JPS631759B2 - - Google Patents

Info

Publication number
JPS631759B2
JPS631759B2 JP15654280A JP15654280A JPS631759B2 JP S631759 B2 JPS631759 B2 JP S631759B2 JP 15654280 A JP15654280 A JP 15654280A JP 15654280 A JP15654280 A JP 15654280A JP S631759 B2 JPS631759 B2 JP S631759B2
Authority
JP
Japan
Prior art keywords
pattern
conductor
temporary
conductor pattern
density
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP15654280A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5780795A (en
Inventor
Takayoshi Imura
Keiji Kurosawa
Haruo Kawamata
Mitsuo Yamashita
Kyotaka Myagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP15654280A priority Critical patent/JPS5780795A/ja
Publication of JPS5780795A publication Critical patent/JPS5780795A/ja
Publication of JPS631759B2 publication Critical patent/JPS631759B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP15654280A 1980-11-07 1980-11-07 Method of producing printed board Granted JPS5780795A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15654280A JPS5780795A (en) 1980-11-07 1980-11-07 Method of producing printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15654280A JPS5780795A (en) 1980-11-07 1980-11-07 Method of producing printed board

Publications (2)

Publication Number Publication Date
JPS5780795A JPS5780795A (en) 1982-05-20
JPS631759B2 true JPS631759B2 (en, 2012) 1988-01-13

Family

ID=15630067

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15654280A Granted JPS5780795A (en) 1980-11-07 1980-11-07 Method of producing printed board

Country Status (1)

Country Link
JP (1) JPS5780795A (en, 2012)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0210930U (en, 2012) * 1988-07-04 1990-01-24
JPH04114538U (ja) * 1991-03-19 1992-10-08 モダン・プラスチツク工業株式会社 防錆効果を有する粘着シートおよび粘着テープ

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0762592A (ja) * 1993-08-27 1995-03-07 Fuji Elelctrochem Co Ltd 薄膜磁気ヘッドの製造方法
JP4312758B2 (ja) * 2005-12-27 2009-08-12 日本特殊陶業株式会社 配線基板の製造方法、配線基板の中間製品
JP2010114177A (ja) * 2008-11-05 2010-05-20 Nippon Mektron Ltd プリント配線板の形成方法
WO2022158357A1 (ja) * 2021-01-21 2022-07-28 富士フイルム株式会社 マスター原盤及び金属成形物の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0210930U (en, 2012) * 1988-07-04 1990-01-24
JPH04114538U (ja) * 1991-03-19 1992-10-08 モダン・プラスチツク工業株式会社 防錆効果を有する粘着シートおよび粘着テープ

Also Published As

Publication number Publication date
JPS5780795A (en) 1982-05-20

Similar Documents

Publication Publication Date Title
US5369881A (en) Method of forming circuit wiring pattern
US7752752B1 (en) Method of fabricating an embedded circuit pattern
US4411982A (en) Method of making flexible printed circuits
US4000045A (en) Electroplating contacts of printed circuits
US4608274A (en) Method of manufacturing circuit boards
JPS631759B2 (en, 2012)
US5196230A (en) Method for connecting an electromagnetic wave shielding layer with a ground circuit in a printed circuit board
US4925525A (en) Process for producing a printed circuit board
EP1942711B1 (en) Method of manufacturing a wiring board including electroplating
KR101241291B1 (ko) 미세 피치 인쇄회로기판 제조방법
GB1239824A (en) Magnetic circuit element
US3496072A (en) Multilayer printed circuit board and method for manufacturing same
KR20150080565A (ko) 전기 부품 및 전기 부품을 제조하는 방법
US4779339A (en) Method of producing printed circuit boards
US6233819B1 (en) Fine-pitch electrode, process for producing the same, and fine-pitch electrode unit
CN100455162C (zh) 电路板的制造方法
JPH0336319B2 (en, 2012)
JPH03245593A (ja) プリント配線板の製造方法
JP3849170B2 (ja) 印刷用版およびそれを用いたプリント配線板の製造方法
JPH066031A (ja) プリント配線板の製造方法
JPH0529395A (ja) Tabテープの製造方法
JP3794064B2 (ja) プリント配線板およびその製造方法
CH639516A5 (de) Mit bauelementen bestueckte leiterplatte und verfahren zu deren herstellung.
US20010010273A1 (en) Fine-pitch electrode, process for producing the same, and fine-pitch electrode unit
JPS5832798B2 (ja) 印刷配線板の製造法