JPH05243789A - Manufacture of hybrid integrated circuit - Google Patents

Abstract

PURPOSE:To perform function trimming efficiently under a condition that a plurality of substrates are integrally connected to form a substrate assembly. CONSTITUTION:A terminal part and a wiring part 4 are formed on the surface of substrates 1-18 in a substrate assembly 1 where a plurality of substrates 11-18 and a disposal substrate 19 are connected in one piece and at the same time the wiring part 4 or terminal parts which need to be connected at the time of later function trimming are connected mutually through the wiring parts 4 and 10 on the surface adjacent other substrates 11-18 or the disposal substrate 19 which is devided later over the substrates 11-18. Then, function trimming is performed on the substrates 11-18 in the state of the assembly substrate 1 and then the substrate assembly 1 is mounted to a lead frame after it is divided into the substrates 11-18 and the disposal substrate 19 after function trimming is completed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a hybrid integrated circuit having a function trimming step of setting a resistance to a predetermined value while performing a function test.

[0002]

2. Description of the Related Art In recent years, in a hybrid integrated circuit, in order to put a function of a certain circuit block into a predetermined value, function trimming is often performed while performing a function trimming while applying a power supply voltage to bring the circuit block into an operating state. There is. As a method of manufacturing this hybrid integrated circuit, as shown in FIG. 3, a circuit pattern of printed resistors and conductors is formed on a collective substrate 1 such as a ceramic substrate, and various electronic components such as transistors and capacitors are formed on the front or back surface (see FIG. (Not shown) is mounted, the lead frame is soldered to the divided substrates, the function trimming of the printing resistor is performed, and then the resin is externally packaged with a resin mold or the like for commercialization.

For example, in the case of function trimming, when it is necessary to connect the terminals 2 and 3 on the front surface and the back surface of the substrate 11 as shown in FIG. A lead frame was attached to each of the individual substrates thus prepared, and the terminal portions 2 and 3 on the front and back surfaces were connected (hereinafter referred to as a first conventional method).

Further, unlike the first conventional method, there is a method of using a through hole as another mode for performing the function trimming in the state of the collective substrate. In the case of FIG. 4, by connecting the peripheral conductor portions of the terminal portions 2 and 3 with through holes, it is possible to perform function trimming from one direction on the front surface side in the state of the assembled substrate (hereinafter, referred to as the second embodiment). Called the conventional method).

[0005]

However, since the lead frame cannot be attached in the state of the collective substrate 1 in the first conventional method, it is necessary to attach the lead frame after dividing into the respective substrates, and the subsequent manufacturing. There is a problem that workability and yield are poor in the process.

In the second conventional method, function trimming or the like can be performed in the state of the collective substrate 1,
In that respect, it is efficient, but when the circuit is complicated, it is necessary to form a large number of through holes in the substrate 11 made of ceramic or the like, which causes a problem that a large increase in cost cannot be avoided.

The present invention has been made in view of the above problems, and it is possible to perform function trimming in the state before dividing the substrate into individual pieces, that is, in the state of the collective substrate, and without forming through holes. An object of the present invention is to provide a method for manufacturing a hybrid integrated circuit that can be implemented.

[0008]

According to the method of manufacturing a hybrid integrated circuit of the present invention, after a circuit pattern of resistors and conductors is formed on an aggregate substrate in which a plurality of substrates are integrally arranged and formed, an electronic component is mounted. In a method of manufacturing a hybrid integrated circuit including a step of performing function trimming of an electric circuit of each substrate in a state of a collective substrate, wiring parts of circuit patterns that need to be connected at the time of function trimming are
Connections are made via wiring parts formed over the surface of another substrate to be separated later, across one substrate, and after function trimming is performed in the state of the collective substrate, the collective substrate is connected to the wiring part. It is also characterized in that it is separated into each substrate.

[0009]

According to the present invention, when the function trimming is executed, the wiring portion in each substrate which needs to be in the connected state is formed over the other substrates adjacent to each other to be separated later beyond the one substrate. By connecting via the wiring part, it is possible to easily set the connection state, and it is possible to perform function trimming in the state of the collective board. Moreover, when divided into each individual board, it is unnecessary for the original function. The connection between the various wiring parts is automatically cut off.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be specifically described below with reference to the drawings. FIG. 1 is a plan view of a collective substrate used in the method of manufacturing a hybrid integrated circuit according to the present invention, FIG. 2 is an enlarged view of a substrate divided into individual parts, in which 1 is a collective substrate made of ceramic or the like. 18 is an individual board constituting the collective board,
Reference numeral 19 also indicates a discarded substrate.

