JPS62145891A - Circuit substrate - Google Patents
Circuit substrateInfo
- Publication number
- JPS62145891A JPS62145891A JP60288557A JP28855785A JPS62145891A JP S62145891 A JPS62145891 A JP S62145891A JP 60288557 A JP60288557 A JP 60288557A JP 28855785 A JP28855785 A JP 28855785A JP S62145891 A JPS62145891 A JP S62145891A
- Authority
- JP
- Japan
- Prior art keywords
- printed
- resistor
- view
- plan
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は印刷抵抗を使ったハイブリッドＩＣに用いるこ
とが出来る回路基板に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a circuit board that can be used in a hybrid IC using printed resistors.
従来の技術
近年、電気・電子機器の産業分野では、機器の小型化、
軽量化、低価格化が促進されている。特に、ハイブリッ
ドＩＣは、印刷抵抗や多層化により小型化・低価格化さ
れ、急速に普及してきている。Conventional technology In recent years, in the electrical and electronic equipment industry, equipment has become smaller and smaller.
Lighter weight and lower prices are being promoted. In particular, hybrid ICs have become smaller and cheaper due to printed resistors and multilayers, and are rapidly becoming popular.
２ページ
以下、図面を参照しながら、従来の回路基板の一例につ
いて説明する。第９図〜第１２図は従来の回路基板の例
を示すもので、第９図は第１の従来例の回路基板の平面
図で、第１０図は第９図のＥ、Ｅｌ断面図である。１は
印刷抵抗、２は導体、３は絶縁基板、４はレジストであ
る。第１０図のように、印刷抵抗１は絶縁基板３の上に
導体２のペーストを印刷した上に印刷されていた。From page 2 onwards, an example of a conventional circuit board will be described with reference to the drawings. Figures 9 to 12 show examples of conventional circuit boards. Figure 9 is a plan view of the first conventional circuit board, and Figure 10 is a sectional view of E and El in Figure 9. be. 1 is a printed resistor, 2 is a conductor, 3 is an insulating substrate, and 4 is a resist. As shown in FIG. 10, the printed resistor 1 was printed on an insulating substrate 3 with a paste of a conductor 2 printed thereon.
次に第１１図は第２の従来例で、印刷抵抗１と他の電子
部品との配置関係を示す平面図であり、第１２図は第１
１図のＦ−Ｆ’断面図を示すものである。５は電子部品
、６は半田、７は電極ランドである。第１１図、第１２
図に示すように、印刷抵抗１と電子部品６の電極７は別
々に必要となる。Next, FIG. 11 shows a second conventional example, which is a plan view showing the arrangement relationship between the printed resistor 1 and other electronic components, and FIG.
1 is a cross-sectional view taken along line FF' in FIG. 5 is an electronic component, 6 is solder, and 7 is an electrode land. Figures 11 and 12
As shown in the figure, the printed resistor 1 and the electrode 7 of the electronic component 6 are required separately.
発明が解決しようとする問題点
しかしながら上記のような構成では、印刷抵抗１と電子
部品５の電極ランドＴが別々に必要となり、基板面積に
対して電極面積が大きくなるので、実装密度が高くなら
ないという問題を有していた３本発明は上記問題点を鑑
み、印刷抵抗を導体の３ベーノ
上にすることにより、印刷抵抗と電子部品の電極ランド
を共用化できるようにした回路基板を提供するものであ
る。Problems to be Solved by the Invention However, in the above configuration, the printed resistor 1 and the electrode land T of the electronic component 5 are required separately, and the electrode area becomes larger than the board area, so the packaging density does not become high. In view of the above problems, the present invention provides a circuit board in which the printed resistor and the electrode land of the electronic component can be shared by placing the printed resistor on the conductor. It is something.
問題点を解決するだめの手段
上記問題点を解決するための本発明の回路基板は、絶縁
基板の少なくとも片面に抵抗を印刷し、前記抵抗に一部
重なり合うように導体を印刷するという構成を備えたも
のである。Means for Solving the Problems In order to solve the above problems, the circuit board of the present invention has a structure in which a resistor is printed on at least one side of an insulating substrate, and a conductor is printed so as to partially overlap the resistor. It is something that
作用
本発明は上記した構成によって、導体が印刷抵抗の上に
なり、これにより印刷抵抗の電極ランドと電子部品の電
極ランドを共用化することにより、電極ランドの面積を
小さくすることが出来ることとなる。Effects of the present invention With the above-described configuration, the conductor is placed on top of the printed resistor, thereby making it possible to reduce the area of the electrode land by sharing the electrode land of the printed resistor and the electrode land of the electronic component. Become.
