JPS5956701A - Chip resistor - Google Patents
Chip resistorInfo
- Publication number
- JPS5956701A JPS5956701A JP57167264A JP16726482A JPS5956701A JP S5956701 A JPS5956701 A JP S5956701A JP 57167264 A JP57167264 A JP 57167264A JP 16726482 A JP16726482 A JP 16726482A JP S5956701 A JPS5956701 A JP S5956701A
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- chip resistor
- resistors
- ceramic substrate
- sides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Non-Adjustable Resistors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 本発明は、チップ抵抗に関するものである。[Detailed description of the invention] The present invention relates to a chip resistor.
エレクトロニクスの発展に伴ない電子部品の形状もいろ
いろと変わってきており、受動部品、すなわち抵抗体や
、コンデンサもリード線を有した、いわゆるディスクリ
ートなものからフェースボンデイングが可能なチップ形
のものが多く使われてきている。抵抗体の場合、これを
セラミック基板上に導体配線や半導体部品用のボンデイ
ングパッドと共に一度に形成する、いわゆる原膜（薄膜
）抵抗基板がかなり使われているが、抵抗体の少ない回
路、あるいは、回路定数の固定しにくい回路などにはチ
ップ抵抗が多く使われている。このチップ抵抗は、厚膜
抵抗基板と同様な手法で作られ、ひとつの大きな基板か
ら数多くのチップ抵抗が一度に作られるので安価である
が、小形なために消費電力が限られ、微小電力用のもの
にしか使用できない。又、回路基板上に組み込んだ後、
抵抗値調整のためにファンクショントリミングをする場
合などは、チップ抵抗の表、裏を判別して回路基板上に
組み込まなければならない。With the development of electronics, the shapes of electronic components have changed in many ways, and passive components, such as resistors and capacitors, have changed from so-called discrete components with lead wires to chip-shaped components that can be face bonded. It is being used. In the case of resistors, so-called original film (thin film) resistor substrates, in which resistors are formed on a ceramic substrate together with conductor wiring and bonding pads for semiconductor components, are often used. Chip resistors are often used in circuits where circuit constants are difficult to fix. This chip resistor is made using a method similar to that of a thick film resistor substrate, and is inexpensive because many chip resistors are made at once from one large substrate. It can only be used for. Also, after being assembled on the circuit board,
When performing function trimming to adjust the resistance value, it is necessary to determine the front and back sides of the chip resistor and install it on the circuit board.
この種の従来のチップ抵抗を図を用いて詳細に説明する
。This type of conventional chip resistor will be explained in detail using figures.
第１図、及び第２図は、各々従来のチップ抵抗を示す平
面図、及び断面図である。セラミック基板（１）に端子
電極（２）を形成した後、抵抗体（３）を印刷、焼成し
て形成し、さらにその後、保護用にオ−バーコート（４
）を行なってチップ抵抗は形成される。FIG. 1 and FIG. 2 are a plan view and a cross-sectional view, respectively, showing a conventional chip resistor. After forming a terminal electrode (2) on a ceramic substrate (1), a resistor (3) is printed and fired, and then an overcoat (4) is applied for protection.
) to form a chip resistor.
現在、作られているチップ抵抗には、約２ｍｍ×１ｍｍ
のものと、約３．２ｍｍ×１．６ｍｍの２種類の大きさ
のものがある。この程度の大きさでは、形成された抵抗
体（３）の大きさが限られるため、電流容量がある程度
大きく要求される場合、１つのチップ抵抗では足りず、
直列又は並列にて数個使用しなければならず、回路基板
のスペースが多くとられてしまうという欠点があった。Chip resistors currently manufactured have a size of approximately 2 mm x 1 mm.
There are two sizes: one with a size of approximately 3.2 mm x 1.6 mm. With this size, the size of the formed resistor (3) is limited, so if a certain amount of current capacity is required, one chip resistor is not enough.
