JPS63179355A - Reticle protective case - Google Patents
Reticle protective caseInfo
- Publication number
- JPS63179355A JPS63179355A JP62011612A JP1161287A JPS63179355A JP S63179355 A JPS63179355 A JP S63179355A JP 62011612 A JP62011612 A JP 62011612A JP 1161287 A JP1161287 A JP 1161287A JP S63179355 A JPS63179355 A JP S63179355A
- Authority
- JP
- Japan
- Prior art keywords
- case
- reticle
- synthetic resin
- protective case
- microparticles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001681 protective effect Effects 0.000 title abstract description 15
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 18
- 239000000057 synthetic resin Substances 0.000 claims abstract description 18
- 229920000049 Carbon (fiber) Polymers 0.000 claims abstract description 14
- 239000004917 carbon fiber Substances 0.000 claims abstract description 14
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims abstract description 4
- 239000002184 metal Substances 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 4
- 230000005611 electricity Effects 0.000 abstract description 9
- 230000003068 static effect Effects 0.000 abstract description 8
- 239000011859 microparticle Substances 0.000 abstract description 5
- 229930182556 Polyacetal Natural products 0.000 abstract description 3
- 230000007423 decrease Effects 0.000 abstract description 3
- 229920006324 polyoxymethylene Polymers 0.000 abstract description 3
- 238000001179 sorption measurement Methods 0.000 abstract description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052799 carbon Inorganic materials 0.000 abstract description 2
- 239000002245 particle Substances 0.000 description 9
- 239000000428 dust Substances 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000010419 fine particle Substances 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229910021642 ultra pure water Inorganic materials 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
Landscapes
- Preparing Plates And Mask In Photomechanical Process (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体製造における縮少投影露光工程の回路パ
ターンを半導体基板上へ縮少投影転写する際に用いられ
るレチクルの保護ケースに関するものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a protective case for a reticle used when reducing and transferring a circuit pattern onto a semiconductor substrate in a reduction projection exposure step in semiconductor manufacturing. .
従来、このような縮少投影露光工程において必要な回路
パターンをウェーハ上に転写するなめレチクルが用いら
れるが、レチクルの保管、運搬。Conventionally, a diagonal reticle is used to transfer the necessary circuit pattern onto a wafer in such a reduced projection exposure process, but storage and transportation of the reticle is difficult.
装置装着時には清浄な合成樹脂製保護ケースを用いてい
た。A clean synthetic resin protective case was used when installing the device.
第6図は従来のレチクル保護ケースの部分破砕斜視図で
ある1、この保護ケースは、金属底板12上にレチクル
13を搭載して、合成樹脂製外装ケース21と合成樹脂
製前ブタ22をかぶせたものであった。FIG. 6 is a partially exploded perspective view of a conventional reticle protective case.1 This protective case has a reticle 13 mounted on a metal bottom plate 12, and is covered with a synthetic resin outer case 21 and a synthetic resin front cover 22. It was something like that.
一般に、半導体の製造工程においては、露光工程が何回
かあり、回路パターンの一部を形どったマスクはレチク
ルを使用して半導体基板上に必要な回路パターンを転写
するが、特に縮少投影露光法では一枚のレチクル上のパ
ターンを繰り返しウェーハ上に転写して用いている。そ
のためレチクル上に微小ゴミが付着した場合、微小ゴミ
の形状がそのままウェーハ上に繰り返し転写されてしま
うと、これらウェーハが全て不良となってしまうので、
微小ゴミの付着には十分に注意を払う必要があった。Generally, in the semiconductor manufacturing process, there are several exposure steps, and a mask shaped like a part of the circuit pattern is used to transfer the necessary circuit pattern onto the semiconductor substrate using a reticle. In the exposure method, a pattern on a single reticle is repeatedly transferred onto a wafer. Therefore, if minute dust adheres to the reticle, if the shape of the fine dust is repeatedly transferred onto the wafer, all of these wafers will become defective.
It was necessary to pay sufficient attention to the adhesion of minute dust.
例えば、最も一般的な例では、225III112の領
域に1000分の11の大きさのゴミ1個あってはいけ
ないほどである。For example, in the most common example, there should not be a single piece of dust with a size of 11/1000 in an area of 225III112.
そのためレチクル表面にペリクルという保護膜をはりつ
けたり、レチクル保護ケースを繰り返し洗浄した後、レ
チクルを非常に静かに装着して使用していた。For this reason, after pasting a protective film called a pellicle on the reticle surface and repeatedly cleaning the reticle protective case, the reticle was attached very gently and used.
しかし、ペリクルは高価であり、使用可能寿命が短かい
欠点があり、またレチクル保護ケースは合成樹脂製であ
るため、超純水で洗浄すると、静電気を生じて微小粒子
を表面に吸着してしまい、その微小粒子がレチクル装着
時にレチクル上に再落下して逆に回路パターン欠陥をつ
くる原因となるという欠点があった。However, pellicles are expensive and have short usable lifespans, and since the reticle protective case is made of synthetic resin, cleaning it with ultrapure water creates static electricity that attracts minute particles to the surface. However, when the reticle is attached, the fine particles fall onto the reticle again and cause circuit pattern defects.
本発明の目的は、このような欠点を除き、ケースの表面
の導電性を良くし、抵抗を抑えて表面に静電気を生じさ
せないようにし、微小粒子を吸着せずに使用出来るレチ
クル保護ケースを提供することにある。The purpose of the present invention is to eliminate these drawbacks, improve the conductivity of the surface of the case, suppress resistance, and prevent the generation of static electricity on the surface, and provide a reticle protective case that can be used without adsorbing minute particles. It's about doing.
本発明の構成は、半導体装置の縮少投影露光工程に用い
られるレチクルを、金属底板上に搭載しこの金属底板に
外装ケースをかぶせるレチクル保護ケースにおいて、前
記外装ケースとして合成樹脂に炭素繊維を含有させ、そ
の表面抵抗を下げた材料を用いたことを特徴とする。The present invention provides a reticle protection case in which a reticle used in a reduction projection exposure process of semiconductor devices is mounted on a metal bottom plate and an outer case is placed over the metal bottom plate, and the outer case contains carbon fiber in a synthetic resin. The material is characterized by the use of a material with reduced surface resistance.
次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第1図は本発明の一実施例の縦断面図である。FIG. 1 is a longitudinal sectional view of one embodiment of the present invention.
図において、11は炭素繊維含有合成樹脂製外装ケース
、12は金属製底板、13はレチクルである0本実施例
では外装ケース11が炭素繊維含有の合成樹脂からなる
ので、導電性があり、表面電位が低くでき、従って静電
気を生ぜず、粒子の吸着をすることもなくなり、従来の
保護ケースに比べ非常に利用価値が高まった。In the figure, 11 is an exterior case made of carbon fiber-containing synthetic resin, 12 is a metal bottom plate, and 13 is a reticle. The potential can be lowered, so it does not generate static electricity or attract particles, making it much more useful than conventional protective cases.
第2図は本実施例に用いた炭素繊維含有合成樹脂の炭素
繊維含有率とその表面抵抗の関係を示すグラフである。FIG. 2 is a graph showing the relationship between the carbon fiber content of the carbon fiber-containing synthetic resin used in this example and its surface resistance.
この場合、含有率0が従来品で、この場合には表面抵抗
が約1014Ωと非常に高いが、含有率5%を超えると
108Ω以下に急激に抵抗値が下がる。本実施例の外装
ケースに用いる場合、樹脂硬度の点から5%〜20%の
範囲が適当である。また、炭素繊維を含有させる元の樹
脂としては、ポリアセタール、塩化ビニール、ABS樹
脂等で良いが、本実施例ではポリアセタールを使用した
。また、導電性を出すには、炭素粒子を含有させること
もできるが、強度が低下すること、微小粒子の原因とな
ることから不適当である。In this case, the content rate is 0 for the conventional product, and in this case, the surface resistance is very high at about 1014Ω, but when the content rate exceeds 5%, the resistance value rapidly decreases to 108Ω or less. When used in the exterior case of this embodiment, a range of 5% to 20% is appropriate from the viewpoint of resin hardness. Further, the original resin containing the carbon fibers may be polyacetal, vinyl chloride, ABS resin, etc., but polyacetal was used in this example. Further, carbon particles can be included in order to provide electrical conductivity, but this is unsuitable because it lowers the strength and causes the formation of fine particles.
第3図は表面抵抗率と帯電静電気の関係を示すグラフで
あり、表面抵抗率を下げれば帯電を防ぐことが出来るこ
とがわかる。FIG. 3 is a graph showing the relationship between surface resistivity and electrostatic charge, and it can be seen that charging can be prevented by lowering the surface resistivity.
第4図は本実施例の実験結果から得た帯電静電気と付着
微小粒子数との関係を示すグラフであり、帯電気電圧が
高いと付着粒子が多いことが判明する。すなわち外装ケ
ースの表面に付着する微小粒子数を減らすためには、炭
素繊維を含有させて表面抵抗を下げれば良いことがわが
る。FIG. 4 is a graph showing the relationship between the electrostatic charge and the number of attached fine particles obtained from the experimental results of this example, and it is clear that the higher the charging voltage is, the more particles are attached. In other words, it is clear that in order to reduce the number of microparticles adhering to the surface of the exterior case, it is sufficient to lower the surface resistance by incorporating carbon fibers.
