JP2773288B2 - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JP2773288B2 JP2773288B2 JP22627389A JP22627389A JP2773288B2 JP 2773288 B2 JP2773288 B2 JP 2773288B2 JP 22627389 A JP22627389 A JP 22627389A JP 22627389 A JP22627389 A JP 22627389A JP 2773288 B2 JP2773288 B2 JP 2773288B2
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- slide switch
- switch contact
- contact portion
- conductive paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Contacts (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、各種電子機器に使用するスライドスイッチ
接点部を有するプリント配線板に関するものである。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board having a slide switch contact portion used for various electronic devices.
従来の技術 従来、この種のプリント配線板のスライドスイッチ接
点部は第２図に示すように、絶縁基板11上にスライドス
イッチ部となる導体12を銅はくのエッチングにより形成
した後に、導体12の周囲に間隔をあけてソルダレジスト
13を形成する。その後、スライドスイッチ部の導体12を
導体の酸化等から保護するため、その上に導電ペースト
14、例えば、カーボンペーストやめっきを形成する構成
であり、導電ペースト14上を摺動可能なように配置され
た摺動子15が摺動することで、スライドスイッチを構成
していた。2. Description of the Related Art Conventionally, as shown in FIG. 2, a slide switch contact portion of a printed wiring board of this type is formed by etching a conductor 12 serving as a slide switch portion on an insulating substrate 11 by etching a copper foil. Solder resist with a space around
Form 13. Then, in order to protect the conductor 12 of the slide switch from oxidation of the conductor, a conductive paste
14, for example, a configuration in which a carbon paste or plating is formed, and a slide switch 15 is configured by sliding a slider 15 slidably on the conductive paste 14.
発明が解決しようとする課題 このような構成では、摺動子15がスライドスイッチ部
の導体12のエッジ部を摺動すると、このエッジ部分の導
電ペースト14の膜厚が他の部分よりも薄いため、摺動子
15によってこの部分の導電ペースト14が削られ、エッジ
部の導体12が露出し、導体12が酸化されることにより摺
動部の抵抗値が上昇するなどの課題があった。In such a configuration, when the slider 15 slides on the edge of the conductor 12 of the slide switch portion, the thickness of the conductive paste 14 at this edge portion is smaller than that of the other portions. , Slider
There is a problem that the conductive paste 14 in this portion is scraped off by 15, the conductor 12 at the edge portion is exposed, and the conductor 12 is oxidized to increase the resistance value of the sliding portion.
本発明は、このような課題を解決しようとするもので
あり、導体のエッジ部が露出しない摺動用スイッチ接点
を形成したプリント配線板の提供を目的とするものであ
る。An object of the present invention is to solve such a problem, and an object of the present invention is to provide a printed wiring board having a sliding switch contact in which an edge of a conductor is not exposed.
課題を解決するための手段 この課題を解決するため本発明では、少なくとも片面
に１つのスライドスイッチ接点部を有する導電回路を形
成し、そのスライドスイッチ接点部となる導体のエッジ
部を覆うようにソルダレジストを形成し、かつこのスラ
イドスイッチ接点部となる導体上に導電層を形成したも
のである。Means for Solving the Problems In order to solve the problem, according to the present invention, a conductive circuit having at least one slide switch contact portion is formed, and a solder is formed so as to cover an edge portion of a conductor serving as the slide switch contact portion. A resist is formed, and a conductive layer is formed on a conductor serving as a slide switch contact portion.
作用 この構成によれば、スライドスイッチ接点部の導体の
エッジ部を覆うようにソルダレジストを形成しているの
で、導電ペーストやめっきによる導電層の膜厚が薄くな
る部分がなく、その結果、摺動子が導体のエッジ部にあ
たって導電ペーストやめっきが削られても下地の導体が
露出することはなくなる。According to this configuration, since the solder resist is formed so as to cover the edge of the conductor of the slide switch contact portion, there is no portion where the thickness of the conductive layer is reduced by conductive paste or plating. Even if the conductive paste or plating is scraped when the moving element hits the edge of the conductor, the underlying conductor is not exposed.
