JPH02288201A - Chip component - Google Patents
Chip componentInfo
- Publication number
- JPH02288201A JPH02288201A JP1109702A JP10970289A JPH02288201A JP H02288201 A JPH02288201 A JP H02288201A JP 1109702 A JP1109702 A JP 1109702A JP 10970289 A JP10970289 A JP 10970289A JP H02288201 A JPH02288201 A JP H02288201A
- Authority
- JP
- Japan
- Prior art keywords
- chip component
- terminal
- chip
- printed wiring
- resistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims abstract description 3
- 238000010586 diagram Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Details Of Resistors (AREA)
- Non-Adjustable Resistors (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は印刷配線板に表面実装するチップ部品に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] This invention relates to a chip component that is surface mounted on a printed wiring board.
第４図は現在量産されている例えばＥＩＡＪ規格ＲＣ−
２６９Ｏｒ角板形チップ固定抵抗器」 （以下、チップ
部品と称す）の外観斜視図、第５図はチップ部品を印刷
配線板にはんだ付は実装した組立外観斜視図、第６図は
印刷配線板上のランド配設図である。各図において、１
ａはチップ部品、２ａはチップ部品１ａの電極用の端子
、３ａは印刷配線板上に配設したチップ部品１ａの接続
用のランド、４ははんだ、Ｔａはチップ部品１ａの厚さ
である。Figure 4 shows the EIAJ standard RC-
269Or square plate type fixed chip resistor (hereinafter referred to as a chip component). Figure 5 is an assembled exterior perspective view of the chip component soldered and mounted on a printed wiring board. Figure 6 is an assembled external perspective view of the printed wiring board. This is the land layout diagram above. In each figure, 1
a is a chip component, 2a is an electrode terminal of the chip component 1a, 3a is a land for connection of the chip component 1a arranged on the printed wiring board, 4 is solder, and Ta is the thickness of the chip component 1a.
次に作用について説明する。チップ部品１ａの複数の端
子２ａは、対向する印刷配線板（図示せず）にパターン
配設したランド３ａの上にはんだ４によりはんだ付は実
装される。印刷配線板に電子回路をパターン設計する際
において、例えば２個のチップ部品１ａを直交して配設
したい場合、第６図のようにランド３ａ、３ｂを同一平
面に並設する。従って、２個のチップ部品１ａのための
印刷配線板上のパターン占有面′ｆＲ（範囲）は７で示
す範囲となる。Next, the effect will be explained. The plurality of terminals 2a of the chip component 1a are soldered and mounted by solder 4 on lands 3a arranged in a pattern on an opposing printed wiring board (not shown). When designing an electronic circuit pattern on a printed wiring board, for example, if it is desired to arrange two chip components 1a orthogonally, lands 3a and 3b are arranged side by side on the same plane as shown in FIG. Therefore, the pattern occupied surface 'fR (range) on the printed wiring board for the two chip components 1a becomes the range shown by 7.
従来のチップ部品は以上のように構成されているので、
パターン設計におけるランド配設時に、例えば２個のチ
ップ部品を直交して配設する必要がある場合でも、直交
が不可能なため並設しなければならず、大きな占有範囲
を必要としていためで、実装密度が高くできないという
問題点があった。Conventional chip components are configured as described above, so
When arranging lands in pattern design, for example, even if it is necessary to arrange two chip components perpendicularly, they must be arranged side by side because orthogonality is impossible, which requires a large occupied area. There was a problem that the packaging density could not be increased.
この発明は上記のような問題点を解消するためになされ
たもので、ランドの占有範囲を小さくすることを可能に
し、印刷配線板の小型化を達成し得るようにしたチップ
部品を得ることを目的とする。This invention was made in order to solve the above-mentioned problems, and aims to obtain a chip component that makes it possible to reduce the area occupied by the land and to achieve miniaturization of printed wiring boards. purpose.
この発明に係るチップ部品は、抵抗体とこの抵抗体の両
端に取付けられた端子とからなり、この端子が印刷配線
板上のランドにはんだ付けにより固定されるようになさ
れたチップ部品において、上記端子の抵抗体保持部より
下側を厚くし、抵抗体の下方に他のチップ部品の挿入を
許す空間を形成したものである。A chip component according to the present invention includes a resistor and a terminal attached to both ends of the resistor, and the terminal is fixed to a land on a printed wiring board by soldering. The terminal is made thicker below the resistor holding portion, and a space is formed below the resistor to allow insertion of other chip components.
この発明におけるチップ部品の端子構造は、２個のチッ
プ部品を立体交差して印刷配線板上に実装できる。The terminal structure of the chip component according to the present invention allows two chip components to be mounted on a printed wiring board in a three-dimensionally intersecting manner.
以下この発明の一実施例を図について説明する。 An embodiment of the present invention will be described below with reference to the drawings.
第１図において、２ｂは本発明のチップ部品１ｂの端子
、５はチップ部品１ｂの抵抗体であり、上記端子２ｂは
、チップ部品１ｄを保持している部分より下方を厚くし
て、チップ部品１ｂと印刷配線板との間に他のチップ部
品を配置できる高さＨで示す空間を確保できるようにな
されている。In FIG. 1, 2b is a terminal of the chip component 1b of the present invention, 5 is a resistor of the chip component 1b, and the terminal 2b is made thicker below than the part holding the chip component 1d. A space with a height H in which other chip components can be placed can be secured between 1b and the printed wiring board.
