JPS63220594A - Electronic circuit adjustment - Google Patents

Electronic circuit adjustment

Info

Publication number
JPS63220594A
JPS63220594A JP62054543A JP5454387A JPS63220594A JP S63220594 A JPS63220594 A JP S63220594A JP 62054543 A JP62054543 A JP 62054543A JP 5454387 A JP5454387 A JP 5454387A JP S63220594 A JPS63220594 A JP S63220594A
Authority
JP
Japan
Prior art keywords
resistor
printed
resistance value
circuit
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62054543A
Other languages
Japanese (ja)
Inventor
洋一 村上
大野 保雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP62054543A priority Critical patent/JPS63220594A/en
Publication of JPS63220594A publication Critical patent/JPS63220594A/en
Pending legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、ビデオテープレコーダなどの小型化が要望さ
れる電子機器に多く用いられている厚膜集積回路の如き
電子回路調整方法に関するものである。
DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for adjusting electronic circuits such as thick film integrated circuits which are often used in electronic devices such as video tape recorders that require miniaturization.

従来の技術 近年、電子機器の軽薄短小化や高機能化に対する要望は
益々増大しており、それにともなってこれら電子機器の
電子回路をいかに高密度化(−てゆくかが極めて重要な
課題となってきている。
Conventional technology In recent years, the demand for smaller, lighter, thinner, and more sophisticated electronic devices has been increasing, and as a result, how to increase the density of the electronic circuits in these devices has become an extremely important issue. It's coming.

このような中にあって従来から一般的に行なわれている
電子回路の実装方法としては、1つの電子回路をいくつ
かの機能回路に分割して、それぞれの機能回路を構成す
る回路素子を集積化して回路ブロックを構成し、この回
路ブロックを印刷配線板に実装して電子回路を構成する
実装方法がある。
Under these circumstances, the conventional method of mounting electronic circuits that has been commonly used is to divide one electronic circuit into several functional circuits and integrate the circuit elements that make up each functional circuit. There is a mounting method in which a circuit block is constructed by converting the electronic circuit into a circuit block, and this circuit block is mounted on a printed wiring board to construct an electronic circuit.

特にこのような機能回路化思想を採り入れた電子回路で
は個々の機能回路毎に回路特性の調整を行なう必要があ
り、特に厚膜集積回路では印刷抵抗の面積を切欠する等
のいわゆるトリミングを行い回路特性の調整を行う機能
トリミング方法が多く採用されている。
In particular, in electronic circuits that incorporate this concept of functional circuitization, it is necessary to adjust the circuit characteristics of each functional circuit. Particularly in thick-film integrated circuits, so-called trimming, such as cutting out the area of printed resistors, is performed to improve the circuit characteristics. Many functional trimming methods are used to adjust characteristics.