実施例 以下、本発明の一実施例を第１図を用いて説明する。
第１図a,bは、本発明によって得られたプリント配線板
上のスライドスイッチ接点の断面図である。Embodiment An embodiment of the present invention will be described below with reference to FIG.
1a and 1b are cross-sectional views of a slide switch contact on a printed wiring board obtained according to the present invention.
（実施例１） 第１図（ａ）に示すように絶縁基板１上にスライドス
イッチ接点部の導体２を有する導電回路を形成した後
に、その接点部の導体２のエッジ部をソルダレジスト３
で覆うようにソルダレジスト３を形成する。その後、こ
の上にカーボンペーストなどの導電ペースト４を形成し
ており、この導電ペースト４上を摺動子５が摺動すると
いう構成となる。従来の構成によれば、スライドスイッ
チ接点部の導体のエッジ部の導電ペーストの膜厚は、導
体上の導電ペースト膜厚が14〜16μｍの時、３〜４μｍ
であったが、この実施例によると導体２のエッジ部の導
電ペースト４の膜厚は11〜13μｍとなり、従来より厚く
なる。このため、摺動子５がこのエッジ部にあたり、導
電ペースト４が削られても導体２が露出することはな
い。(Example 1) After forming a conductive circuit having a conductor 2 of a slide switch contact portion on an insulating substrate 1 as shown in FIG. 1 (a), an edge portion of the conductor 2 of the contact portion was replaced with a solder resist 3
The solder resist 3 is formed so as to cover with. After that, a conductive paste 4 such as a carbon paste is formed thereon, and the slider 5 slides on the conductive paste 4. According to the conventional configuration, the thickness of the conductive paste at the edge of the conductor of the slide switch contact portion is 3 to 4 μm when the thickness of the conductive paste on the conductor is 14 to 16 μm.
However, according to this embodiment, the thickness of the conductive paste 4 at the edge of the conductor 2 is 11 to 13 μm, which is larger than that of the related art. For this reason, the conductor 5 is not exposed even if the conductive paste 4 is shaved, because the slider 5 corresponds to this edge portion.
（実施例２） 上記実施例１において、第１図（ｂ）に示すように導
電ペースト４の面積より、この下層部に形成するスライ
ドスイッチ接点部の導体２の面積を大きく形成する。そ
の後、この導体２において実施例１に示す接点部の導体
２の面積を残すように、この導体２のエッジ部をソルダ
レジスト３で覆う。その後、導体２上に導電ペースト４
を形成して構成している。Second Embodiment In the first embodiment, as shown in FIG. 1B, the area of the conductor 2 of the slide switch contact portion formed in the lower layer portion is formed larger than the area of the conductive paste 4. Thereafter, the edge of the conductor 2 is covered with a solder resist 3 so as to leave the area of the conductor 2 at the contact portion shown in the first embodiment. Then, the conductive paste 4 is applied on the conductor 2.
Is formed.
この構成によれば、前記実施例１に追加して、仮に摺
動子５の組込みがずれた場合においても、導体２のエッ
ジ部に摺動子５があたることはなく、確実に導体２上に
形成した導電ペースト４上を摺動子５が摺動するという
効果が得られる。According to this configuration, in addition to the above-described first embodiment, even if the slider 5 is disassembled, the slider 5 does not hit the edge of the conductor 2, and the conductor 5 can be reliably placed on the conductor 2. The effect is obtained that the slider 5 slides on the conductive paste 4 formed in the above.
