JPS6320378B2 - - Google Patents

Info

Publication number
JPS6320378B2
JPS6320378B2 JP56000593A JP59381A JPS6320378B2 JP S6320378 B2 JPS6320378 B2 JP S6320378B2 JP 56000593 A JP56000593 A JP 56000593A JP 59381 A JP59381 A JP 59381A JP S6320378 B2 JPS6320378 B2 JP S6320378B2
Authority
JP
Japan
Prior art keywords
silver paste
conductive adhesive
lead frame
main surface
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56000593A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57114245A (en
Inventor
Nobuyuki Yanagihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP56000593A priority Critical patent/JPS57114245A/ja
Publication of JPS57114245A publication Critical patent/JPS57114245A/ja
Publication of JPS6320378B2 publication Critical patent/JPS6320378B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/30—
    • H10W72/0113—
    • H10W72/01351—
    • H10W72/073—
    • H10W72/07337—

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
JP56000593A 1981-01-06 1981-01-06 Assembling of semiconductor device Granted JPS57114245A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56000593A JPS57114245A (en) 1981-01-06 1981-01-06 Assembling of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56000593A JPS57114245A (en) 1981-01-06 1981-01-06 Assembling of semiconductor device

Publications (2)

Publication Number Publication Date
JPS57114245A JPS57114245A (en) 1982-07-16
JPS6320378B2 true JPS6320378B2 (esLanguage) 1988-04-27

Family

ID=11478029

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56000593A Granted JPS57114245A (en) 1981-01-06 1981-01-06 Assembling of semiconductor device

Country Status (1)

Country Link
JP (1) JPS57114245A (esLanguage)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5961141A (ja) * 1982-09-30 1984-04-07 Nec Corp ペレツトボンデイング方法
JPS60146342U (ja) * 1984-03-10 1985-09-28 新日本無線株式会社 接着剤塗布装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5363870A (en) * 1976-11-19 1978-06-07 Hitachi Ltd Assembling method of semiconductor device

Also Published As

Publication number Publication date
JPS57114245A (en) 1982-07-16

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