JPS61124158A - Composite electronic parts - Google Patents

Composite electronic parts

Info

Publication number
JPS61124158A
JPS61124158A JP59245145A JP24514584A JPS61124158A JP S61124158 A JPS61124158 A JP S61124158A JP 59245145 A JP59245145 A JP 59245145A JP 24514584 A JP24514584 A JP 24514584A JP S61124158 A JPS61124158 A JP S61124158A
Authority
JP
Japan
Prior art keywords
terminal
leads
cut
ceramic composite
terminals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP59245145A
Other languages
Japanese (ja)
Inventor
Tsuneharu Katada
片田　恒春
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP59245145A priority Critical patent/JPS61124158A/en
Publication of JPS61124158A publication Critical patent/JPS61124158A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To eliminate the improper shortcircuit in manufacture by splitting leads externally to form upper and lower leads, and placing ceramic composite parts on the top of a semiconductor integrated circuit parts cut selectively at the terminal leads at the lower side connected to a printed board. CONSTITUTION:The terminal 3-18 of an IC is split at the same terminal to upper and lower terminals, one of which is connected with the upper ceramic composite part, and the other of which is bent downwards, and connected with the copper foil of a printed board, but the terminals 4, 5, 15, 17 are cut at the terminals at the lower side of the IC, and not connected with the board. A terminal number 12 is similarly cut at the lower side terminal, other foil is formed on the board by cutting the lower side terminal leads, external leads are split to form upper and lower leads, the ceramic composite parts are placed on the top of the IC cut selectively at the lower terminal leads, and assembled stereoscopically. Thus, other printed foil is formed in a space corresponding to the lower leads cut in this manner, circuit wirings are facilitated to eliminate a jumper wirings, and an improper shortcircuit in manufacture can be eliminated.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は電子機器に用いることができる複合電子部品に
関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a composite electronic component that can be used in electronic equipment.

従来の技術 近年、電子機器にセラミックを応用した電子部品や半導
体集積回路（以下ＩＣという）が幅広く使用されている
。2. Description of the Related Art In recent years, electronic components and semiconductor integrated circuits (hereinafter referred to as ICs) in which ceramics are applied have been widely used in electronic devices.

以下図面を参照しながら従来の複合電子部品の一例につ
いて説明する。An example of a conventional composite electronic component will be described below with reference to the drawings.

第４図は既に提案されている従来の複合電子部品の斜視
図を示すものである。第４図において、１はＩＣの樹脂
モールド、２はセラミック複合部品、３．４．５．６．
７．８．９．　１０．１１゜１２．１３，１４．’１５
，１６，１７．１８はＩＣの端子、１９はプリント基板
の銅箔である。FIG. 4 shows a perspective view of a conventional composite electronic component that has already been proposed. In FIG. 4, 1 is an IC resin mold, 2 is a ceramic composite part, 3.4.5.6.
7.8.9. 10.11°12.13,14. '15
, 16, 17, and 18 are IC terminals, and 19 is a copper foil of a printed circuit board.

以主の様に構成された複合電子部品について、３Ａ 以下その動作を説明する。3A regarding composite electronic components configured as shown below. The operation will be explained below.

ＩＣの端子３−１８の各々は同一の端子を上下に分割さ
れ、一方は上部のセラミック複合部品に接続し、他方は
下方に曲げられ、プリント基板の銅箔に接続され回路を
構成される。Each of the terminals 3-18 of the IC is the same terminal divided into upper and lower parts, one of which is connected to the upper ceramic composite component, and the other is bent downward and connected to the copper foil of the printed circuit board to form a circuit.

発明が解決しようとする問題点 しかしながら上記のような構成では、プリント基板の銅
箔にＩＣの端子をすべて接続することになり苗量が狭い
ため、回路構成において結線が困難であり、その結果ジ
ャンパー線が必要になりコストが高くなったり、製造上
においては各端子のはんだ付けの際、隣接端子間のショ
ート不良が発生しやすいという問題点を有していた。Problems to be Solved by the Invention However, with the above configuration, all the IC terminals are connected to the copper foil of the printed circuit board, and the amount of seedlings is limited, making it difficult to connect the circuit configuration. There are problems in that wires are required, which increases costs, and in manufacturing, short circuits between adjacent terminals are likely to occur when soldering each terminal.

本発明は上記問題点に鑑み、簡単な構造で回路結線を容
易にし、ジャンパー線を不要にすると共に、製造上のシ
ョート不良をなくすことができる複合電子部品を提供す
るものである。In view of the above problems, the present invention provides a composite electronic component that has a simple structure, facilitates circuit connection, eliminates the need for jumper wires, and eliminates short-circuit defects during manufacturing.

