JPH02132876A - Manufacture of hybrid integrated circuit device - Google Patents

Abstract

PURPOSE:To make an overall circuit, which is composed of circuit substrates heaped up, precise in electrical characteristics by a method wherein two or more substrates are connected together through deformable connecting pieces, resistors are trimmed, and then the circuit substrates are heaped up by bending the connecting pieces. CONSTITUTION:Circuit substrates 21 and 22 and circuit substrates 22 and 23 are electrically and mechanically connected with each other through connecting pieces 24a and 24b respectively. Then, thick film resistors 22a and 22b of the circuit substrate 22 are trimmed measuring an overall circuit characteristic of the circuit substrates 21-23 combined in one and the overall circuit characteristic is adjusted to a specified value. After the adjustment has been finished, the circuit substrates 21-23 are heaped up bending the connecting pieces 24a and 24b. By this constitution, the characteristics of an overall circuit can be made equal to those of the over all circuit of the substrates 21-23 precisely trimmed before heaped up.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method of manufacturing a hybrid integrated circuit device that improves the accuracy of the overall electrical characteristic values of the hybrid integrated circuit device.

BACKGROUND OF THE INVENTION As electronic supplies become smaller and more sophisticated, hybrid integrated circuit devices are required to be smaller and more functional.

In response to this, multilayer boards have been developed in which circuit wiring is done inside the board.

However, as more advanced multi-functionality is required, the total number of electronic GB products mounted on a circuit board increases, and in some cases, it is not possible to mount all of the electronic components necessary for the internal circuit of a multilayer board on the surface. is happening.

To address this, technological innovations have been made to increase the space for mounting electronic components, such as embedding a capacitor in a multilayer board, or stacking boards and installing a resistor between them.

For example, as shown in FIG.
, the thick film resistor 2a is mounted on the substrate 2, the thick film resistor 3a is mounted on the substrate 3, and the connection portion of the through hole is mounted on the substrate 1.
b, 1c, ld, 2b on board 2, 3b, 3 on board 3
c are respectively provided, and the connection portion 1b of the through hole of the substrate 1 is provided.
and the board 2, and the connection part 2b of the through hole of the board 2 and the board 1
A structure is known in which the through-hole connecting portion 1d of the substrate 2 and the through-hole connecting portion 3b of the substrate 3 are electrically and mechanically connected by connecting bodies 4a, 4b, and 4C that also serve as spacers.

Further, as shown in FIG. 5, a chip component 11 is mounted on the substrate 11.
a, thick film resistors 12a, 12b on the substrate 12, substrate 1
Chip components 13a are mounted on the board 3, and these are connected to one connection part 1lb, 12c at both ends of each board.
, 13b, and connect the connecting piece 14a by fitting the fitting portion with a U-shaped cross section and soldering. and the other connection part 11
A structure is also known in which a connecting piece 14b similar to the connecting piece 14a is connected to the connecting pieces 14b, 12a, and 13c, and lead pins 15a and 15b are formed at the lower ends of the respective connecting pieces 14ab and 14b.

Problems to be Solved by the Invention However, even if it becomes possible to increase the density of circuits in this way, when adjusting the electrical characteristic values of the entire circuit that combines the circuits of each board, it is difficult to adjust the electrical characteristics of each circuit board. After assembling as shown in FIGS. 4 and 5, the thick film resistors 2a and 3a in FIG.
Also, since the thick film resistors 12a and 12b shown in FIG. 4 are built inside, they cannot be trimmed. Therefore, there is no other way than to trim each thick film resistor of each circuit board before assembly.

However, when doing this, when the circuits of the individual circuit boards are combined, it is not possible to obtain a predetermined accurate value for the electrical characteristic value of the entire circuit, and the accuracy is also poor.

In particular, when each board is connected by soldering, the board is likely to become distorted due to the heat generated during soldering, which may change the mounting condition of electronic components or cause a difference in the resistance value of thick film resistors. There is.

SUMMARY OF THE INVENTION An object of the present invention is to provide a method for manufacturing a hybrid integrated circuit device, which allows the electrical characteristic values of the entire circuit, which is a combination of a plurality of circuit boards, to be accurately obtained to predetermined values.

Means for Solving the Problems In order to solve the above problems, the present invention provides a method for manufacturing a hybrid integrated circuit device in which a plurality of circuit boards are connected to form an electronic circuit, in which the plurality of circuit boards are deformable. a step of electrically and mechanically connecting the plurality of circuit boards with a connecting piece; a step of adjusting electrical characteristic values of the entire circuit of the hybrid integrated circuit device by trimming a resistor provided on the circuit board; The present invention provides a method for manufacturing a hybrid integrated circuit device, which comprises a step of stacking the connecting pieces by bending them.