第２図は従来のチップ部品１ａの上に本発明のチップ部
品１ｂがまたがるように重ねてはんだ４により実装した
組立外観図を示す。FIG. 2 shows an assembled external view in which a chip component 1b of the present invention is stacked on top of a conventional chip component 1a and mounted with solder 4.
第３図において、６は本発明によるチップ部品１ｂ及び
チップ部品１ａのための印刷配線板上のパターン占有範
囲である。In FIG. 3, numeral 6 indicates the area occupied by the pattern on the printed wiring board for the chip component 1b and the chip component 1a according to the present invention.
第１図において、本発明のチップ部品１ｂの端子２ｂの
厚さ（高さ）をＴｂとする。Ｔｂの大きさを第４図の従
来のチップ部品１ａの厚さＴａより大きくして、抵抗体
５の下面までの高さＨがＴａより大きくなるようにする
。そして、第２図のように高さＨの空間に従来のチップ
部品１ａが納められるような構成となるようにする。In FIG. 1, the thickness (height) of the terminal 2b of the chip component 1b of the present invention is Tb. The size of Tb is made larger than the thickness Ta of the conventional chip component 1a shown in FIG. 4, so that the height H to the bottom surface of the resistor 5 is made larger than Ta. Then, as shown in FIG. 2, the structure is such that the conventional chip component 1a is housed in a space having a height H.
第３図はチップ部品１ａ及び１ｂを第２図に示すように
組立て構成するための印刷配線板上のランド配設図であ
る。チップ部品１ａの端子２ａに対向するランド３ａ一
対と、チップ部品１ｂの端子２ｂに対向するランド３ｂ
一対とを各十文字形に配設する。そして、チップ部品１
ａをランド３ａにはんだ付けし、次にチップ部品１ｂを
チップ部品１ａに覆い被せるようにして、ランド３ｂに
はんだ付けする。FIG. 3 is a layout diagram of lands on a printed wiring board for assembling chip components 1a and 1b as shown in FIG. 2. A pair of lands 3a facing the terminal 2a of the chip component 1a, and a land 3b facing the terminal 2b of the chip component 1b.
A pair is arranged in each cross shape. And chip part 1
A is soldered to the land 3a, and then the chip component 1b is soldered to the land 3b so as to cover the chip component 1a.
以上のようにこの発明によれば、チップ部品の端子構造
を厚く（高く）シたので、印刷配線板のランドの占有範
囲が小さくでき、多数のチップ部品を使用する高密度印
刷配線板においては特に印刷配線板の小型化、低コスト
化を図ることができる。As described above, according to the present invention, since the terminal structure of the chip component is made thicker (higher), the area occupied by the land of the printed wiring board can be reduced, and this is useful for high-density printed wiring boards that use a large number of chip components. In particular, it is possible to reduce the size and cost of printed wiring boards.
第１図はこの発明の一実施例によるチップ部品の外観斜
視図、第２図はその実装態様を示す斜視図、第３図はこ
の発明のチップ部品を実装するためのランド配置図、第
４図は従来のチップ部品の外観斜視図、第５図はその実
装態様を示す斜視図、第６図は従来のランド配設図であ
る。
図中、１ｂはチップ部品、２ｂは端子、３ｂはランド、
４ははんだ、５は抵抗体である。
なお、図中同一符号は同−又は相当部分を示す。FIG. 1 is an external perspective view of a chip component according to an embodiment of the present invention, FIG. 2 is a perspective view showing its mounting mode, FIG. 3 is a land layout diagram for mounting the chip component of the present invention, and FIG. The figure is an external perspective view of a conventional chip component, FIG. 5 is a perspective view showing its mounting mode, and FIG. 6 is a conventional land arrangement diagram. In the figure, 1b is a chip component, 2b is a terminal, 3b is a land,
4 is solder, and 5 is a resistor. Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (1)
なり、この端子が印刷配線板上のランドにはんだ付けに
より固定されるようになされたチップ部品において、上
記端子の抵抗体保持部より下側を厚くし、抵抗体の下方
に他のチップ部品の挿入を許す空間を形成したことを特
徴とするチップ部品。In a chip component that consists of a resistor and a terminal attached to both ends of the resistor, and the terminal is fixed to a land on a printed wiring board by soldering, the terminal is located below the resistor holding part of the terminal. A chip component characterized by having thicker sides and forming a space below the resistor into which other chip components can be inserted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1109702A JPH02288201A (en) | 1989-04-27 | 1989-04-27 | Chip component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1109702A JPH02288201A (en) | 1989-04-27 | 1989-04-27 | Chip component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02288201A true JPH02288201A (en) | 1990-11-28 |
Family
ID=14517047
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1109702A Pending JPH02288201A (en) | 1989-04-27 | 1989-04-27 | Chip component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02288201A (en) |
-
1989
- 1989-04-27 JP JP1109702A patent/JPH02288201A/en active Pending
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