JPS6322679Y2 - - Google Patents
Info
- Publication number
- JPS6322679Y2 JPS6322679Y2 JP127483U JP127483U JPS6322679Y2 JP S6322679 Y2 JPS6322679 Y2 JP S6322679Y2 JP 127483 U JP127483 U JP 127483U JP 127483 U JP127483 U JP 127483U JP S6322679 Y2 JPS6322679 Y2 JP S6322679Y2
- Authority
- JP
- Japan
- Prior art keywords
- face
- semiconductor device
- aluminum
- solder
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 13
- 229910000679 solder Inorganic materials 0.000 claims description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims description 3
- 229910000838 Al alloy Inorganic materials 0.000 claims description 2
- 230000005855 radiation Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP127483U JPS59109152U (ja) | 1983-01-11 | 1983-01-11 | 半導体放熱器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP127483U JPS59109152U (ja) | 1983-01-11 | 1983-01-11 | 半導体放熱器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59109152U JPS59109152U (ja) | 1984-07-23 |
| JPS6322679Y2 true JPS6322679Y2 (en, 2012) | 1988-06-22 |
Family
ID=30133004
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP127483U Granted JPS59109152U (ja) | 1983-01-11 | 1983-01-11 | 半導体放熱器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59109152U (en, 2012) |
-
1983
- 1983-01-11 JP JP127483U patent/JPS59109152U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59109152U (ja) | 1984-07-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107343378A (zh) | 一种液态金属与硅脂结合的散热方法 | |
| JPS6322679Y2 (en, 2012) | ||
| JP2828358B2 (ja) | 半導体放熱構造 | |
| JPH06237019A (ja) | 電子加熱冷却装置 | |
| JPH0159748B2 (en, 2012) | ||
| JPH01132146A (ja) | 半導体装置 | |
| JP2000299419A (ja) | 半導体装置 | |
| JPH0590458A (ja) | 吸熱発熱モジユール | |
| JP2633762B2 (ja) | 全波整流装置 | |
| JPH08236819A (ja) | 冷熱電子素子 | |
| JPH0351302B2 (en, 2012) | ||
| CN211828737U (zh) | 一种功率器件组件及电气设备 | |
| US3462654A (en) | Electrically insulating-heat conductive mass for semiconductor wafers | |
| JPS6135345Y2 (en, 2012) | ||
| JPH0555639A (ja) | 熱電装置 | |
| JPH054578U (ja) | 発熱素子の放熱装置 | |
| JPS5832423A (ja) | 半導体装置 | |
| JPS586617Y2 (ja) | 半田こて | |
| JPS58100388A (ja) | 定温発熱体 | |
| JPS622770Y2 (en, 2012) | ||
| JPS5911449Y2 (ja) | 半導体絶縁座 | |
| JPS6135346Y2 (en, 2012) | ||
| JPS586592B2 (ja) | 半田こての製造方法 | |
| JPH1074872A (ja) | ヒートスプレッダー | |
| JPH0680755B2 (ja) | 電力用半導体素子 |