JPS6320128Y2 - - Google Patents

Info

Publication number
JPS6320128Y2
JPS6320128Y2 JP1982062541U JP6254182U JPS6320128Y2 JP S6320128 Y2 JPS6320128 Y2 JP S6320128Y2 JP 1982062541 U JP1982062541 U JP 1982062541U JP 6254182 U JP6254182 U JP 6254182U JP S6320128 Y2 JPS6320128 Y2 JP S6320128Y2
Authority
JP
Japan
Prior art keywords
light
layer
light emitting
receiving element
receiving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1982062541U
Other languages
English (en)
Japanese (ja)
Other versions
JPS58164255U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6254182U priority Critical patent/JPS58164255U/ja
Publication of JPS58164255U publication Critical patent/JPS58164255U/ja
Application granted granted Critical
Publication of JPS6320128Y2 publication Critical patent/JPS6320128Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05556—Shape in side view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP6254182U 1982-04-28 1982-04-28 発光受光素子 Granted JPS58164255U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6254182U JPS58164255U (ja) 1982-04-28 1982-04-28 発光受光素子

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6254182U JPS58164255U (ja) 1982-04-28 1982-04-28 発光受光素子

Publications (2)

Publication Number Publication Date
JPS58164255U JPS58164255U (ja) 1983-11-01
JPS6320128Y2 true JPS6320128Y2 (enrdf_load_stackoverflow) 1988-06-03

Family

ID=30072692

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6254182U Granted JPS58164255U (ja) 1982-04-28 1982-04-28 発光受光素子

Country Status (1)

Country Link
JP (1) JPS58164255U (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0532804Y2 (enrdf_load_stackoverflow) * 1986-06-06 1993-08-23

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5871682A (ja) * 1981-10-23 1983-04-28 Fujitsu Ltd 半導体発光装置

Also Published As

Publication number Publication date
JPS58164255U (ja) 1983-11-01

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