実施例
以下、本発明の実施例の回路基板について図面を参照し
ながら説明する。Embodiments Hereinafter, circuit boards according to embodiments of the present invention will be described with reference to the drawings.
第１図は本発明の第１の実施例の平面図で、第２図は第
１図のＡ−Ａ′断面図を示すものである。FIG. 1 is a plan view of a first embodiment of the present invention, and FIG. 2 is a sectional view taken along line A-A' in FIG.
１は印刷抵抗、２は導体、３は絶縁基板、４はレジスト
、６は電子部品、６は半田、７は電極ランドである。第
２図のように、絶縁基板の上に抵抗１を印刷し、その上
に導体ペーストを印刷したものである。1 is a printed resistor, 2 is a conductor, 3 is an insulating substrate, 4 is a resist, 6 is an electronic component, 6 is solder, and 7 is an electrode land. As shown in FIG. 2, a resistor 1 is printed on an insulating substrate, and a conductive paste is printed on it.
以上のように構成された回路基板において、他の電子部
品との関係を第３図〜第８図を用いてその動作を説明す
る。The operation of the circuit board configured as described above in relation to other electronic components will be explained using FIGS. 3 to 8.
まず、第３図は本発明の第２の実施例の印刷抵抗１と他
の電子部品５を直列に接続した回路基板の平面図を示す
ものであって、第４図のＢ−Ｂ’ 断面図である。第４
図のように、印刷抵抗１の電極ランド７と電子部品５の
電極ランド７を共用出来る。これにより、印刷抵抗１と
導体２の接続部分の面積を充分に確保する事が出来、か
つ、印刷抵抗１の電極ランド７の面積だけ小型化が可能
となる。First, FIG. 3 shows a plan view of a circuit board in which a printed resistor 1 and other electronic components 5 according to a second embodiment of the present invention are connected in series, and the cross section taken along the line BB' in FIG. It is a diagram. Fourth
As shown in the figure, the electrode land 7 of the printed resistor 1 and the electrode land 7 of the electronic component 5 can be shared. This makes it possible to secure a sufficient area for the connecting portion between the printed resistor 1 and the conductor 2, and to reduce the size of the printed resistor 1 by the area of the electrode land 7.
第５図は第３の実施例の印刷抵抗とセラミックコンデン
サ等の小型部品が並列に接続した回路基板の平面図で、
第６図は第５図のＣ−Ｃ’断面図であり、容易に印刷抵
抗の上に小型部品を搭載する５ ベージ
ことか出来る。FIG. 5 is a plan view of a circuit board in which a printed resistor and small components such as a ceramic capacitor are connected in parallel according to the third embodiment.
FIG. 6 is a sectional view taken along the line CC' in FIG. 5, and it is possible to easily mount small parts on the printed resistor in a 5-page structure.
第７図は第４の実施例のＩＣの端子間に抵抗を入れた回
路基板の平面図であり、第８図は第７図のＤ−Ｄ’断面
図である。Ｓθ−ＩＣの端子間（１，２７朋）にも、極
端に抵抗形状を小さくせずに、トリミング時の信頼性を
確保した状態で、抵抗を印刷する事ができる。FIG. 7 is a plan view of a circuit board in which a resistor is inserted between the terminals of an IC according to the fourth embodiment, and FIG. 8 is a sectional view taken along line DD' in FIG. It is also possible to print a resistor between the Sθ-IC terminals (1, 27) without making the resistor shape extremely small while ensuring reliability during trimming.
以上のように本実施例によれば、印刷抵抗と導体との接
続部分を電子部品の電極ランドとして活用する事により
、導体部の面積を小さくシ、実装密度を上げ、回路基板
の小型化を実現している。As described above, according to this embodiment, by utilizing the connection part between the printed resistor and the conductor as the electrode land of the electronic component, the area of the conductor part can be reduced, the packaging density can be increased, and the size of the circuit board can be reduced. It has been realized.
