JPS63194392A - 電子回路基板の被膜形成方法及び装置 - Google Patents
電子回路基板の被膜形成方法及び装置Info
- Publication number
- JPS63194392A JPS63194392A JP2692987A JP2692987A JPS63194392A JP S63194392 A JPS63194392 A JP S63194392A JP 2692987 A JP2692987 A JP 2692987A JP 2692987 A JP2692987 A JP 2692987A JP S63194392 A JPS63194392 A JP S63194392A
- Authority
- JP
- Japan
- Prior art keywords
- electronic circuit
- circuit board
- resin
- injection
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 33
- 239000000758 substrate Substances 0.000 title description 26
- 239000011347 resin Substances 0.000 claims description 42
- 229920005989 resin Polymers 0.000 claims description 42
- 238000002347 injection Methods 0.000 claims description 36
- 239000007924 injection Substances 0.000 claims description 36
- 238000000576 coating method Methods 0.000 claims description 26
- 239000011248 coating agent Substances 0.000 claims description 25
- 238000001035 drying Methods 0.000 claims description 24
- 238000005507 spraying Methods 0.000 claims description 14
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 230000007246 mechanism Effects 0.000 description 13
- 210000000078 claw Anatomy 0.000 description 12
- 239000007921 spray Substances 0.000 description 11
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 239000002904 solvent Substances 0.000 description 6
- 241000282326 Felis catus Species 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 239000007888 film coating Substances 0.000 description 5
- 238000009501 film coating Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 230000008901 benefit Effects 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 230000000284 resting effect Effects 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- 101100327917 Caenorhabditis elegans chup-1 gene Proteins 0.000 description 1
- 235000016496 Panda oleosa Nutrition 0.000 description 1
- 240000000220 Panda oleosa Species 0.000 description 1
- YASAKCUCGLMORW-UHFFFAOYSA-N Rosiglitazone Chemical compound C=1C=CC=NC=1N(C)CCOC(C=C1)=CC=C1CC1SC(=O)NC1=O YASAKCUCGLMORW-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 230000010349 pulsation Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 230000000452 restraining effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2692987A JPS63194392A (ja) | 1987-02-07 | 1987-02-07 | 電子回路基板の被膜形成方法及び装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2692987A JPS63194392A (ja) | 1987-02-07 | 1987-02-07 | 電子回路基板の被膜形成方法及び装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63194392A true JPS63194392A (ja) | 1988-08-11 |
| JPH0455552B2 JPH0455552B2 (enrdf_load_html_response) | 1992-09-03 |
Family
ID=12206854
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2692987A Granted JPS63194392A (ja) | 1987-02-07 | 1987-02-07 | 電子回路基板の被膜形成方法及び装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63194392A (enrdf_load_html_response) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5737899A (en) * | 1980-08-19 | 1982-03-02 | Nordson Kk | Electronic part and circuit board clamped to one anther with foamable hot metl and method of clamping same |
| JPS6034093A (ja) * | 1983-08-05 | 1985-02-21 | 株式会社日立製作所 | プリント回路板への液体ワニスの塗布方法 |
-
1987
- 1987-02-07 JP JP2692987A patent/JPS63194392A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5737899A (en) * | 1980-08-19 | 1982-03-02 | Nordson Kk | Electronic part and circuit board clamped to one anther with foamable hot metl and method of clamping same |
| JPS6034093A (ja) * | 1983-08-05 | 1985-02-21 | 株式会社日立製作所 | プリント回路板への液体ワニスの塗布方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0455552B2 (enrdf_load_html_response) | 1992-09-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |