09311921A (ja) | 回路基板及びそれを用いたｉｃカード | |
| JPS6220396A (ja) | 電子機器 | |
| JPS597393A (ja) | 表示装置 | |
| JPH0312554Y2 (ko) | ||
| JP3269506B2 (ja) | 半導体装置 | |
| JP3224257B2 (ja) | 集積回路を搭載したカード | |
| JP2661101B2 (ja) | Ｉｃカード | |
| JPS6227786A (ja) | 液晶表示装置 | |
| JPS58122586A (ja) | 液晶表示装置 | |
| JP2882394B2 (ja) | 液晶表示装置 | |
| JPH01228199A (ja) | 携帯可能媒体 | |
| JPS6224262Y2 (ko) | ||
| JPS60158422A (ja) | 電子部品接続装置 | |
| JPH0319003Y2 (ko) | ||
| JPS62276659A (ja) | シ−ト状小型電子機器 | |
| JPH0755592B2 (ja) | Ｉｃカード用プリント配線板 | |
| JP3106846B2 (ja) | 半導体チップ実装基板の製造方法 | |
| JPS6259824B2 (ko) |