以下、図面を参照し寿から上述した従来の機能トリミン
グ方法による電子回路調整方法について3へ 説明する。第4図に示すように、厚膜集積回路はセラミ
ック基板1の表面に導体ペーストや印刷ペーストを印刷
、焼成し、回路導体2と印刷抵抗3を形成したいわゆる
厚膜回路基板を使用する。回路特性調整用の印刷抵抗3
は回路特性のばらつきを考慮してあらかじめ印刷面積を
大きくすなわち抵抗値を小さく設定しておく。その後、
所望の機能を有する回路ブロックを構成するのに必要な
電子部品4を装着し、所定の回路特性になるように印刷
抵抗3をトリミングするという電子回路調整方法が行な
われていた0 発明が解決しようとする問題点 しかしながら上記従来の方法では、トリミングする印刷
抵抗は回路特性のばらつきを考慮して、あらかじめ印刷
面積を大きくつ1り小さな抵抗値に設定しておく必要が
あり、印刷抵抗の抵抗値に対して回路動作範囲が狭い場
合には、印刷抵抗をトリミングする前の状態では回路が
動作せず、電子部品の不良については判別出来ないとい
う問題点があり、さらに印刷抵抗を全て切削してし捷つ
て初めて電子部品が不良であると判断され、結果的には
基板ごと全部棄ててし捷わなければならないという不都
合をも有していた。
Hereinafter, an electronic circuit adjustment method using the conventional function trimming method described above will be described from Kotobuki to Section 3 with reference to the drawings. As shown in FIG. 4, the thick film integrated circuit uses a so-called thick film circuit board in which a conductive paste or a printing paste is printed and fired on the surface of a ceramic substrate 1 to form circuit conductors 2 and printed resistors 3. Printed resistor 3 for adjusting circuit characteristics
In this case, the printing area is set large, that is, the resistance value is set small in advance, taking into account variations in circuit characteristics. after that,
An electronic circuit adjustment method has been used in which electronic components 4 necessary to configure a circuit block having a desired function are mounted, and printed resistors 3 are trimmed to obtain predetermined circuit characteristics. However, with the above conventional method, the printed resistor to be trimmed must be set in advance to a smaller resistance value as the printed area increases, taking into account variations in circuit characteristics. On the other hand, if the circuit operating range is narrow, there is a problem that the circuit will not operate in the state before the printed resistor is trimmed, and it will not be possible to determine if the electronic component is defective. It is not until the electronic component is discarded that it is determined that it is defective, and as a result, the entire board must be discarded and discarded.

本発明は」二記問題点に鑑み、どのような特性の回路ブ
ロックに対しても印刷抵抗の1− ’J ミンクを行う
前に回路ブロックの動作確認を可能とした電子回路調整
方法を提供することを目的とするものである。
In view of the above problems, the present invention provides an electronic circuit adjustment method that makes it possible to check the operation of a circuit block before applying printed resistance 1-'J mink to a circuit block with any characteristics. The purpose is to

問題点を解決するための手段 上記目的を達成するために本発明の電子回路調整方法は
、印刷配線が設けられかつ複数の電子部品が配設された
回路基板の印1!11抵抗の一端を開放状態にして形成
し、前記印刷抵抗の他端と前記印刷抵抗の一端を接続す
る第1の部位との間に可変抵抗を接続し、前記可変抵抗
の抵抗値を変化させて前記[iコ]路基板の電気的特性
か所定の特性となる前記可変抵抗の第1の抵抗値を決定
し、前記可変抵抗を取り外しかつl’ifJ i己印刷
抵抗の抵抗値を前記第1の抵抗値に調整し、前記印判抵
抗の一端とMiJ記第1の部位を接続するものである。
Means for Solving the Problems In order to achieve the above object, the electronic circuit adjustment method of the present invention provides a method for adjusting one end of the mark 1!11 resistor of a circuit board on which printed wiring is provided and a plurality of electronic components are arranged. A variable resistor is formed in an open state, and a variable resistor is connected between the other end of the printed resistor and a first portion connecting one end of the printed resistor, and the resistance value of the variable resistor is changed to ] Determine the first resistance value of the variable resistor that will give the electrical characteristics or predetermined characteristics of the circuit board, remove the variable resistor, and set the resistance value of the printed resistor to the first resistance value. and connect one end of the stamp resistor to the first part of MiJ.

作用 上記調整方法によって、その抵抗値を広範囲にわたり変
化させることのできる可変抵抗を取り付けたことによっ
て、回路基板に形設された電子回路を容易に動作領域に
設定することができ、電気的特性が所定の特性となる可
変抵抗の第1の抵抗値を決定することができる。そして
またこの第1の抵抗値を決定するために特性の検出を行
なうとき、回路基板に配設した電子部品の不良を判別を
行うことが可能となる。また印刷抵抗の抵抗値を設定す
べき抵抗値が確認できるために、印刷抵抗の抵抗値の調
整作業が容易となるものである。
Effect By installing a variable resistor whose resistance value can be varied over a wide range using the above adjustment method, the electronic circuit formed on the circuit board can be easily set in the operating range, and the electrical characteristics can be changed. A first resistance value of the variable resistor that provides predetermined characteristics can be determined. Furthermore, when characteristics are detected in order to determine the first resistance value, it becomes possible to determine whether or not the electronic components disposed on the circuit board are defective. Furthermore, since the resistance value to which the resistance value of the printed resistor should be set can be confirmed, the work of adjusting the resistance value of the printed resistor is facilitated.

