JPH0559873U - 3D circuit board - Google Patents

Abstract

(57) [Abstract] [Purpose] It is possible to mount components between component mounting boards, aiming to reduce their size and area. A lower substrate 10 and an upper substrate 12 are vertically opposed to each other with a conducting substrate 20 interposed so that their substrate surfaces face each other and a component mounting space exists between both substrate surfaces. The conductive board 20 has a board height corresponding to the height of the mounted component on the board surface, and the conductive board 20 is electrically connected to the electrodes 16 and 18 of the boards 10 and 12, respectively. The electrode 22 is applied.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a three-dimensional circuit board in which component mounting boards are three-dimensionally arranged.

[0002]

[Prior Art]

 As shown in FIG. 3, it is possible to mount a circuit component such as a leaded IC 4 or a chip-type resistor 6 on both sides 2a and 2b of the substrate 2 in order to improve the mounting efficiency as compared with the case where the circuit component is mounted on one side of the substrate. , There is a so-called double-sided mounting type. In addition to mounting the circuit components such as the IC 4 on the surface 2a of the substrate 2 as shown in FIG. Although there are some that can reduce the area, there is a drawback in that it is necessary to provide the wiring 8 inside the substrate 2 which requires labor and labor.

Therefore, while having the mounting efficiency of the double-sided mounting type as shown in FIG. 3, the component mounting boards 10 and 12 are vertically moved as shown in FIG. There is a three-dimensional circuit board structure in which the board surfaces 10a and 12a of the plurality of metal pin terminals 14 face each other.

In this three-dimensional circuit board structure, the wiring terminals of the upper and lower boards 10 and 12 are conductively connected by the pin terminals 14, and circuit components such as a resistor 6 are mounted between the surfaces of the boards 10 and 12. We are working to reduce its size and area.

[0005]

[Problems to be solved by the device]

 However, in the case of FIG. 5, in the case where a circuit component having a large number of leads such as the IC4 is mounted on the substrate 12, for example, a large number of pin terminals are provided and the number corresponding to the pin terminals is provided. Since it is necessary to route the printed wiring to the end portion of the substrate 10 and to connect the routed end portion to each corresponding pin terminal for conduction, a large number of man-hours are required to install the pin terminal 14.

Therefore, in the present invention, for example, as shown in FIG. 5, a component is mounted on each of a pair of upper and lower component mounting boards to reduce the size and area of the component mounting board. It is an object of the present invention to facilitate connection conduction to the wiring electrodes of the component mounting board without using the pin terminals as described above and without any trouble.

[0007]

[Means for Solving the Problems]

 In order to achieve such an object, in the three-dimensional circuit board of the present invention, the board for mounting the components is arranged opposite to each other with the board for conduction having a board height of at least the mounting height of the components, and The conducting substrate is characterized by being provided with a conducting electrode for electrically conducting the wiring electrode of the component mounting substrate.

[0008]

[Action]

 Since the component mounting boards are arranged facing each other with the conduction substrate interposed, a component mounting space corresponding to the board height of the conduction substrate exists between the component mounting board surfaces. Parts can be mounted between the mounting board surfaces. In addition, since the conducting electrodes formed on the conducting substrate electrically conduct with the wiring electrodes of the component mounting substrate, even if there are a plurality of wiring electrodes, the conducting electrodes matching the number are provided. It only needs to be formed on the conductive substrate.

[0009]

【Example】

 Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings.

FIG. 1 is an exploded perspective view of a three-dimensional circuit board according to an embodiment of the present invention, in which parts corresponding to those in FIG. 5 are designated by the same reference numerals. As shown in the figure, circuit components such as IC4 are provided on the surface 10a of the lower component mounting substrate (lower substrate) 10, and IC4 and resistors are also provided on the surface 12b of the upper component mounting substrate (upper substrate) 12. Circuit components such as 6 are mounted respectively. In both of the substrates 10 and 12, electrode lands 16 for wiring are formed in the four corners of the lower substrate 10, and through hole electrodes 18 for wiring are formed in the four corners of the upper substrate 12 as well. The surfaces 10a and 12a are vertically opposed to each other with the conduction substrate 20 interposed therebetween. Here, the through-hole electrode is formed by forming an electrode in the through-hole, and the electrode land is formed by simply forming an electrode on the substrate.

