JPS63169789A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPS63169789A JPS63169789A JP224987A JP224987A JPS63169789A JP S63169789 A JPS63169789 A JP S63169789A JP 224987 A JP224987 A JP 224987A JP 224987 A JP224987 A JP 224987A JP S63169789 A JPS63169789 A JP S63169789A
- Authority
- JP
- Japan
- Prior art keywords
- board
- printed wiring
- wiring board
- electronic components
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 2
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000001502 supplementing effect Effects 0.000 description 1
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は印刷配線基板に関し、特に高密度実装の印刷配
線基板に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a printed wiring board, and particularly to a printed wiring board with high density packaging.
し従来の技術〕
従来、この種の印刷配線基板では、第３図に示すように
、小型化が困難なコンデンサ１１や可変抵抗器１２など
の電子部品を基板１′の一方の面上に実装し、電子部品
のリード端子を基板１′の印刷配線にはんだ付けして固
定している。Conventionally, in this type of printed wiring board, as shown in FIG. 3, electronic components such as a capacitor 11 and a variable resistor 12, which are difficult to miniaturize, are mounted on one surface of the board 1'. The lead terminals of the electronic components are soldered and fixed to the printed wiring on the board 1'.
上述した従来の印刷配線基板は、実装される電子部品の
高さによって基板が占有する三次元的な空間が一義的に
決定されるので、装置の小型化が困難になるという問題
点がある。The conventional printed wiring board described above has a problem in that the three-dimensional space occupied by the board is uniquely determined by the height of the electronic components mounted thereon, making it difficult to miniaturize the device.
本発明の目的は、実装すべき電子部品の高さによって三
次元的な空間が決定されることから解放され高密度実装
が可能な印刷配線基板を提供することにある。An object of the present invention is to provide a printed wiring board that is free from the three-dimensional space being determined by the height of electronic components to be mounted and that allows high-density mounting.
本発明の印刷配線基板は、少くとも一方の面に印刷配線
面を有する基板と、該基板に設けられ前記基板に実装す
べき電子部品を挿入できる大きさの穴と、該穴に挿入さ
れる前記電子部品の少くとも一方の面を覆いかつ前記電
子部品と接する面と反対の面に予め設定される配線層を
設ける絶縁性のフィルムとを有している。The printed wiring board of the present invention includes a board having a printed wiring surface on at least one side, a hole provided in the board and having a size that allows insertion of an electronic component to be mounted on the board, and a hole that is inserted into the hole. and an insulating film that covers at least one surface of the electronic component and provides a preset wiring layer on a surface opposite to the surface in contact with the electronic component.
次に、本発明の実施例について図面を参照して説明する
。Next, embodiments of the present invention will be described with reference to the drawings.
第１図は本発明の一実施例の分解斜視図、第２図は第１
図のＡ−Ａ”線断面図である。FIG. 1 is an exploded perspective view of one embodiment of the present invention, and FIG.
It is a sectional view taken along the line A-A'' in the figure.
第１図及び第２図に示すように、本実施例は少くとも上
面に印刷配線面４を有する基板１と、基板１に設けられ
基板１に実装すべき電子部品としてのコンデンサ１１及
び可変抵抗器１２を横向きに挿入できる穴２Ａ及び２Ｂ
と、コンデンサ１１及び可変抵抗器１２をそれぞれ穴２
Ａ及び２Ｂに横向きに挿入し、それぞれのリード端子を
印刷配線面４の対応する配線にはんだ付けして基板１に
固定した後、それぞれがコンデンサ１１及び可変抵抗器
１２それぞれの上面を覆いかつそれらの電子部品に接触
しない面に予め基板１の印刷配線に対応して設定された
配線層３１Ａ及び３１ｅを有する絶縁性のフィルム３＾
及び３Ｂとを含んで構成される。As shown in FIGS. 1 and 2, this embodiment includes a substrate 1 having at least a printed wiring surface 4 on the upper surface, a capacitor 11 and a variable resistor as electronic components provided on the substrate 1 and to be mounted on the substrate 1. Holes 2A and 2B into which the container 12 can be inserted horizontally
and the capacitor 11 and the variable resistor 12 respectively through the holes 2.
A and 2B laterally, and after soldering each lead terminal to the corresponding wiring on the printed wiring surface 4 and fixing it to the board 1, each covers the upper surface of the capacitor 11 and the variable resistor 12, and An insulating film 3^ having wiring layers 31A and 31e set in advance in correspondence with the printed wiring of the substrate 1 on a surface that does not come into contact with electronic components.
and 3B.
このように構成することにより、電子部品を横向きに実
装することによる高さの低下と、基板１の厚み分の実装
高さ方向への利用が可能になり、三次元的な空間を小さ
くできる。With this configuration, it is possible to reduce the height by mounting the electronic components horizontally, and to utilize the thickness of the board 1 in the mounting height direction, thereby reducing the three-dimensional space.