実施例 以下、本発明の一実施例の電子回路調整方法を図面を参
照しながら説明する。第1図および第2図は本発明の一
実施例の電子回路調整方法を説明する等価回路図である
EXAMPLE Hereinafter, an electronic circuit adjustment method according to an example of the present invention will be described with reference to the drawings. 1 and 2 are equivalent circuit diagrams illustrating an electronic circuit adjustment method according to an embodiment of the present invention.

第1図および第2図において、5,6.7はそれぞれ端
子で、端子5と端子6の間に印刷抵抗8が形成されてい
る。なおこの印刷抵抗8は回路特性の調整を行なうだめ
に、印刷面積を大きくすなわち抵抗値を小さく設定して
おく。9は可変抵抗器である。
In FIGS. 1 and 2, 5, 6.7 are terminals, and a printed resistor 8 is formed between the terminals 5 and 6. Note that the printed resistor 8 is set to have a large printed area, that is, a small resistance value, in order to adjust the circuit characteristics. 9 is a variable resistor.

上記構成で電子回路の特性を調整する場合、捷ず端子6
と端子7の間に可変抵抗9を取り付け、可変抵抗9の抵
抗値R9を変化させて所定の回路特性となる抵抗値RO
を決定する(第1図)。
When adjusting the characteristics of the electronic circuit with the above configuration, do not change the terminal 6.
A variable resistor 9 is attached between the terminal 7 and the terminal 7, and the resistance value R9 of the variable resistor 9 is changed to obtain a resistance value RO that provides a predetermined circuit characteristic.
(Figure 1).

次に可変抵抗9を取り外し、印刷抵抗8をトリミングし
て、印刷抵抗8の抵抗値R8を上述により得た抵抗値R
oに調整し、その後、端子5と端子70間をジャンパー
リード等で接続する(第2図)。
Next, the variable resistor 9 is removed, the printed resistor 8 is trimmed, and the resistance value R8 of the printed resistor 8 is set to the resistance value R8 obtained as described above.
After that, connect terminal 5 and terminal 70 with a jumper lead or the like (Fig. 2).

上述の電子回路調整方法を厚膜集積回路からなる電子回
路に適用した場合について第3図を参照しながら説明す
る。
A case in which the above electronic circuit adjustment method is applied to an electronic circuit made of a thick film integrated circuit will be described with reference to FIG.

第3図において、1oはセラミック基板で、このセラミ
ック基板6の表面に導体ペーストや抵抗体ペーストを印
刷、焼成し、回路導体11と印刷抵抗8を形成している
。印刷抵抗8は端子5と端子6の間に形成され、セラミ
ック基板の両側部に設けられたリード端子12は、電子
部品13の端子とそれぞれ回路導体11、印刷抵抗8を
介して接続されている。セラミック基板10を装着する
印刷配線板14には、リード端子12を嵌合する嵌合孔
15が設けられ、これらの嵌合孔16のなかの端子5,
7にそれぞれ接続されたリード端子12を嵌合する嵌合
孔15a 、 15bは印刷配線16で接続されている
In FIG. 3, 1o is a ceramic substrate, and a conductor paste or a resistor paste is printed and fired on the surface of this ceramic substrate 6 to form circuit conductors 11 and printed resistors 8. A printed resistor 8 is formed between the terminals 5 and 6, and lead terminals 12 provided on both sides of the ceramic substrate are connected to terminals of an electronic component 13 via a circuit conductor 11 and a printed resistor 8, respectively. . The printed wiring board 14 on which the ceramic substrate 10 is mounted is provided with fitting holes 15 into which the lead terminals 12 are fitted, and the terminals 5 and 5 in these fitting holes 16 are provided.
Fitting holes 15a and 15b into which lead terminals 12 respectively connected to 7 are fitted are connected by printed wiring 16.

