JPS6322601Y2 - - Google Patents
Info
- Publication number
- JPS6322601Y2 JPS6322601Y2 JP1984122936U JP12293684U JPS6322601Y2 JP S6322601 Y2 JPS6322601 Y2 JP S6322601Y2 JP 1984122936 U JP1984122936 U JP 1984122936U JP 12293684 U JP12293684 U JP 12293684U JP S6322601 Y2 JPS6322601 Y2 JP S6322601Y2
- Authority
- JP
- Japan
- Prior art keywords
- melting point
- layer
- low melting
- resistance layer
- point alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000002844 melting Methods 0.000 claims description 15
- 230000008018 melting Effects 0.000 claims description 15
- 229910045601 alloy Inorganic materials 0.000 claims description 14
- 239000000956 alloy Substances 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 6
- 239000010410 layer Substances 0.000 description 32
- 230000002159 abnormal effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
Landscapes
- Fuses (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12293684U JPS6138744U (ja) | 1984-08-10 | 1984-08-10 | 温度ヒユ−ズ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12293684U JPS6138744U (ja) | 1984-08-10 | 1984-08-10 | 温度ヒユ−ズ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6138744U JPS6138744U (ja) | 1986-03-11 |
| JPS6322601Y2 true JPS6322601Y2 (US08197722-20120612-C00042.png) | 1988-06-21 |
Family
ID=30681692
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12293684U Granted JPS6138744U (ja) | 1984-08-10 | 1984-08-10 | 温度ヒユ−ズ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6138744U (US08197722-20120612-C00042.png) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3426508B2 (ja) * | 1998-06-30 | 2003-07-14 | 矢崎総業株式会社 | 低融点材溶断装置及び回路遮断装置 |
| JP6102266B2 (ja) * | 2013-01-11 | 2017-03-29 | 株式会社村田製作所 | ヒューズ |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5333349A (en) * | 1976-09-08 | 1978-03-29 | Matsushita Electric Ind Co Ltd | Chipplike temperature fuse and method of manufacturing thereof |
| JPS5987736A (ja) * | 1982-11-12 | 1984-05-21 | 富士通株式会社 | 半導体記憶装置 |
-
1984
- 1984-08-10 JP JP12293684U patent/JPS6138744U/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5333349A (en) * | 1976-09-08 | 1978-03-29 | Matsushita Electric Ind Co Ltd | Chipplike temperature fuse and method of manufacturing thereof |
| JPS5987736A (ja) * | 1982-11-12 | 1984-05-21 | 富士通株式会社 | 半導体記憶装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6138744U (ja) | 1986-03-11 |
