JPS63179355A - Reticle protective case - Google Patents

Reticle protective case

Info

Publication number
JPS63179355A
JPS63179355A JP62011612A JP1161287A JPS63179355A JP S63179355 A JPS63179355 A JP S63179355A JP 62011612 A JP62011612 A JP 62011612A JP 1161287 A JP1161287 A JP 1161287A JP S63179355 A JPS63179355 A JP S63179355A
Authority
JP
Japan
Prior art keywords
case
reticle
synthetic resin
protective case
microparticles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62011612A
Other languages
Japanese (ja)
Inventor
▲やな▼井 正晴
Masaharu Yanai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP62011612A priority Critical patent/JPS63179355A/en
Publication of JPS63179355A publication Critical patent/JPS63179355A/en
Pending legal-status Critical Current

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  • Preparing Plates And Mask In Photomechanical Process (AREA)

Abstract

PURPOSE:To prevent adsorption of microparticles to a case, etc., by using a synthetic resin into which carbon fibers are incorporated as an external case and using a material which decreases the surface resistance thereof to suppress the static electricity to be electrified on the surface of the protective case. CONSTITUTION:The case 11 of the reticle protective case 13 which is mounted on a metallic bottom plate 12 and puts the external case on the plate 12 consists of the synthetic resin contg. the carbon fibers. The surface resistance value decreases sharply when the carbon fiber content in the synthetic resin such as polyacetal exceeds prescribed %. The static electricity to be electrified on the surface of the protective case is thereby suppressed in the case of using the carbon fiber-contg. synthetic resin as the external case. Adsorption of the microparticles of the case is eventually suppressed and the removal of the microparticles is facilitated. Redropping of the microparticles onto the reticle surface and the sticking thereof to the surface are thereby prevented.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は半導体製造における縮少投影露光工程の回路パ
ターンを半導体基板上へ縮少投影転写する際に用いられ
るレチクルの保護ケースに関するものである。
[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a protective case for a reticle used when reducing and transferring a circuit pattern onto a semiconductor substrate in a reduction projection exposure step in semiconductor manufacturing. .

〔従来の技術〕[Conventional technology]

従来、このような縮少投影露光工程において必要な回路
パターンをウェーハ上に転写するなめレチクルが用いら
れるが、レチクルの保管、運搬。
Conventionally, a diagonal reticle is used to transfer the necessary circuit pattern onto a wafer in such a reduced projection exposure process, but storage and transportation of the reticle is difficult.

装置装着時には清浄な合成樹脂製保護ケースを用いてい
た。
A clean synthetic resin protective case was used when installing the device.

第6図は従来のレチクル保護ケースの部分破砕斜視図で
ある1、この保護ケースは、金属底板12上にレチクル
13を搭載して、合成樹脂製外装ケース21と合成樹脂
製前ブタ22をかぶせたものであった。
FIG. 6 is a partially exploded perspective view of a conventional reticle protective case.1 This protective case has a reticle 13 mounted on a metal bottom plate 12, and is covered with a synthetic resin outer case 21 and a synthetic resin front cover 22. It was something like that.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

一般に、半導体の製造工程においては、露光工程が何回
かあり、回路パターンの一部を形どったマスクはレチク
ルを使用して半導体基板上に必要な回路パターンを転写
するが、特に縮少投影露光法では一枚のレチクル上のパ
ターンを繰り返しウェーハ上に転写して用いている。そ
のためレチクル上に微小ゴミが付着した場合、微小ゴミ
の形状がそのままウェーハ上に繰り返し転写されてしま
うと、これらウェーハが全て不良となってしまうので、
微小ゴミの付着には十分に注意を払う必要があった。
Generally, in the semiconductor manufacturing process, there are several exposure steps, and a mask shaped like a part of the circuit pattern is used to transfer the necessary circuit pattern onto the semiconductor substrate using a reticle. In the exposure method, a pattern on a single reticle is repeatedly transferred onto a wafer. Therefore, if minute dust adheres to the reticle, if the shape of the fine dust is repeatedly transferred onto the wafer, all of these wafers will become defective.
It was necessary to pay sufficient attention to the adhesion of minute dust.

例えば、最も一般的な例では、225III112の領
域に1000分の11の大きさのゴミ1個あってはいけ
ないほどである。
For example, in the most common example, there should not be a single piece of dust with a size of 11/1000 in an area of 225III112.

そのためレチクル表面にペリクルという保護膜をはりつ
けたり、レチクル保護ケースを繰り返し洗浄した後、レ
チクルを非常に静かに装着して使用していた。
For this reason, after pasting a protective film called a pellicle on the reticle surface and repeatedly cleaning the reticle protective case, the reticle was attached very gently and used.