上記構成で電子回路の調整を行なう場合、まずリード端
子12と印刷配線板14の間は絶縁状態とし、端子6と
端子70間に可変抵抗9を取り付ける。
When adjusting the electronic circuit with the above configuration, first, the lead terminals 12 and the printed wiring board 14 are insulated, and the variable resistor 9 is attached between the terminals 6 and 70.

次に可変抵抗9の抵抗値R9を変化させながらセラミッ
ク基板10上に形成された電子回路の特性を計測し、所
定の特性を得られる抵抗値ROを決定する。
Next, the characteristics of the electronic circuit formed on the ceramic substrate 10 are measured while changing the resistance value R9 of the variable resistor 9, and a resistance value RO that provides predetermined characteristics is determined.

そして可変抵抗9をセラミック基板1oから取り外し、
印刷抵抗8をトリミングして印刷抵抗8の抵抗値R8を
抵抗値ROに設定する0それからセラミック基板10を
印刷配線板14に装着することで電子回路の特性の調整
が行なわれる。
Then, remove the variable resistor 9 from the ceramic substrate 1o,
The printed resistor 8 is trimmed to set the resistance value R8 of the printed resistor 8 to the resistance value RO. Then, the ceramic substrate 10 is mounted on the printed wiring board 14, thereby adjusting the characteristics of the electronic circuit.

したがって本実施例によれば、可変抵抗9を取り付け、
可変抵抗9の抵抗値を変化させることで、セラミック基
板10上に形成された電子回路を動作領域に設定するこ
とが容易となり、所定の特性となる可変抵抗9の抵抗値
を容易に決定することが可能となる。捷た電子回路の特
性を計測する時点で、電子部品8の不良を判別を行うこ
とができるものである。さらに印刷抵抗8の抵抗値を設
定すべき抵抗値が明らかになり、トリミングを容易に実
行できるものである。その結果、電子回路の歩留りが向
上し、かつ電子回路の特性の調整作業が従来より正確か
つ容易になるものである。
Therefore, according to this embodiment, the variable resistor 9 is attached,
By changing the resistance value of the variable resistor 9, it is easy to set the electronic circuit formed on the ceramic substrate 10 in the operating region, and the resistance value of the variable resistor 9 that provides predetermined characteristics can be easily determined. becomes possible. At the time when the characteristics of the broken electronic circuit are measured, it is possible to determine whether the electronic component 8 is defective. Furthermore, the resistance value to which the resistance value of the printed resistor 8 should be set becomes clear, and trimming can be easily performed. As a result, the yield of electronic circuits is improved, and the adjustment of the characteristics of electronic circuits becomes more accurate and easier than before.

発明の効果 本発明によれば、回路基板の印刷抵抗の一端を開放させ
て形成し、印刷抵抗の龍端と印刷抵抗の一端を接続する
第1の部位との間に可変抵抗を取り付け、前記可変抵抗
の抵抗値を変化させて回路基板の電気的特性が所定の特
性となる第1の抵抗9へ。
Effects of the Invention According to the present invention, one end of the printed resistor of the circuit board is formed open, and a variable resistor is attached between the dragon end of the printed resistor and the first part connecting the one end of the printed resistor. To the first resistor 9, which changes the resistance value of the variable resistor so that the electrical characteristics of the circuit board become predetermined characteristics.

値を決定し、前記印刷抵抗の抵抗値を前記第1の抵抗値
に調整することとしたために、可変抵抗を取り付けて特
性を計測することで、回路基板上に形成された電子回路
を動作領域に設定することが容易となり、所定の特性と
なる第1の抵抗値を決定できる。そしてまた電子回路の
特性を計測し第1の抵抗値を決定する測定の過程で回路
基板に配設した電子部品の不良を判別することができる
Since the resistance value of the printed resistor was determined and the resistance value of the printed resistor was adjusted to the first resistance value, a variable resistor was attached and the characteristics were measured, thereby controlling the electronic circuit formed on the circuit board to the operating range. This makes it easy to set the first resistance value to have a predetermined characteristic. Further, in the process of measuring the characteristics of the electronic circuit and determining the first resistance value, it is possible to determine whether or not the electronic components disposed on the circuit board are defective.