Function: Multiple circuit boards are connected electrically and mechanically using deformable connection pieces, and after trimming the resistor in this state, each circuit board is stacked by bending the connection pieces. , the characteristic value of the entire circuit of the device can be made the same as the characteristic value obtained by performing accurate trimming before stacking the circuit boards.

Embodiment Next, an embodiment of the present invention will be explained based on FIGS. 1 and 2.

2L22, 23 are circuit boards. A chip component 21a is mounted on the circuit board 21, and board connecting portions 2l are provided at both ends of the chip component 21a.
b, 21C are formed, and a lead terminal 21 is formed by soldering a U-shaped fitting portion in cross section to each connection portion.
d, 21e are attached. Similarly, thick film resistors 22a and 22b are mounted on the front and back sides of the circuit board 22.
Board connecting portions 22c and 22d are formed at both ends thereof, and a chip component 23a is similarly mounted on the circuit board 23, and a board connecting portion 23b is provided at one end thereof.

Each circuit board provided in this way is connected to the circuit board slopes 21 and 2.
2, the fitting part of the lead terminal 21e of the board connecting part 21c and the upper surface of the fitting part fitted and soldered to the board connecting part 22c are connected by a conductive and deformable connecting piece 24a, and the circuit The boards 22 and 23 are connected to the board connection parts 22d and 23.
The lower surfaces of the fitting portions fitted and soldered to each of the portions b are electrically and mechanically connected by a conductive and deformable connecting piece 24b. Note that each fitting portion and the connecting piece are made of an integral member.

After that, an electrical circuit characteristic value measuring circuit (not shown) is connected to the lead terminals 21d and 21e, and the circuit boards 21, 22,
While measuring the overall circuit characteristics of the circuit board 23, so-called function trimming is performed, in which the thick film resistors 22a and 22b of the circuit board 22 are trimmed by cutting grooves using a laser or the like, and the characteristic values of the entire circuit are determined by predetermined values. Adjust to the value of

After this adjustment is completed, the connecting pieces 24a and 24b are bent and the circuit boards are pressed together as shown in FIG.

In this way, the characteristic value of the entire circuit can be made the same as the characteristic value obtained by precisely trimming before stacking.

In the above, trimming was performed so that each circuit board was connected to a plane to adjust the entire circuit, but as shown in FIG. The chip component 32a is mounted and the circuit board 32
A board connecting portion 32b is formed at one end, and a dummy lead 32c is attached to the other end. Then, connect the board connecting portion 32b to the circuit board 31 by soldering or the like using the connecting piece 33 so that the two base slopes are at right angles, and in this state, adjust the entire circuit combining the circuits of both circuit boards using the thick film resistor. After that, the dummy lead 32c at the other end of the circuit board slope 32 is trimmed on the circuit board slope 31 by trimming the dummy land 3l.
b may be soldered to mechanically connect and fix. This case is suitable when the circuit board 32 is smaller than the circuit board slope 31.

Effects of the Invention According to the present invention, the electrical characteristic values of the entire circuit of a hybrid integrated circuit device constructed by combining a plurality of circuit boards can be adjusted by connecting each circuit board with a deformable connection piece and trimming the resistor. After that, each circuit board is stacked by deforming the connection piece, so the electrical characteristic value of the entire circuit can be adjusted to a predetermined value before stacking, and therefore the electrical characteristics of the entire circuit after stacking can be adjusted to a predetermined value. Characteristic values can also be set to predetermined values with accuracy and precision.

[Brief explanation of drawings]

FIG. 1 is a side view showing one step of a method according to an embodiment of the present invention, FIG. 2 is a side view showing its completed state, and FIG. 3 is a side view showing one step of a method according to another embodiment. FIG. 4 is a sectional view of a conventional hybrid integrated circuit device, and FIG. 5 is a side view of another conventional hybrid integrated circuit device. In the figure, 21, 22, 23, 31, 32 and a circuit board, 22
a, 22b, 31a are thick film resistors, 24a, 24
b, 33 is a connecting piece. Figure 1 51

Claims (1)

[Claims] (1) A method for manufacturing a hybrid integrated circuit device in which a plurality of circuit boards are connected to form an electronic circuit, including the step of electrically and mechanically connecting the plurality of circuit boards with a deformable connecting piece; A hybrid integrated circuit device comprising: adjusting electrical characteristic values of the entire circuit of the hybrid integrated circuit device by trimming a resistor provided on the substrate; and stacking the plurality of circuit boards by bending the connecting pieces. A method of manufacturing an integrated circuit device.