発明の効果 以上のように本発明によれば、スライドスイッチ接点
部の導体となるエッジ部をソルダレジストで覆うことに
よりエッジ部の導電ペーストの膜厚が従来よりも厚くな
るので摺動子によってこの部分の導電ペーストが削られ
てもスライドスイッチ接点部となる導体が露出すること
はなく、しかもこのソルダレジストは従来のプリント配
線の工程であるソルダレジスト形成と同時に形成するこ
とができるので、新たに工程を増加させることなく所望
のスライドスイッチ接点部付プリント配線板を製造でき
るという効果が得られる。なお、上記実施例において、
スライドスイッチ接点部には導電ペーストを用いたが、
金めっきなどのめっきを用いてもよい。Advantageous Effects of the Invention As described above, according to the present invention, the conductive paste of the edge of the slide switch is covered with a solder resist so that the thickness of the conductive paste at the edge of the slide switch becomes thicker than in the past. Even if the conductive paste on the part is removed, the conductor that will become the slide switch contact point will not be exposed, and since this solder resist can be formed simultaneously with the solder resist formation, which is a conventional printed wiring process, a new The effect that a desired printed circuit board with a slide switch contact portion can be manufactured without increasing the number of steps is obtained. In the above embodiment,
Although the conductive paste was used for the slide switch contact part,
Plating such as gold plating may be used.
第１図a,bはそれぞれ本発明の一実施例によるプリント
配線板上のスライドスイッチ接点部を示す断面図、第２
図は従来のプリント配線板上のスライドスイッチ接点部
を示す断面図である。 １……絶縁基板、２……スライドスイッチ接点部の導
体、３……ソルダレジスト、４……導電ペースト、５…
…摺動子。FIGS. 1a and 1b are cross-sectional views showing a slide switch contact portion on a printed wiring board according to an embodiment of the present invention.
The figure is a cross-sectional view showing a conventional slide switch contact portion on a printed wiring board. DESCRIPTION OF SYMBOLS 1 ... Insulating board, 2 ... Conductor of a slide switch contact part, 3 ... Solder resist, 4 ... Conductive paste, 5 ...
... Slider.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭57−128096（ＪＰ，Ａ) 実開 昭63−128635（ＪＰ，Ｕ) 実開 平２−47087（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.6，ＤＢ名) H01H 1/06 H05K 3/24──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-57-128096 (JP, A) JP-A 63-128635 (JP, U) JP-A-2-47087 (JP, U) (58) Investigation Field (Int.Cl. 6 , DB name) H01H 1/06 H05K 3/24
Claims (2)
接点部を有する導電回路を形成し、そのスライドスイッ
チ接点部となる導体のエッジ部を覆うようにソルダレジ
ストを形成し、かつこのスライドスイッチ接点部となる
導体上に導電層を形成したプリント配線板。1. A conductive circuit having at least one slide switch contact portion on one side is formed, and a solder resist is formed so as to cover an edge portion of a conductor serving as the slide switch contact portion. A printed wiring board in which a conductive layer is formed on a conductor.
り、この下層部に形成するスライドスイッチ接点部の導
体の面積を大きく形成した請求項１記載のプリント配線
板。2. The printed wiring board according to claim 1, wherein the area of the conductor of the slide switch contact portion formed in the lower layer portion is larger than the area of the conductive layer of the slide switch contact portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22627389A JP2773288B2 (en) | 1989-08-31 | 1989-08-31 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22627389A JP2773288B2 (en) | 1989-08-31 | 1989-08-31 | Printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0389416A JPH0389416A (en) | 1991-04-15 |
| JP2773288B2 true JP2773288B2 (en) | 1998-07-09 |
Family
ID=16842624
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22627389A Expired - Fee Related JP2773288B2 (en) | 1989-08-31 | 1989-08-31 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2773288B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2055148C (en) * | 1991-10-25 | 2002-06-18 | Alain Langevin | Method of forming an electrically conductive contact on a substrate |
| EP1371275A1 (en) * | 2001-03-22 | 2003-12-17 | Siemens Aktiengesellschaft | Circuit support element for electronic devices, in particular for communication terminals |
| DE10249873A1 (en) | 2001-10-26 | 2003-05-08 | Pentax Corp | Method for printing marking on slide view spectacle glass to show dioptric effect involves drafting pattern containing marking comprising scale for determining corresponding spot and then printing pattern on glass |
-
1989
- 1989-08-31 JP JP22627389A patent/JP2773288B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0389416A (en) | 1991-04-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |