JPH1149272A - Dustproof housing container - Google Patents

Abstract

PROBLEM TO BE SOLVED: To equip a dustproof housing container that is made up by closing a mounting base with synthetic resin covers with a capacity of preventing substrate members from being contaminated with sticking of pulverulent dusts existing in the air or arising from abrasion of resin itself restrained. SOLUTION: The dustroof housing container is made up by closing a mounting base 2 mounting substrate members 1 thereon by putting from below and above, as indicated with arrows P and Q, a conductive lower cover 3a and a conductive upper cover 3b respectively made mainly of polypropylene resin on the mounting base 2. On making up the container, fibrous stainless steel wires are added to the inside of the covers or the surfaces of the covers are coated with metal plating film, and thereby conductivity is given and sticking of pulverulent dusts to the covers can be restrained. Furthermore, with a proper quantity of fluorocarbon resin mixed on making of the covers, abrasion resistance can be improved for the covers and dusts arising from abrasion of the covers themselves can be restrained, and contamination arising from propagation to the substrate members can be prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dust-proof storage container for carrying and storing a substrate member such as a silicon substrate or a hard disk substrate.

[0002]

2. Description of the Related Art Products such as semiconductor devices and magnetic disks degrade the performance of products when the substrate members such as silicon substrates or hard disk substrates are contaminated by adhesion of fine dust in the air. In order to reduce the non-defective product rate, it is usually manufactured in a clean room where dust is reduced as much as possible.

In a manufacturing process in a clean room,
By preparing a dust-proof storage container and storing the substrate member therein, contamination of the substrate member is prevented, and the dust-proof storage container is provided for transportation and storage. FIG. 4 is a perspective view showing a conventional example of a dustproof storage container, and shows a substrate member 1.
Is mounted on the mounting table 2 which has been cleaned by pure water washing or the like. The lower part of the mounting table 2 is closed with a synthetic resin lid (lower) 31a, and as indicated by an arrow R from the upper part of the mounting table 2 A cover (upper) 31b made of synthetic resin is put on the cover to prevent intrusion of dust.

In recent years, with the improvement of production technologies such as high-density integration technology for semiconductor devices and high-density recording technology for magnetic disks, even if there is attachment of minute fine dust, which has not been a problem in the past, the integration of integrated circuits can be improved. It has been clarified that it may cause a short circuit or poor data reading, and contamination by fine dust in a process of transporting and storing a substrate member such as a silicon substrate or a hard disk substrate has become a problem.

However, the conventional dust-proof storage container is generally an ordinary resin product such as a polypropylene resin which is inexpensive and easy to process, and has a surface resistivity (JISC2141).
Was in a non-conductive state of 10 ¹⁴ Ω or more,
It is charged even by a small amount of friction, and it is easy for fine particles in the air and fine particles due to abrasion of the resin itself to adhere to the charged part. Was difficult to remove.

[0006]

In the process of manufacturing a product such as a semiconductor device or a magnetic disk, if a conventional non-conductive dust-proof storage container is used, fine dust in the air adhering to the wall surface of the storage container is reduced. It is said that fine dust due to abrasion and dust generation of the resin itself may be transferred to a substrate member such as a silicon substrate or a hard disk substrate housed therein, thereby deteriorating the performance of the product and lowering the non-defective product rate. There was a problem.

SUMMARY OF THE INVENTION The present invention has been made in consideration of the above-described problems, and has as its object to provide a dust-proof storage container that can prevent contamination of a substrate member by suppressing adhesion of fine dust.

[0008]

According to the present invention, an object of the present invention is to provide a dustproof storage container in which a mounting table is closed with a synthetic resin cover, wherein the cover has conductivity. This is achieved by: In addition, it is effective that the lid is a fiber to which a fibrous stainless steel wire is added, and the lid is covered with a conductive film such as a metal plating film. It is preferable that the material of the cover be a mixture of 1% to 9% of particles of a fluororesin mainly composed of a polypropylene resin.

According to the above arrangement, since the cover is not charged and hardly adheres with fine dust due to the provision of the conductive cover, transfer to the substrate member does not occur. Further, since the abrasion resistance is improved by mixing the fluororesin particles, it is possible to suppress abrasion and dust generation from the lid itself due to friction.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A dust-proof storage container is formed by covering the upper and lower portions of a mounting table for mounting a substrate member such as a silicon substrate or a hard disk substrate with a conductive cover. FIG. 1 is a perspective view showing one embodiment of a dustproof storage container according to the present invention. In FIG. 1, a substrate member 1
From the lower and upper parts of a mounting base 2 made of, for example, a polycarbonate resin, as shown by arrows P and Q, respectively.
A storage container having a dustproof structure is formed by covering the mounting table 2 with the cover 3a and the cover (upper) 3b.

As a specific means for the cover to have conductivity, a fibrous stainless steel wire is added to the inside of the cover, or the surface of the cover is a conductive film such as a metal plating film. By coating with. By such means, the surface resistivity of the cover (according to JISC2141)
Can be brought into a conductive state of 10 ⁵ Ω or less, and a cover with a charge amount of 0.5 kV or less can be obtained, so that adhesion of fine dust due to charging can be suppressed.

Further, when manufacturing the conductive cover as described above, the fluororesin particles are contained in the range of 1% to 9%,
By using a polypropylene resin mixed with preferably about 3%, it is possible to improve the abrasion resistance while maintaining the conductive state, so that a cover with low abrasion dust generation and low production cost can be obtained. This has been confirmed by experiments.

An embodiment of the present invention will be described below. (Embodiment 1) FIG. 2 is a partial sectional view showing a first embodiment of a cover according to the present invention, in which a mounting table on which a substrate member is mounted is omitted. In FIG. 2, a dust-proof storage container provided with a lid (lower) 3c and a lid (upper) 3d made of a polypropylene resin in which fibrous stainless steel wires 4 are added in a random arrangement inside by 20% by weight. And (Embodiment 2) FIG. 3 is a partial sectional view showing a second embodiment of the cover according to the present invention, and the mounting table is omitted from illustration as in FIG. In FIG. 3, a dustproof storage container was provided with a cover (lower) 3e and a cover (upper) 3f made of polypropylene resin whose surface was covered with a metal plating film 5 of nickel having a thickness of 50 μm. (Comparative Example 1) A dustproof storage container using a cover made of a polypropylene resin according to a conventional technique.

Examples 1 and 2 and Comparative Example 1
, The surface resistivity of the cover, the charge amount, and the number of attached dust (particle diameter: 0.3 μm or more) were measured. The number of adhering dusts was determined by immersing three sets of the test sample lids in 1 liter of ultrapure water for 10 minutes, and changing the flow rate from 10 cc / min to 10 cc / min.
Is an average value obtained by sampling the amount of the sample three times and measuring with an in-liquid particle counter (KL-11 manufactured by RION).

Table 1 summarizes the results of the investigation and evaluation.

[0016]

[Table 1]

According to the results of the investigation and evaluation in Table 1, Examples 1 and 2 were in a conductive state in which the surface resistivity was 10 ⁵ Ω or less and the charge amount was 0.5 kV or less. It is clear that the amount of dust due to the attachment of fine dust is significantly suppressed and the degree of contamination is small as compared with the case of No. 1. For fine dust that has adhered once,
In any case of Examples 1 and 2 and Comparative Example 1, it was found in the above investigation process that it was hardly expected to be cleaned by the subsequent washing. Therefore, it is preferable that the lid is not reused (repeated use). . (Example 3) A cover made by mixing 3% fluororesin with polypropylene resin containing 20% stainless steel wire was used. (Example 4) A lid made by mixing 6% fluororesin into polypropylene resin containing 20% stainless steel wire was used. (Example 5) A lid made by mixing 9% fluororesin into polypropylene resin containing 20% stainless steel wire was used. (Comparative Example 2) A cover made without mixing fluorine resin into polypropylene resin containing 20% of stainless steel wire was used. (Comparative Example 3) A lid produced by mixing 12% of a fluorine resin with a polypropylene resin to which 20% of a stainless steel wire was added was used.

In Examples 3 to 5 and Comparative Examples 2 and 3, the amount of wear, the amount of charge, and the production cost of the test lid were investigated. Table 2 summarizes the survey and evaluation results.

[0019]

[Table 2]

According to the results of the investigation and evaluation in Table 2, in Examples 3 to 5 (the mixing ratio of the fluororesin is 3% to 9%), since each of them has a charge amount of 0.5 kV or less, fine dust is generated. Since it is difficult to adhere and the amount of wear of the resin is very small, the amount of abrasion dust is suppressed, and the production cost is low, so that the overall evaluation is good. In particular, in Example 3 (the mixing ratio of the fluororesin is 3%), it is clear that the charge amount is minimum and the fine dust hardly adheres, so that it is the best overall.

Comparative Example 2 (without mixing of fluorine resin)
With regard to (1), the production cost is the lowest, but the amount of abraded dust is large and fine dust is easily attached. Comparative Example 3
(The mixing ratio of the fluororesin is 12%) is not preferable because the amount of dust generated by abrasion is small, but the amount of charge increases and the manufacturing cost increases.

[0022]

According to the present invention, in a dustproof storage container in which a mounting table is closed with a synthetic resin cover, the cover or surface to which a fibrous stainless steel wire is added has a metal plating film. By providing an electrically conductive lid such as a lid covered with a resin, it is possible to suppress the adhesion of fine dust to the lid, and an appropriate amount of fluororesin to a resin mainly composed of polypropylene resin. By using a cover manufactured by mixing the above, wear and dust generation from the cover itself can be suppressed, and contamination due to transfer to the substrate member closed by the cover can be avoided.

[Brief description of the drawings]

FIG. 1 is a perspective view showing one embodiment of a dustproof storage container according to the present invention.

FIG. 2 is a partial sectional view showing a first embodiment of a cover according to the present invention;

FIG. 3 is a partial sectional view showing a second embodiment of the cover according to the present invention;

FIG. 4 is a perspective view showing a conventional example of a dust-proof storage container.

[Explanation of symbols]

 1 ... board member 2 ... mounting table 3a, 3c, 3e ... cover (lower) 3b, 3d, 3f ... cover (upper) 4 ... ... Stainless steel wire 5 ... Metal plating film

Claims (4)

[Claims] 1. A dust-proof storage container in which a mounting table is covered with a cover made of synthetic resin, wherein the cover has conductivity. 2. The dust-proof storage container according to claim 1, wherein the cover is made by adding a fibrous stainless steel wire. 3. The dust-proof storage container according to claim 1, wherein the cover has a surface covered with a conductive film such as a metal plating film. 4. A dust-proof storage container according to claim 2, wherein a material of the cover is a mixture of 1% to 9% of particles of a fluorine resin mainly composed of a polypropylene resin.