The disadvantage is that several devices must be used in series or in parallel, which takes up a lot of space on the circuit board.
又、抵抗体（３）が片面にしか形成されていないため、
チップ抵抗を回路基板に取付けた後、ファンクショント
リミングしようとする場合は、抵抗体（３）を基板に対
し上向きに取付けなければならないという制約ができ、
チップ抵抗の表、裏を判別して組み込まなければならな
いという欠点があった。Also, since the resistor (3) is formed only on one side,
If you try to perform function trimming after installing the chip resistor on the circuit board, there is a restriction that the resistor (3) must be installed facing upwards on the board.
The drawback was that it was necessary to distinguish between the front and back sides of the chip resistor before installing it.
本発明はこれらの欠点に鑑みてなされたもので、両端子
電極間で並列接続となるようにセラミック基板の両面に
抵抗体を形成し、且つ、抵抗値を調整する場合は片面の
抵抗体のみを用いて該調整をおこなうようにすることに
より、同一形状のチップ抵抗でも２倍程度の抵抗体面積
が得られるため、電流容量がかなり大きくとれ、さらに
、両面に抵抗体が形成されているため回路基板に組んだ
後ファンクショントリミングする場合でも表、裏の判別
は不要となり、しかも従来のものに比べ２つの抵抗体が
あるため表、裏の抵抗体をいろいろ変えて形成すること
により高範囲で精度の良い抵抗を得ることが可能なチッ
プ抵抗を提供することを目的としている。The present invention was made in view of these drawbacks, and it forms resistors on both sides of a ceramic substrate so that both terminal electrodes are connected in parallel, and when adjusting the resistance value, only the resistor on one side is used. By making this adjustment using a chip resistor of the same shape, the area of the resistor element can be doubled, so the current capacity can be considerably increased.Furthermore, since the resistor element is formed on both sides, the current capacity can be considerably increased. Even when performing function trimming after assembly on a circuit board, it is no longer necessary to distinguish between the front and back sides, and since there are two resistors compared to conventional ones, the front and back resistors can be formed with various changes, allowing for a wide range of performance. The purpose is to provide a chip resistor that can obtain highly accurate resistance.
以下、本発明の一実施例を図面に従い説明する。An embodiment of the present invention will be described below with reference to the drawings.
第３図及び第４図は各々、本発明の一実施例によるチッ
プ抵抗を示す平面図、及び断面図である。3 and 4 are a plan view and a cross-sectional view, respectively, showing a chip resistor according to an embodiment of the present invention.
セラミック基板（１）の両端に、該基板（１）の両面に
等しく接続部（２ａ）を有する端子電極（２）′を形成
する。Terminal electrodes (2)' having connecting portions (2a) equally on both sides of the ceramic substrate (1) are formed at both ends of the ceramic substrate (1).
つづいて、表、裏の抵抗体（３）、（３）′を並列接続
にて所望の設計抵抗値になるように上記セラミック基板
（１）の両面に形成する。その後、表、裏の抵抗体（３
）、（３）′に各々オーバーコート（４）、（４）′を
かける。Subsequently, front and back resistors (3) and (3)' are formed on both sides of the ceramic substrate (1) in parallel connection so as to have a desired design resistance value. After that, the front and back resistors (3
) and (3)' are applied with overcoats (4) and (4)', respectively.
チップ抵抗が形成された後、抵抗値調整は片面の抵抗体
（３）のみにトリミングを施こし、他面の抵抗体（３）
′はトリミングをしない。このように形成したチップ抵
抗は大きさが従来のままで電流容量が従来に比し２倍程
度のものが得られる。又、両面に抵抗体（３）、（３）
′が形成されるため、回路基板上に裏表の判別をするこ
となしに取付けてもファンクショントリミングが可能で
ある。更に、両面に形成する抵抗体（３）、（３）′の
種類をいろいろと変えたり細工することにより、高範囲
で且つ精度の良いチップ抵抗が得られる。After the chip resistor is formed, the resistance value is adjusted by trimming only the resistor (3) on one side, and trimming the resistor (3) on the other side.
' is not trimmed. The chip resistor formed in this manner has a current capacity approximately twice that of the conventional one, while maintaining the same size as the conventional one. Also, resistors (3), (3) on both sides
' is formed, so function trimming is possible even when mounted on a circuit board without distinguishing between the front and back sides. Furthermore, by changing the types of the resistors (3) and (3)' formed on both sides and modifying them, a chip resistance with a wide range and high precision can be obtained.
以上のように、本発明によれば、チップ抵抗において、
両端子電極間で並列接続となるようにセラミック基板の
両面に抵抗体を形成し、且つ、抵抗値を調整する場合、
片面の抵抗体のみにて行なうようにしたので、小形でし
かも電流容量が大きくとれ、また抵抗値調整用のトリミ
ングを施こす場合でも、回路基板上に組み込む際の表、
裏の判別が不要となり、さらに、上記両面の抵抗体をい
ろいろ変えて形成することにより高範囲で精度の良い抵
抗が得られる効果がある。As described above, according to the present invention, in the chip resistor,
When forming resistors on both sides of a ceramic substrate so that both terminal electrodes are connected in parallel, and adjusting the resistance value,
Since this is done using only a resistor on one side, it is compact and has a large current capacity.Also, even when trimming for resistance value adjustment, there is no need to worry about the table or table when installing it on the circuit board.
There is no need to identify the back side, and by forming the resistors on both sides in various ways, it is possible to obtain highly accurate resistance over a wide range.
第１図は従来のチップ抵抗の平面図、第２図は第１図の
断面図、第３図は本発明の一実施例によるチップ抵抗の
平面図、第４図は第３図の断面図である。
（１）・・・セラミック基板、（２）′・・・端子電極
、（３），（３）′・・・抵抗体。
なお、図中同一符号は同一、又は相当部分を示す。FIG. 1 is a plan view of a conventional chip resistor, FIG. 2 is a sectional view of FIG. 1, FIG. 3 is a plan view of a chip resistor according to an embodiment of the present invention, and FIG. 4 is a sectional view of FIG. 3. It is. (1)... Ceramic substrate, (2)'... Terminal electrode, (3), (3)'... Resistor. Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (2)
けられた端子電極と、上記両端子電極間に並列接続とな
るよう上記セラミック基板の両面にそれぞれ形成された
２つの抵抗体とを備えたことを特徴とするチップ抵抗。(1) A ceramic substrate, terminal electrodes provided at both ends of the ceramic substrate, and two resistors formed on both sides of the ceramic substrate so as to be connected in parallel between both terminal electrodes. A chip resistor featuring:
うち片面の抵抗体にのみ抵抗値調整用のトリミングが施
こされていることを特徴とする特許請求の範囲第１項記
載のチップ抵抗。(2) A chip resistor according to claim 1, wherein trimming for resistance value adjustment is performed only on one side of the resistors formed on both sides of the ceramic substrate. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57167264A JPS5956701A (en) | 1982-09-24 | 1982-09-24 | Chip resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57167264A JPS5956701A (en) | 1982-09-24 | 1982-09-24 | Chip resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5956701A true JPS5956701A (en) | 1984-04-02 |
Family
ID=15846507
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57167264A Pending JPS5956701A (en) | 1982-09-24 | 1982-09-24 | Chip resistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5956701A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62201902U (en) * | 1986-06-13 | 1987-12-23 | ||
| JPH03124601U (en) * | 1990-03-30 | 1991-12-17 |
-
1982
- 1982-09-24 JP JP57167264A patent/JPS5956701A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62201902U (en) * | 1986-06-13 | 1987-12-23 | ||
| JPH0541525Y2 (en) * | 1986-06-13 | 1993-10-20 | ||
| JPH03124601U (en) * | 1990-03-30 | 1991-12-17 |
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