しかし、ペリクルは高価であり、使用可能寿命が短かい
欠点があり、またレチクル保護ケースは合成樹脂製であ
るため、超純水で洗浄すると、静電気を生じて微小粒子
を表面に吸着してしまい、その微小粒子がレチクル装着
時にレチクル上に再落下して逆に回路パターン欠陥をつ
くる原因となるという欠点があった。
However, pellicles are expensive and have short usable lifespans, and since the reticle protective case is made of synthetic resin, cleaning it with ultrapure water creates static electricity that attracts minute particles to the surface. However, when the reticle is attached, the fine particles fall onto the reticle again and cause circuit pattern defects.

本発明の目的は、このような欠点を除き、ケースの表面
の導電性を良くし、抵抗を抑えて表面に静電気を生じさ
せないようにし、微小粒子を吸着せずに使用出来るレチ
クル保護ケースを提供することにある。
The purpose of the present invention is to eliminate these drawbacks, improve the conductivity of the surface of the case, suppress resistance, and prevent the generation of static electricity on the surface, and provide a reticle protective case that can be used without adsorbing minute particles. It's about doing.

〔問題点を解決するための手段〕[Means for solving problems]

本発明の構成は、半導体装置の縮少投影露光工程に用い
られるレチクルを、金属底板上に搭載しこの金属底板に
外装ケースをかぶせるレチクル保護ケースにおいて、前
記外装ケースとして合成樹脂に炭素繊維を含有させ、そ
の表面抵抗を下げた材料を用いたことを特徴とする。
The present invention provides a reticle protection case in which a reticle used in a reduction projection exposure process of semiconductor devices is mounted on a metal bottom plate and an outer case is placed over the metal bottom plate, and the outer case contains carbon fiber in a synthetic resin. The material is characterized by the use of a material with reduced surface resistance.

〔実施例〕〔Example〕

次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.

第1図は本発明の一実施例の縦断面図である。FIG. 1 is a longitudinal sectional view of one embodiment of the present invention.

図において、11は炭素繊維含有合成樹脂製外装ケース
、12は金属製底板、13はレチクルである0本実施例
では外装ケース11が炭素繊維含有の合成樹脂からなる
ので、導電性があり、表面電位が低くでき、従って静電
気を生ぜず、粒子の吸着をすることもなくなり、従来の
保護ケースに比べ非常に利用価値が高まった。
In the figure, 11 is an exterior case made of carbon fiber-containing synthetic resin, 12 is a metal bottom plate, and 13 is a reticle. The potential can be lowered, so it does not generate static electricity or attract particles, making it much more useful than conventional protective cases.

第2図は本実施例に用いた炭素繊維含有合成樹脂の炭素
繊維含有率とその表面抵抗の関係を示すグラフである。
FIG. 2 is a graph showing the relationship between the carbon fiber content of the carbon fiber-containing synthetic resin used in this example and its surface resistance.

この場合、含有率0が従来品で、この場合には表面抵抗
が約1014Ωと非常に高いが、含有率5%を超えると
108Ω以下に急激に抵抗値が下がる。本実施例の外装
ケースに用いる場合、樹脂硬度の点から5%〜20%の
範囲が適当である。また、炭素繊維を含有させる元の樹
脂としては、ポリアセタール、塩化ビニール、ABS樹
脂等で良いが、本実施例ではポリアセタールを使用した
。また、導電性を出すには、炭素粒子を含有させること
もできるが、強度が低下すること、微小粒子の原因とな
ることから不適当である。
In this case, the content rate is 0 for the conventional product, and in this case, the surface resistance is very high at about 1014Ω, but when the content rate exceeds 5%, the resistance value rapidly decreases to 108Ω or less. When used in the exterior case of this embodiment, a range of 5% to 20% is appropriate from the viewpoint of resin hardness. Further, the original resin containing the carbon fibers may be polyacetal, vinyl chloride, ABS resin, etc., but polyacetal was used in this example. Further, carbon particles can be included in order to provide electrical conductivity, but this is unsuitable because it lowers the strength and causes the formation of fine particles.

第3図は表面抵抗率と帯電静電気の関係を示すグラフで
あり、表面抵抗率を下げれば帯電を防ぐことが出来るこ
とがわかる。
FIG. 3 is a graph showing the relationship between surface resistivity and electrostatic charge, and it can be seen that charging can be prevented by lowering the surface resistivity.

第4図は本実施例の実験結果から得た帯電静電気と付着
微小粒子数との関係を示すグラフであり、帯電気電圧が
高いと付着粒子が多いことが判明する。すなわち外装ケ
ースの表面に付着する微小粒子数を減らすためには、炭
素繊維を含有させて表面抵抗を下げれば良いことがわが
る。
FIG. 4 is a graph showing the relationship between the electrostatic charge and the number of attached fine particles obtained from the experimental results of this example, and it is clear that the higher the charging voltage is, the more particles are attached. In other words, it is clear that in order to reduce the number of microparticles adhering to the surface of the exterior case, it is sufficient to lower the surface resistance by incorporating carbon fibers.