The collective substrate 1 is formed with cuts 7 for cutting between the individual substrates 11 to 18 and between these and the discarded substrate 19. Further, each of the substrates 11 to 18 is provided with the same terminal portion 2 and wiring portion 4 as shown in FIGS. 4 (a) and 4 (b) on the front and back surfaces thereof. However, various electronic parts such as transistors and capacitors are mounted, and these electrodes and terminals are soldered to the wiring portion 4 and the like.

In the method of the present invention, among the terminal portions 2 on each of the substrates 11 to 18 that require connection especially when performing function trimming, for example, and is another substrate adjacent to the substrate 11. The wiring portion 4 in 12 and the wiring portions 8 and 9 connecting the wiring portion 4 of the terminal portion 2 and the wiring portion 4 are connected.

The wiring portions 8 and 9 are formed in the same method as in the step of forming the wiring portion 4. The wiring portions 8 and 9 are formed over the cut 7 formed between the one substrate 11 and the other substrate 12 adjacent to each other.
The wiring portions 4 connected to this are connected to each other.

Further, it is located facing the peripheral portion of the collective substrate 1,
In the case of a board having no other adjacent board having the wiring section 4 to be used, for example, the boards 14 and 18, the waste board 19 located facing the board 14 is used as shown in FIG. The wiring portion 10 connecting the terminal portion 2 and the terminal portion 2 is formed.

With respect to the collective substrate 1 thus formed, each of the substrates 11 to 18 is subjected to an energization test and function trimming to properly set each constant. When the test is completed, the collective substrate 1 is cut along each of the cuts 7. When the collective substrate 1 is divided into the individual substrates 11 to 18, the wiring portions 8 and 9 are also cut, as shown in FIG.

FIG. 2 is an enlarged plan view of the substrate 12. In this state, the lead frame is attached and the whole is covered with a synthetic resin in a later resin molding step. As a result, the wiring portions 8 and 9 are present on each substrate. 11-18 Does not adversely affect the functioning of itself. The same applies to the wiring portion 10, and each terminal portion 2
Since the terminals 2 of the terminal portion 2 are connected to each other through the wiring extending over the notch 7 from the notch substrate 19 to the notch substrate 19, the substrate 11 as an individual piece of the aggregate substrate 1 is connected. ~
When the wiring board is divided into 18, the wirings 8 and 9 are cut at the cuts 7 in the middle, respectively, as in the case of the wiring portions 8 and 9, and the functions of the substrates 11 to 18 themselves are not adversely affected. A lead frame is attached to the substrates 11 to 18 obtained in this way, and after soldering the respective terminal portions 2 and the lead portions, they are sent to a resin process and molded with a synthetic resin.

In the above-described embodiment, the case where the wiring portions 4 to be used are present in the adjacent substrates 11 to 18 has been described. However, when such wiring portions 4 are not present, the space is provided in the space. If there is a margin, another adjacent substrate 11 ~
A wiring portion used only at the time of testing may be formed on 18. In addition, when there is no room in the space for providing such a wiring portion, the discarding substrate 19 is provided not only in the peripheral portion of the collective substrate 1 but also between the substrates 11 to 18, and the surface of the discarding substrate 19 is used. It is also possible to form a wiring portion for connecting a terminal portion or a wiring portion necessary for function trimming.

[0018]

As described above, according to the method of the present invention, a wiring portion in which wirings required for function trimming are formed on the surface of another adjacent substrate to be cut later after passing over one substrate. I decided to connect via
The wiring portion for this purpose can be formed at the same time when the circuit pattern is formed, and no special process such as formation of a through hole is required, and the process such as function trimming is performed in the state of the collective substrate. Therefore, the present invention has excellent effects such that the working efficiency is remarkably improved.

[Brief description of drawings]

FIG. 1 is a plan view of a collective substrate used in the method of the present invention.

FIG. 2 is an enlarged plan view of a substrate obtained by dividing the collective substrate of FIG.

FIG. 3 is a plan view of a collective substrate used in a conventional method.

FIG. 4 is an enlarged view of front and back surfaces of a substrate obtained by dividing the collective substrate of FIG.

[Explanation of symbols]

 1 Assembly board 2, 3 Terminal section 4, 5 Wiring section 7 Cut line 8, 9, 10 Wiring section 11-18 Board 19 Discarded board 20 Printing resistance

Claims (1)

[Claims] 1. A circuit pattern of resistors and conductors is formed on a collective substrate in which a plurality of substrates are integrally arranged and formed, and after electronic components are mounted, function trimming of an electric circuit of each substrate is performed in the state of the collective substrate. In the method for manufacturing a hybrid integrated circuit including the steps to be performed, the wiring parts of the circuit patterns that need to be connected at the time of function trimming are formed over one substrate and over the surface of another adjacent substrate to be separated later. A method of manufacturing a hybrid integrated circuit, wherein the integrated substrate is separated from each other together with the wiring portion after performing the function trimming in the state of the aggregated substrate after the connection is made through the parts.