On the other hand, the conductive board 20 has a rectangular frame shape, and between the board surfaces of both boards 10 and 12, a component mounting space is present inside the frame shape, and the board height is lower. It has the height of the mounted circuit component 4 on the substrate 10. The conduction substrate 20 is formed with conduction through-hole electrodes 22 at positions facing the wiring electrodes 16 and 18 formed at the four corners of the substrates 10 and 12, respectively. As a result, the circuit components 4 and 6 of the upper substrate 12 are led to the through-hole electrodes 18 of the upper substrate 12, the through-hole electrodes 22 of the conducting substrate 20 and the electrode lands 16 of the lower substrate 10, and are illustrated. When the three-dimensional circuit board is mounted on a parent board that is not mounted, it is possible to input and output electric signals with other circuit components on the parent board.

As described above, in this embodiment, the lower substrate 10 and the upper substrate 12 are arranged on the substrate surfaces 10a. 12a are arranged so as to face each other with a conducting substrate 20 interposed therebetween, and the substrate height of the conducting substrate is set to the component height of the circuit component 4 mounted on the lower substrate 10. Since the component mounting space can exist, the circuit component 4 can be mounted on the surface 10a of the lower substrate 10 facing between the both substrates 10 and 12, and the both substrates 10 and 12 are integrated into a compact and low-area three-dimensional circuit. It can be a substrate.

Further, since the through-hole electrode 22 formed on the conductive substrate 20 is electrically connected to the land electrodes 16 and 18 of both substrates 10 and 12, even if there are a plurality of electrodes. It is only necessary to form the electrodes 22 corresponding to the number on the conductive substrate 20, and therefore it is not necessary to provide lead terminals between both substrates according to the number of electrodes as in the conventional case.

Although the conducting board 22 in the above-described embodiment has a rectangular frame shape, it does not have such a frame shape. For example, as shown in FIG. 2, a pair of conducting boards 24 are provided in the component mounting space. May be provided so as to face each other, and the through-hole electrode 22 corresponding to FIG. 1 is formed on each of the pair of conductive substrates 24.

In the above-described embodiment, the through-hole electrode is formed on the conduction substrate 20, but the electrode is formed along the outer periphery of the conduction substrate 20 instead of the through-hole electrode. But it's okay.

Further, although the electrode lands 16 are formed at the four corners of the lower substrate 10 and the through-hole electrodes 18 are formed on the upper substrate 12 in the above-described embodiment, the lower substrate 10 also has the back surface side. If circuit components are mounted, through-hole electrodes may be provided at the four corners of the lower substrate 10.

Further, in the above-described embodiment, a terminal electrode is formed on the outer peripheral edge of the lower substrate 10 to be a surface mounting type, or a lead terminal is attached to the outer peripheral edge to form a single inline (SIP) or dual. An in-line (DIP) type three-dimensional circuit board may be used, or a resin may be molded over the entire three-dimensional circuit board.

[0018]

[Effect of the device]

 As described above, according to the present invention, since the component mounting boards are arranged opposite to each other with the board height being at least the component mounting height, the component mounting boards are disposed between the component mounting boards. It can be mounted, and both boards can be integrated into a compact, low-area 3D circuit board. Further, since the electrodes of the conducting board can establish electrical conduction with the electrodes of the component mounting board, even if there are a plurality of electrodes, it suffices to form the number of electrodes on the conducting board. Since there is no need to provide lead terminals between both substrates as in the conventional case, the size and area are reduced, and since no pin terminals are used, it is easy to install. Complete.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of a three-dimensional circuit board according to an embodiment of the present invention.

FIG. 2 is an exploded perspective view of a three-dimensional circuit board according to another embodiment of the present invention.

FIG. 3 is a side view of a circuit board according to a conventional example.

FIG. 4 is a side view of a circuit board according to another conventional example.

FIG. 5 is a side view of a circuit board according to still another conventional example.

[Explanation of symbols]

 4, 6 Circuit Parts 10 Lower Substrate 12 Upper Substrate 16 Electrode Land 18 Through Hole Electrode 20 Conduction Substrate 22 Through Hole Electrode

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Masao Uno 26-10 Tenjin, Nagaokakyo, Kyoto Prefecture Murata Manufacturing Co., Ltd.

Claims (1)

[Scope of utility model registration request] 1. A component mounting board is arranged so as to face each other via a conduction board having a board height of at least a mounting height of the component, and the conduction board is for wiring the component mounting board. A three-dimensional circuit board characterized by being provided with a conducting electrode for establishing electrical conduction with the electrode.