JPS6317360B2 - - Google Patents
Info
- Publication number
- JPS6317360B2 JPS6317360B2 JP58107346A JP10734683A JPS6317360B2 JP S6317360 B2 JPS6317360 B2 JP S6317360B2 JP 58107346 A JP58107346 A JP 58107346A JP 10734683 A JP10734683 A JP 10734683A JP S6317360 B2 JPS6317360 B2 JP S6317360B2
- Authority
- JP
- Japan
- Prior art keywords
- plate
- green sheet
- ceramic green
- ceramic
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000919 ceramic Substances 0.000 claims description 65
- 238000000034 method Methods 0.000 claims description 19
- 238000004519 manufacturing process Methods 0.000 claims description 15
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 238000004891 communication Methods 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 229910000838 Al alloy Inorganic materials 0.000 claims description 2
- 238000007639 printing Methods 0.000 description 21
- 238000001035 drying Methods 0.000 description 10
- 239000010935 stainless steel Substances 0.000 description 8
- 229910001220 stainless steel Inorganic materials 0.000 description 8
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000006837 decompression Effects 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
Landscapes
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10734683A JPS59232497A (ja) | 1983-06-15 | 1983-06-15 | セラミツク回路基板の製造法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10734683A JPS59232497A (ja) | 1983-06-15 | 1983-06-15 | セラミツク回路基板の製造法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59232497A JPS59232497A (ja) | 1984-12-27 |
JPS6317360B2 true JPS6317360B2 (US20030204162A1-20031030-M00001.png) | 1988-04-13 |
Family
ID=14456719
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10734683A Granted JPS59232497A (ja) | 1983-06-15 | 1983-06-15 | セラミツク回路基板の製造法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59232497A (US20030204162A1-20031030-M00001.png) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0468242U (US20030204162A1-20031030-M00001.png) * | 1990-10-25 | 1992-06-17 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0711933Y2 (ja) * | 1988-11-30 | 1995-03-22 | 太陽誘電株式会社 | セラミックグリーンシートの搬送用トレイ |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5889974U (ja) * | 1981-12-11 | 1983-06-17 | 鳴海製陶株式会社 | 生セラミツクシ−ト保持用カセツト |
-
1983
- 1983-06-15 JP JP10734683A patent/JPS59232497A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0468242U (US20030204162A1-20031030-M00001.png) * | 1990-10-25 | 1992-06-17 |
Also Published As
Publication number | Publication date |
---|---|
JPS59232497A (ja) | 1984-12-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CA1280516C (en) | Apparatus and method for temporarily sealing holes in printed circuit boards | |
US4802945A (en) | Via filling of green ceramic tape | |
US5032426A (en) | Method and apparatus for applying liquid coatings on the surface of printed circuit boards | |
JPH04206912A (ja) | セラミック積層電子部品の製造方法 | |
JPS6317360B2 (US20030204162A1-20031030-M00001.png) | ||
JPH0592544A (ja) | クリーム半田印刷機及びクリーム半田の印刷方法 | |
JPH0754779B2 (ja) | 積層コンデンサ用生シ−トの加工方法 | |
JPS59228741A (ja) | セラミツクグリ−ンシ−トの保持プレ−ト | |
JP3175409B2 (ja) | 積層セラミック電子部品の製造方法及びその装置 | |
JPS6074597A (ja) | 厚膜印刷方法 | |
JPS59147486A (ja) | グリ−ンシ−トの穴充填法 | |
JP3033356B2 (ja) | 陽極基板の製造方法 | |
JPH07202428A (ja) | 多層回路基板の製造方法 | |
JPH0730252A (ja) | 多層配線セラミックス基板の製造方法 | |
JPH06270123A (ja) | グリーンシートの加工方法 | |
JPH062241Y2 (ja) | チツプ抵抗 | |
JPH08244019A (ja) | セラミックグリーンシートの積層方法 | |
JPS582473B2 (ja) | プリントソウチ | |
JPH03270938A (ja) | スクリーン印刷機 | |
JP2572168B2 (ja) | 立体面転写印刷装置 | |
JPS61113298A (ja) | スル−ホ−ル印刷法 | |
JPH0234833Y2 (US20030204162A1-20031030-M00001.png) | ||
JPH0697711B2 (ja) | セラミツク回路基板の製造方法 | |
WO1988002928A1 (en) | Via filling of green ceramic tape | |
JPH08167538A (ja) | 積層電子部品の製造方法 |