問題点を解決するための手段 上記問題点を解決するために本発明の複合電子部品は、
外部への導出リードを二分割し、上下にフォーミングす
ると共に、プリント基板に接続する下側の端子リードを
選択的に切断した半導体集積回路部品の上部にセラミッ
ク複合部品を搭載し、立体的に組立てたものである。Means for Solving the Problems In order to solve the above problems, the composite electronic component of the present invention has the following features:
A ceramic composite component is mounted on top of a semiconductor integrated circuit component in which the external lead is divided into two parts, formed into upper and lower parts, and the lower terminal lead that connects to the printed circuit board is selectively cut, and the ceramic composite component is assembled three-dimensionally. It is something that

作　　用 本発明は上記した構成によって、ＩＣとその上部に搭載
されたセラミック複合部品によって回路が構成された端
子の下側リードを切断したことにより、その部分に他の
プリント基を構成することができ、回路結線を容易にし
、ジャンパー線を不要にすると共に、製造上のショート
不良をなくすことができるものである。Effects According to the present invention, by cutting the lower lead of a terminal whose circuit is formed by an IC and a ceramic composite component mounted on the IC, it is possible to construct another printed circuit board in that part. This facilitates circuit connection, eliminates the need for jumper wires, and eliminates short-circuit defects during manufacturing.

実施例 以下本発明の実施例の複合電子部品について、以下図面
を参照しながら説明する。Embodiments Hereinafter, composite electronic components according to embodiments of the present invention will be described with reference to the drawings.

第１図は本発明の実施例における複合電子部品の斜視図
であり、第２図はその側断面構成図である。また、第３
図は実施例の回路図であり、ＦＭ／ＡＭ中間周波増幅回
路を示すものである。FIG. 1 is a perspective view of a composite electronic component according to an embodiment of the present invention, and FIG. 2 is a side cross-sectional configuration diagram thereof. Also, the third
The figure is a circuit diagram of an embodiment, showing an FM/AM intermediate frequency amplification circuit.

第１図において、１はＩＣの樹脂モールド、２５、−　
、・ はセラミック複合部品、３．　４．　５．　６．　７．
　８゜９．１０，１１，１２，１３，１４，１５，１６
゜１７．１８はＩＣの端子、１９．２０はプリント基板
の銅箔である。第２図において、８は上下共ある端子、
１７は上側のみの端子、２１は切断された下側端子跡を
示し、２はセラミック複合部品、２３．２４はその内部
に構成されたコンデンサ、２５．２６はその表面に構成
された抵抗、１９゜２ｏは銅箔、２２はプリント基板で
ある。In FIG. 1, 1 is an IC resin mold, 25, -
,・ are ceramic composite parts, 3. 4. 5. 6. 7.
8゜9.10,11,12,13,14,15,16
17.18 is the terminal of the IC, and 19.20 is the copper foil of the printed circuit board. In Figure 2, 8 is a terminal with both upper and lower ends;
17 shows the terminal only on the upper side, 21 shows the trace of the cut lower terminal, 2 shows the ceramic composite part, 23.24 shows the capacitor configured inside it, 25.26 shows the resistor built on its surface, 19 2o is a copper foil, and 22 is a printed circuit board.

以上の様に構成された複合電子部品について、以下第１
図、第２図及び第３図を用いてその動作を説明する。Regarding the composite electronic component configured as above, the following is the first part.
The operation will be explained using FIG. 2, FIG. 3, and FIG.

まず第１図は斜視図を示すものであり、ＩＣの端子３−
１８の各々は同一の端子を上下に分割され、一方は上部
のセラミック複合部品に接続し、他方は下方に曲げられ
、プリント基板の銅箔に接続されるが、端子４．　５．
　１５．　１７はＩＣの下側の端子を切断しており、プ
リント基板に接続され々い。この状態は第３図の回路に
おいて端子番号４．　５．　１５．　１７に相当し、端
子番号１２も６ベー 同様に下側の端子を切断しており、これはＩＣが機能す
るだめのコンデンサ、抵抗を上側端子に接続しているこ
とによるためであり、第２図のコンデンサ２３．２４及
び抵抗２５．２６である。なお、ここ１埴宜上ＩＣの端
子番号を３−１８としている。First, Figure 1 shows a perspective view, showing terminals 3-
Each of the terminals 4.18 is the same terminal divided into upper and lower parts, one connected to the upper ceramic composite component and the other bent downwards and connected to the copper foil of the printed circuit board. 5.
15. Reference numeral 17 has a terminal on the lower side of the IC cut off, which will be connected to the printed circuit board. This state occurs at terminal number 4 in the circuit of FIG. 5. 15. 17, terminal number 12 has its lower terminal cut off in the same way as 6-bay. This is because the capacitor and resistor that the IC does not function on are connected to the upper terminal, and the second These are capacitors 23 and 24 and resistors 25 and 26 in the figure. Note that the terminal numbers of the IC are 3-18 here.

この状態を側断面構成図として表わしたのが第２図であ
り、２１が切断している下側端子跡を表わしている。FIG. 2 shows this state as a side cross-sectional configuration diagram, and 21 represents the cut trace of the lower terminal.

このように下側端子リードを切断したことによりプリン
ト基板上で他の箔を構成でき、第１図の銅箔２０がそれ
である。By cutting the lower terminal lead in this manner, another foil can be constructed on the printed circuit board, such as the copper foil 20 in FIG.

