JPS63156390A - Hybrid integrated circuit component - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a hybrid integrated circuit component that is effective for use in electronic devices and the like that require high-density packaging.

Conventional technology In recent years, electronic devices have been required to be smaller, lighter, and lower in cost, and electronic components are also becoming smaller and surface-mounted.
Along with this, the number of hybrid integrated circuit components is rapidly increasing. In particular, in hybrid integrated circuit components using ceramic substrates, it is possible to form small resistors on the substrate by direct bonding of ICs, printing and vapor deposition techniques, and the packaging density is improved. Cost reductions have also been realized. However, when it comes to the connection structure with the motherboard, the common method is to insert it into the motherboard using a COM lead, similar to conventional ICs.

Hereinafter, an example of the above-mentioned conventional hybrid integrated circuit component will be described with reference to the drawings.

FIG. 4 is a cross-sectional view of a conventional hybrid integrated circuit component mounted on a motherboard. 1 is a printed wiring board, 2 is an electronic component, 4 is a motherboard, and 6 is an external connection terminal, in this case a com lead.

As shown in FIG. 4, a com lead 6 is attached as an external connection terminal of the hybrid integrated circuit component, and is inserted into the mother board 4, and the connection is made by soldering or the like.

Problems to be Solved by the Invention However, in the above configuration, when using hybrid integrated circuit components, the number of through holes 4d increases on the motherboard 4, making pattern design difficult and making it difficult to reduce the mounting density of the motherboard 4. The problem was that it could not be raised sufficiently.

In view of the above-mentioned problems, the present invention makes it possible to surface-mount the hybrid integrated circuit component itself onto the motherboard by making the external connection terminal a conductive component having a cylindrical or prismatic shape.

Means for Solving the Problems In order to solve the above problems, the hybrid integrated circuit component of the present invention includes electronic components mounted on a printed wiring board and electrically connected columnar conductive components as external connection terminals. This configuration allows for surface mounting on a motherboard.

According to the present invention, with the above-described configuration, the com lead, which is an external connection terminal, becomes a columnar conductor, thereby making it possible to surface-mount the hybrid integrated circuit component on the motherboard, and to simplify the manufacturing process of the hybrid integrated circuit. However, the conductive parts that serve as external connection ends can be mounted at the same time as other surface-mounted electronic parts, eliminating the need for the process of attaching COM leads, and reducing the number of processing steps.

Embodiments Hereinafter, hybrid integrated circuit components according to embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view of a hybrid integrated circuit component according to an embodiment of the present invention. 1 is a printed wiring board, 2 is an electronic component, and 3 is a cylindrical or prismatic conductive component, which serves as an external connection terminal. Second
The figure shows hybrid integrated circuit components according to an embodiment of the present invention on a motherboard 4.
4 is a cross-sectional view of the hybrid integrated circuit component mounted on the mother board 4. FIG. As shown in Figure 2, by using the conductor component 3 as the external connection terminal of the hybrid integrated circuit component, the external connection terminal can be surface-mounted in the same way as other electronic components even in the manufacture of the hybrid integrated circuit component, and Integrated circuit components can also be surface mounted on the motherboard 4. This surface mounting allows for free pattern design on the back side of the connection surface, improving packaging density. Furthermore, the external connection terminals can be mounted at the same time as other electronic components, and the number of man-hours required to process the hybrid integrated circuit components can be reduced.

Furthermore, since the hybrid integrated circuit component of the present invention can be surface-mounted, it can be easily multi-layered by stacking the components.

Furthermore, as shown in Fig. 2, it is generally desirable that the columnar conductor, which is an external connection terminal, be larger in height than other electronic components; When mounting, it may be possible to make holes in the mother board 4 to increase the overall space advantage.

Incidentally, the columnar conductor 3, which is an external connection terminal, is formed between the pattern of the hybrid integrated circuit component and the pattern of the motherboard 4.

- It is sufficient if there is a function to connect the That is, the columnar conductor 3 only needs to have conductivity between the bottom surface and the top surface.

In addition, soldering is performed twice: once to electrically connect the electronic components (including conductive parts of external connection terminals) mounted on the hybrid integrated circuit, and once to electrically connect the hybrid integrated circuit components to the motherboard. There is no need to mention that the former is used with ordinary solder and the latter with low melting point solder or conductive adhesive, or that the electronic components are fixed in advance with adhesive.

Effects of the Invention As described above, according to the present invention, a hybrid integrated circuit component can be surface-mounted on a motherboard, pattern design of the motherboard becomes easy, and the packaging density of the entire device is improved. Furthermore, by mounting the external connection terminals at the same time as other electronic components, it is possible to reduce the number of processing steps. Furthermore, the hybrid integrated circuit of the present invention has the advantage of being easily multilayered.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of an embodiment of the hybrid integrated circuit component of the present invention;
FIG. 2 is a sectional view of an embodiment of the present invention mounted on a motherboard, FIG. 3 is a sectional view of an applied row of the present invention, and FIG. 4 is a sectional view of a conventional hybrid integrated circuit. 1...Printed wiring board, 2...Electronic components, 3...Conductor parts, 4...Mother board. Name of agent: Patent attorney Toshio Nakao and 1 other person/-
11 print layout base plate? - Electric,) Resignation 8 - 11th grade forgery 1 ('Dissection product Figure 1/---Psonto board 4 - Maji base 12 Figure 3?

Claims (1)

[Claims] A hybrid integrated circuit component characterized by mounting electronic components on a circuit board and surface-mounting columnar conductive components for maintaining a constant distance from the motherboard as external connection terminals.