第5図は本発明の第2の実施例を示す断面図である。こ
の実施例は、平板状の炭素繊維含有導電性合成樹脂製ケ
ース11’と、金属製の底板及び黒板12′とを用いて
レチクル13を収納した場合を示している。FIG. 5 is a sectional view showing a second embodiment of the invention. This embodiment shows a case in which a reticle 13 is housed using a flat carbon fiber-containing conductive synthetic resin case 11' and a metal bottom plate and blackboard 12'.
以上説明したように、本発明は、表面抵抗率を1010
から102Ωとした炭素繊維含有合成樹脂を外装ケース
に用いたことにより、保護ケースの表面に帯電する靜°
電気を抑え、その結果ケースに微小な粒子が吸着するの
を抑え、かつ微小粒子を除去しやすくし、レチクル表面
に微小粒子が再落下したり、付着することを防ぐことが
出るという効果がある。As explained above, the present invention has a surface resistivity of 1010
By using carbon fiber-containing synthetic resin with a resistance of 102Ω for the exterior case, the static electricity that builds up on the surface of the protective case can be reduced.
It has the effect of suppressing electricity, thereby suppressing the adsorption of minute particles to the case, making it easier to remove minute particles, and preventing minute particles from falling again or adhering to the reticle surface. .
第1図は本発明の一実施例のレチクル保護ケースの縦断
面図、第2I21は本実施例のレチクル保護ケースに用
いた合成樹脂の炭素繊維含有率と表面抵抗を示す特性図
、第3図は表面抵抗と静電気量を示す特性図、第4図は
静電気量と表面付着粒子数を示す特性図、第5図は本発
明の第2の実施例の断面図、第6図は従来のレチクル保
護ケースの一例の部分破砕斜視図である。
11・・・炭′素繊維含有導電性合成樹脂製外装ケース
。12.12’・・・金属製底板、13・・・レチクル
、21・・・合成樹脂ケース、22・・・合成樹脂製前
ブタ。Fig. 1 is a longitudinal sectional view of a reticle protection case according to an embodiment of the present invention, Fig. 2I21 is a characteristic diagram showing the carbon fiber content and surface resistance of the synthetic resin used in the reticle protection case of this embodiment, and Fig. 3 is a characteristic diagram showing the surface resistance and the amount of static electricity, FIG. 4 is a characteristic diagram showing the amount of static electricity and the number of particles attached to the surface, FIG. 5 is a cross-sectional view of the second embodiment of the present invention, and FIG. 6 is a conventional reticle. FIG. 2 is a partially exploded perspective view of an example of a protective case. 11...Exterior case made of conductive synthetic resin containing carbon fiber. 12.12'...Metal bottom plate, 13...Reticle, 21...Synthetic resin case, 22...Synthetic resin front cover.
Claims (1)
、金属底板上に搭載しこの金属底板に外装ケースをかぶ
せるレチクル保護ケースにおいて、前記外装ケースとし
て合成樹脂に炭素繊維を含有させ、その表面抵抗を下げ
た材料を用いたことを特徴とするレチクル保護ケース。In a reticle protection case in which a reticle used in the reduction projection exposure process of semiconductor devices is mounted on a metal bottom plate and an outer case is placed over the metal bottom plate, carbon fiber is contained in a synthetic resin as the outer case to reduce its surface resistance. A reticle protection case characterized by using a lowered material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62011612A JPS63179355A (en) | 1987-01-20 | 1987-01-20 | Reticle protective case |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62011612A JPS63179355A (en) | 1987-01-20 | 1987-01-20 | Reticle protective case |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63179355A true JPS63179355A (en) | 1988-07-23 |
Family
ID=11782733
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62011612A Pending JPS63179355A (en) | 1987-01-20 | 1987-01-20 | Reticle protective case |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63179355A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5330053A (en) * | 1991-02-07 | 1994-07-19 | Dai Nippon Printing Co., Ltd. | Case for photomask |
KR20010061334A (en) * | 1999-12-28 | 2001-07-07 | 윤종용 | A reticle for photolithography process |
JP2007025183A (en) * | 2005-07-15 | 2007-02-01 | Shin Etsu Polymer Co Ltd | Storage container for pellicle |
-
1987
- 1987-01-20 JP JP62011612A patent/JPS63179355A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5330053A (en) * | 1991-02-07 | 1994-07-19 | Dai Nippon Printing Co., Ltd. | Case for photomask |
KR20010061334A (en) * | 1999-12-28 | 2001-07-07 | 윤종용 | A reticle for photolithography process |
JP2007025183A (en) * | 2005-07-15 | 2007-02-01 | Shin Etsu Polymer Co Ltd | Storage container for pellicle |
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