以上のように本実施例によれば、外部への導出リードを
二分割し、上下にフォーミングすると共に、プリント基
板に接続する下側の端子リードを選択的に切断したＩＣ
の上部にセラミック複合部品を搭載し、立体的に組立て
ることにより、切断された下側リードに対応するスペー
スに他のプリント基を構成でき、回路結線を容易にし、
ジャンパー線を不要にすると共に、製造上のショート不
７７、 良をなくすことができる。As described above, according to this embodiment, the lead to the outside is divided into two parts, formed into upper and lower parts, and the lower terminal lead connected to the printed circuit board is selectively cut.
By mounting a ceramic composite part on the top of the board and assembling it three-dimensionally, other printed boards can be configured in the space corresponding to the cut lower lead, making circuit wiring easier.
In addition to eliminating the need for jumper wires, it also eliminates manufacturing short circuit defects.

発明の効果 以上の様に本発明は、ＩＣとその上部に搭載されたセラ
ミック複合部品によって回路が構成された端子の下側リ
ードを切断したことにより、その部分に他のプリント箔
を構成することができ、回路結線を容易にし、ジャンパ
ー線を不要にすると共に、製造上のショート不良をなく
すことができるものである。Effects of the Invention As described above, the present invention has the advantage that by cutting the lower lead of a terminal where a circuit is formed by an IC and a ceramic composite component mounted on the IC, another printed foil can be formed in that part. This makes circuit connection easier, eliminates the need for jumper wires, and eliminates short-circuit defects during manufacturing.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明の一実施例における複合電子部品の斜視
図、第２図はその側断面構成図、第３図ある。 １・・・・・・ＩＣの樹脂モールド、２・・・・・・セ
ラミック複合部品、３−１８・・・・・・ＩＣの端子、
１９．２０・・・・・・プリント基板の銅箔、２１・・
・・・・切断された下側端子跡、２２・・・・・・プリ
ント基板、２３．２４・・・・・・セラミック複合部品
のコンデンサ、２５．　２６・・・・・・セラミック複
合部品の抵抗。 代理人の氏名　弁理士　中　尾　敏　男　ほか１名二に
憾ｉ 枦　）FIG. 1 is a perspective view of a composite electronic component according to an embodiment of the present invention, FIG. 2 is a side cross-sectional configuration diagram thereof, and FIG. 3 is a perspective view of a composite electronic component according to an embodiment of the present invention. 1... IC resin mold, 2... Ceramic composite parts, 3-18... IC terminal,
19.20... Copper foil for printed circuit board, 21...
... Traces of cut lower terminals, 22 ... Printed circuit board, 23. 24 ... Capacitor of ceramic composite part, 25. 26...Resistance of ceramic composite parts. Name of agent: Patent attorney Toshio Nakao and one other person)

Claims (4)

【特許請求の範囲】[Claims] （１）上部にセラミック複合部品が搭載される半導体集
積回路部品の外部への導出リードの内、回路に結線され
ない端子を少なくとも一つ以上を切断し、プリント基板
等に装着されることを特徴とする複合電子部品。(1) Among the leads leading to the outside of a semiconductor integrated circuit component on which a ceramic composite component is mounted, at least one terminal that is not connected to the circuit is cut off and mounted on a printed circuit board, etc. Composite electronic components. （２）外部への導出リードの内、ＩＣチップからの結線
のない端子を切断したことを特徴とする特許請求の範囲
第１項記載の複合電子部品。(2) The composite electronic component according to claim 1, wherein among the leads leading to the outside, terminals not connected to the IC chip are cut off. （３）外部への導出リードを二分割し、上下にフォーミ
ングすると共に、プリント基板に接続する下側の端子リ
ードを選択的に切断した半導体集積回路部品と、この半
導体集積回路部品の上部に搭載したセラミック複合部品
を備えたことを特徴とする複合電子部品。(3) A semiconductor integrated circuit component in which the external lead is divided into two parts, formed into upper and lower parts, and the lower terminal lead connected to the printed circuit board is selectively cut, and mounted on the top of this semiconductor integrated circuit component. A composite electronic component characterized by being equipped with a ceramic composite component. （４）半導体集積回路部品の上側端子が上部に搭載され
たセラミック複合部品と接続され、必要な回路を構成さ
れる端子のみ下側の端子リードを切断したことを特徴と
する特許請求の範囲第３項記載の複合電子部品。(4) The upper terminal of the semiconductor integrated circuit component is connected to the ceramic composite component mounted on the upper part, and the lower terminal lead is cut only for the terminal that constitutes a necessary circuit. Composite electronic component according to item 3.
JP59245145A 1984-11-20 1984-11-20 Composite electronic parts Pending JPS61124158A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59245145A JPS61124158A (en) 1984-11-20 1984-11-20 Composite electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59245145A JPS61124158A (en) 1984-11-20 1984-11-20 Composite electronic parts

Publications (1)

Publication Number Publication Date
JPS61124158A true JPS61124158A (en) 1986-06-11

Family

ID=17129288

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59245145A Pending JPS61124158A (en) 1984-11-20 1984-11-20 Composite electronic parts

Country Status (1)

Country Link
JP (1) JPS61124158A (en)

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