JPS58122461U - Mounting board - Google Patents
Mounting boardInfo
- Publication number
- JPS58122461U JPS58122461U JP1961182U JP1961182U JPS58122461U JP S58122461 U JPS58122461 U JP S58122461U JP 1961182 U JP1961182 U JP 1961182U JP 1961182 U JP1961182 U JP 1961182U JP S58122461 U JPS58122461 U JP S58122461U
- Authority
- JP
- Japan
- Prior art keywords
- mounting board
- groove
- electronic component
- embedding
- contacting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は、本考案の基板に装着可能な半導体集積回路の
１例を示した斜視図である。第２図は、第１図の正面図
である。第３図は、本考案の半導体集積回路取付基板で
ある。第４図は、第１図の半導体集積回路を第３図の基
板は装着した断面図である。第５図は、半導体集積回路
を２段積重ねし基板に装着した時の断面図である。
。
１・・・・・・パッケージ、２・・・・・・リード、３
・・・・・・プリント基板、４・・・・・・挿入孔、５
・・・・・・張り出し部、６・・・・・・配線。FIG. 1 is a perspective view showing one example of a semiconductor integrated circuit that can be mounted on the substrate of the present invention. FIG. 2 is a front view of FIG. 1. FIG. 3 shows a semiconductor integrated circuit mounting board of the present invention. FIG. 4 is a sectional view of the semiconductor integrated circuit of FIG. 1 mounted on the substrate of FIG. 3. FIG. 5 is a cross-sectional view of two stacked semiconductor integrated circuits mounted on a substrate.
. 1...Package, 2...Lead, 3
...Printed circuit board, 4...Insertion hole, 5
...Protrusion, 6...Wiring.
Claims (1)
電子部品の電気的端子と接触するためのバネ効果をもつ
配線端子を設けたことを特徴とする実装基板。1. A mounting board comprising a groove for embedding an electronic component, and a wiring terminal having a spring effect provided on a side surface of the groove for contacting an electrical terminal of the electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1961182U JPS58122461U (en) | 1982-02-15 | 1982-02-15 | Mounting board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1961182U JPS58122461U (en) | 1982-02-15 | 1982-02-15 | Mounting board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58122461U true JPS58122461U (en) | 1983-08-20 |
Family
ID=30031814
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1961182U Pending JPS58122461U (en) | 1982-02-15 | 1982-02-15 | Mounting board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58122461U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS647590A (en) * | 1987-06-29 | 1989-01-11 | Ibiden Co Ltd | Substrate for mounting electronic component |
| JP2018182046A (en) * | 2017-04-12 | 2018-11-15 | 日本電気株式会社 | Wiring board and component built-in substrate and manufacturing method thereof |
| WO2026033954A1 (en) * | 2024-08-07 | 2026-02-12 | 株式会社村田製作所 | Wiring board |
-
1982
- 1982-02-15 JP JP1961182U patent/JPS58122461U/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS647590A (en) * | 1987-06-29 | 1989-01-11 | Ibiden Co Ltd | Substrate for mounting electronic component |
| JP2018182046A (en) * | 2017-04-12 | 2018-11-15 | 日本電気株式会社 | Wiring board and component built-in substrate and manufacturing method thereof |
| WO2026033954A1 (en) * | 2024-08-07 | 2026-02-12 | 株式会社村田製作所 | Wiring board |
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