更に、配線層を有するフィルム３Ａ及び３Ｂにより、穴
２Ａ及び２Ｂによる基板１の配線領域の減少分を補充す
ることができる。Furthermore, the films 3A and 3B having wiring layers can compensate for the reduction in the wiring area of the substrate 1 due to the holes 2A and 2B.
以上説明したように本発明の印刷配線基板は、小型化で
きない電子部品を基板に設けた穴に横向きに挿入実装し
、電子部品の少くとも一方の面を、電子部品に接しない
面に配線層を設けた絶縁性のフィルムで覆い、フィルム
の配線層と基板の印刷配線とを接続して固定することに
より、基板の高さ方向の占有空間を小さくできるので、
高密度実装が可能になり、かつ、穴を設けることによる
基板の配線領域の減少を補充でき、装置の小型化を達成
できるという効果がある。As explained above, in the printed wiring board of the present invention, electronic components that cannot be miniaturized are inserted and mounted horizontally into holes provided in the board, and at least one side of the electronic components is placed on a wiring layer on the side that is not in contact with the electronic components. By covering the board with an insulating film and connecting and fixing the wiring layer of the film to the printed wiring of the board, the space occupied in the height direction of the board can be reduced.
This has the effect of enabling high-density mounting, supplementing the reduction in wiring area on the board due to the provision of holes, and achieving miniaturization of the device.
第１図は本発明の一実施例の分解斜視図、第２図は第１
図のＡ−Ａ’線断面図、第３図は従来の印刷配線基板の
一例の側面図である。
１．１′・・・基板、２Ｂ、２Ｂ・・・穴、３Ａ、３Ｂ
・・・フィルム、４・・・印刷配線面、１１・・・コン
デンサ、１２・・・可変抵抗器、３１Ａ、３１Ｂ・・・
配線層。
招１回
乎づ別FIG. 1 is an exploded perspective view of one embodiment of the present invention, and FIG.
A cross-sectional view taken along the line AA' in the figure, and FIG. 3 is a side view of an example of a conventional printed wiring board. 1.1'... Board, 2B, 2B... Hole, 3A, 3B
...Film, 4...Printed wiring surface, 11...Capacitor, 12...Variable resistor, 31A, 31B...
wiring layer. 1st invitation farewell
Claims (1)
に設けられ前記基板に実装すべき電子部品を挿入できる
大きさの穴と、該穴に挿入される前記電子部品の少くと
も一方の面を覆いかつ前記電子部品と接する面と反対の
面に予め設定される配線層を設ける絶縁性のフィルムと
を有する印刷配線基板。A board having a printed wiring surface on at least one surface, a hole provided in the board and large enough to insert an electronic component to be mounted on the board, and at least one of the electronic components to be inserted into the hole. 1. A printed wiring board comprising: an insulating film that covers a surface and has a wiring layer set in advance on a surface opposite to the surface in contact with the electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP224987A JPS63169789A (en) | 1987-01-07 | 1987-01-07 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP224987A JPS63169789A (en) | 1987-01-07 | 1987-01-07 | Printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63169789A true JPS63169789A (en) | 1988-07-13 |
Family
ID=11524080
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP224987A Pending JPS63169789A (en) | 1987-01-07 | 1987-01-07 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63169789A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0479989U (en) * | 1990-11-22 | 1992-07-13 |
-
1987
- 1987-01-07 JP JP224987A patent/JPS63169789A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0479989U (en) * | 1990-11-22 | 1992-07-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS63169789A (en) | Printed wiring board | |
| JP2512828B2 (en) | Chip component mounting method | |
| JPH02301182A (en) | Printed circuit board for flat mounting structure | |
| JP3769881B2 (en) | Electronic circuit equipment | |
| JPH0439668Y2 (en) | ||
| JPH0458189B2 (en) | ||
| JP2003309354A (en) | Method of connecting printed wiring board and printed wiring board | |
| JPH0124944Y2 (en) | ||
| JPS58182430U (en) | Flat package integrated circuit mounting equipment | |
| JPH05198737A (en) | Laminated multichip semiconductor device ant its manufacture | |
| JPS63156390A (en) | Hybrid integrated circuit component | |
| JPS58122461U (en) | Mounting board | |
| JPS5968918A (en) | Chip type electronic part | |
| JPS60236282A (en) | Electronic circuit board | |
| JPS5911450U (en) | Mounting board for integrated circuit elements | |
| JPS5942045U (en) | Flat package integrated circuit mounting equipment | |
| JPS60229394A (en) | Electronic circuit device | |
| JPH04302115A (en) | Chip part | |
| JPS60109358U (en) | Block board connection structure | |
| JPS6054368U (en) | hybrid integrated circuit | |
| JPS60110190A (en) | Hybrid integrated circuit | |
| JPS5965563U (en) | printed wiring board | |
| JPS58138371U (en) | Parts mounting holder | |
| JPH02288201A (en) | Chip component | |
| JPS63228578A (en) | Method of mounting electronic parts on board |