第5図は本発明の第2の実施例を示す断面図である。こ
の実施例は、平板状の炭素繊維含有導電性合成樹脂製ケ
ース11’と、金属製の底板及び黒板12′とを用いて
レチクル13を収納した場合を示している。
FIG. 5 is a sectional view showing a second embodiment of the invention. This embodiment shows a case in which a reticle 13 is housed using a flat carbon fiber-containing conductive synthetic resin case 11' and a metal bottom plate and blackboard 12'.

〔発明の効果〕〔Effect of the invention〕

以上説明したように、本発明は、表面抵抗率を1010
から102Ωとした炭素繊維含有合成樹脂を外装ケース
に用いたことにより、保護ケースの表面に帯電する靜°
電気を抑え、その結果ケースに微小な粒子が吸着するの
を抑え、かつ微小粒子を除去しやすくし、レチクル表面
に微小粒子が再落下したり、付着することを防ぐことが
出るという効果がある。
As explained above, the present invention has a surface resistivity of 1010
By using carbon fiber-containing synthetic resin with a resistance of 102Ω for the exterior case, the static electricity that builds up on the surface of the protective case can be reduced.
It has the effect of suppressing electricity, thereby suppressing the adsorption of minute particles to the case, making it easier to remove minute particles, and preventing minute particles from falling again or adhering to the reticle surface. .

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例のレチクル保護ケースの縦断
面図、第2I21は本実施例のレチクル保護ケースに用
いた合成樹脂の炭素繊維含有率と表面抵抗を示す特性図
、第3図は表面抵抗と静電気量を示す特性図、第4図は
静電気量と表面付着粒子数を示す特性図、第5図は本発
明の第2の実施例の断面図、第6図は従来のレチクル保
護ケースの一例の部分破砕斜視図である。 11・・・炭′素繊維含有導電性合成樹脂製外装ケース
。12.12’・・・金属製底板、13・・・レチクル
、21・・・合成樹脂ケース、22・・・合成樹脂製前
ブタ。
Fig. 1 is a longitudinal sectional view of a reticle protection case according to an embodiment of the present invention, Fig. 2I21 is a characteristic diagram showing the carbon fiber content and surface resistance of the synthetic resin used in the reticle protection case of this embodiment, and Fig. 3 is a characteristic diagram showing the surface resistance and the amount of static electricity, FIG. 4 is a characteristic diagram showing the amount of static electricity and the number of particles attached to the surface, FIG. 5 is a cross-sectional view of the second embodiment of the present invention, and FIG. 6 is a conventional reticle. FIG. 2 is a partially exploded perspective view of an example of a protective case. 11...Exterior case made of conductive synthetic resin containing carbon fiber. 12.12'...Metal bottom plate, 13...Reticle, 21...Synthetic resin case, 22...Synthetic resin front cover.

Claims (1)

【特許請求の範囲】[Claims] 半導体装置の縮少投影露光工程に用いられるレチクルを
、金属底板上に搭載しこの金属底板に外装ケースをかぶ
せるレチクル保護ケースにおいて、前記外装ケースとし
て合成樹脂に炭素繊維を含有させ、その表面抵抗を下げ
た材料を用いたことを特徴とするレチクル保護ケース。
In a reticle protection case in which a reticle used in the reduction projection exposure process of semiconductor devices is mounted on a metal bottom plate and an outer case is placed over the metal bottom plate, carbon fiber is contained in a synthetic resin as the outer case to reduce its surface resistance. A reticle protection case characterized by using a lowered material.
JP62011612A 1987-01-20 1987-01-20 Reticle protective case Pending JPS63179355A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62011612A JPS63179355A (en) 1987-01-20 1987-01-20 Reticle protective case

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62011612A JPS63179355A (en) 1987-01-20 1987-01-20 Reticle protective case

Publications (1)

Publication Number Publication Date
JPS63179355A true JPS63179355A (en) 1988-07-23

Family

ID=11782733

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62011612A Pending JPS63179355A (en) 1987-01-20 1987-01-20 Reticle protective case

Country Status (1)

Country Link
JP (1) JPS63179355A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5330053A (en) * 1991-02-07 1994-07-19 Dai Nippon Printing Co., Ltd. Case for photomask
KR20010061334A (en) * 1999-12-28 2001-07-07 윤종용 A reticle for photolithography process
JP2007025183A (en) * 2005-07-15 2007-02-01 Shin Etsu Polymer Co Ltd Storage container for pellicle

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5330053A (en) * 1991-02-07 1994-07-19 Dai Nippon Printing Co., Ltd. Case for photomask
KR20010061334A (en) * 1999-12-28 2001-07-07 윤종용 A reticle for photolithography process
JP2007025183A (en) * 2005-07-15 2007-02-01 Shin Etsu Polymer Co Ltd Storage container for pellicle

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