才だこのとき印刷抵抗の抵抗値を設定すべき抵抗値が明
確になるために、印刷抵抗の抵抗値の調整作業が従来に
比べて正確かつ容易になるものである。その結果、電子
回路の歩留り、そして作業性が向上するものである。
At this point, the resistance value to which the resistance value of the printed resistor should be set becomes clear, so the adjustment work of the resistance value of the printed resistor becomes more accurate and easier than in the past. As a result, the yield of electronic circuits and workability are improved.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図および第2図はそれぞれ本発明の一実施例の電子
回路調整方法を説明する等価回路図、第3図は本発明の
一実施例の電子回路調整方法を適用した印刷配線板の斜
視図、λ4図は従来の電子回路調整方法を適用した印口
11配線板の斜視図である0 1 o・\ 8・・・・・・印刷抵抗、9・・・・・・可変抵抗、1
0・・・・・セラミンク基板、11・・・・・・回路導
体、13・・・・・・電子部品、14・・・・・・印刷
配線板。 代理人の氏名 弁理士 中 尾 敏 男 ほか1名第2
図 13−電′:+舒白 +4−67千配穆楳 第3図  f3f/7 f。 特開n、’1B3−22D594(4)第4図 □
1 and 2 are equivalent circuit diagrams illustrating an electronic circuit adjustment method according to an embodiment of the present invention, and FIG. 3 is a perspective view of a printed wiring board to which the electronic circuit adjustment method according to an embodiment of the present invention is applied. Figure, λ4 is a perspective view of the printed circuit board 11 to which the conventional electronic circuit adjustment method is applied.
0...Ceramink board, 11...Circuit conductor, 13...Electronic component, 14...Printed wiring board. Name of agent: Patent attorney Toshio Nakao and 1 other person 2nd
Figure 13-Electric': + Shubai + 4-67 thousand distribution map 3 f3f/7f. JP-A n, '1B3-22D594 (4) Figure 4 □

Claims (1)

【特許請求の範囲】[Claims]  印刷配線が設けられかつ複数の電子部品が配設された
回路基板の印刷抵抗の一端を開放状態にして形成し、前
記印刷抵抗の他端と前記印刷抵抗の一端を接続する第1
の部位との間に可変抵抗を接続し、前記可変抵抗の抵抗
値を変化させて前記回路基板の電気的特性が所定の特性
となる前記可変抵抗の第1の抵抗値を決定し、前記可変
抵抗を取り外しかつ前記印刷抵抗の抵抗値を前記第1の
抵抗値に調整し、前記印刷抵抗の一端と前記第1の部位
を接続する電子回路調整方法。
A first printed resistor is formed with one end of a printed resistor in an open state on a circuit board on which printed wiring is provided and a plurality of electronic components are arranged, and the other end of the printed resistor is connected to one end of the printed resistor.
A variable resistor is connected between the variable resistor and the variable resistor, the resistance value of the variable resistor is changed to determine a first resistance value of the variable resistor at which the electrical characteristics of the circuit board become predetermined characteristics, An electronic circuit adjustment method comprising removing a resistor, adjusting the resistance value of the printed resistor to the first resistance value, and connecting one end of the printed resistor to the first portion.
JP62054543A 1987-03-10 1987-03-10 Electronic circuit adjustment Pending JPS63220594A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62054543A JPS63220594A (en) 1987-03-10 1987-03-10 Electronic circuit adjustment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62054543A JPS63220594A (en) 1987-03-10 1987-03-10 Electronic circuit adjustment

Publications (1)

Publication Number Publication Date
JPS63220594A true JPS63220594A (en) 1988-09-13

Family

ID=12973592

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62054543A Pending JPS63220594A (en) 1987-03-10 1987-03-10 Electronic circuit adjustment

Country Status (1)

Country Link
JP (1) JPS63220594A (en)

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