発明の効果
以上のように本発明によれば、印刷抵抗の電極と電子部
品の電極を共用化出来、電子部品の下に容易に印刷抵抗
を潜り込ませることが出来、回路の実装面積を小さく出
来るといったすぐれた効果を得ることが出来るっEffects of the Invention As described above, according to the present invention, the electrode of the printed resistor and the electrode of the electronic component can be shared, the printed resistor can be easily hidden under the electronic component, and the mounting area of the circuit can be reduced. You can get excellent effects such as
第１図は本発明の第１の実施例の平面図、第２図は第１
図のＡ−Ａ’断面図、第３図は本発明の第６ベージ
２の実施例の平面図、第４図は第３図のＢ−Ｂ’断面図
、第５図は第３の実施例の平面図、第６図は第５図のｃ
−ｃ’断面図、第７図は第４の実施例の平面図、第８図
は第７図のＤ−Ｄ／断面図、第９図は第１の従来例の平
面図、第１ｏ図は第９図のＥ−１’断面図、第１１図は
第２の従来例の平面図、第１２図は第１１図のＦ−Ｆ’
断面図である。
１・・・・・・印刷抵抗、２・・・・・・導体、３・・
・・・・絶縁基板、４・・・・・・レジスト、５・・・
・・・電子部品、６・・・・・・半田、７・・・・・・
電極ランド、８・・・・・・工Ｃ０代理人の氏名 弁理
士 中 尾 敏 男 ほか１名り ｅ
。
城 城
（ＱFIG. 1 is a plan view of the first embodiment of the present invention, and FIG. 2 is a plan view of the first embodiment of the present invention.
3 is a plan view of an embodiment of the sixth page 2 of the present invention, FIG. 4 is a BB' sectional view of FIG. 3, and FIG. The plan view of the example, Fig. 6 is c of Fig. 5.
-c' sectional view, FIG. 7 is a plan view of the fourth embodiment, FIG. 8 is a DD/sectional view of FIG. 7, FIG. 9 is a plan view of the first conventional example, and FIG. is a sectional view taken along line E-1' in Figure 9, Figure 11 is a plan view of the second conventional example, and Figure 12 is taken along line FF' in Figure 11.
FIG. 1...Printed resistor, 2...Conductor, 3...
...Insulating substrate, 4...Resist, 5...
...Electronic parts, 6...Solder, 7...
Electrode land, 8...Name of engineering C0 agent Patent attorney Toshio Nakao and 1 other person e
. Castle Castle (Q
Claims (2)
抵抗に一部重なり合うように導体を印刷したことを特徴
とする回路基板。(1) A circuit board characterized in that a resistor is printed on at least one side of an insulating substrate, and a conductor is printed so as to partially overlap the resistor.
分とする特許請求の範囲第１項記載の回路基板。(2) The circuit board according to claim 1, wherein the conductor portion above the printed resistor is a soldered portion of an electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60288557A JPS62145891A (en) | 1985-12-20 | 1985-12-20 | Circuit substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60288557A JPS62145891A (en) | 1985-12-20 | 1985-12-20 | Circuit substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62145891A true JPS62145891A (en) | 1987-06-29 |
Family
ID=17731789
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60288557A Pending JPS62145891A (en) | 1985-12-20 | 1985-12-20 | Circuit substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62145891A (en) |
-
1985
- 1985-12-20 JP JP60288557A patent/JPS62145891A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS594873B2 (en) | printed wiring board | |
| JPH05102648A (en) | Printed board | |
| JP2789406B2 (en) | Circuit board | |
| JPS62145891A (en) | Circuit substrate | |
| JPS5835993A (en) | Printed circuit board | |
| JPS631093A (en) | Electronic parts mounting board device | |
| JPS6298791A (en) | Flexible printed circuit sheet | |
| JPS59180470U (en) | Printed circuit board connection structure | |
| JPS62208691A (en) | Double-sided mounting hybrid integrated circuit | |
| JPS5914394U (en) | hybrid integrated circuit board | |
| JPS63156390A (en) | Hybrid integrated circuit component | |
| JPS60176577U (en) | Printed board | |
| JPS5974761U (en) | printed wiring board | |
| JPS5986285A (en) | Device for connecting printed board | |
| JPS60106363U (en) | printed wiring board | |
| JPS59152761U (en) | Wiring pattern connection structure between circuit boards | |
| JPS6148986A (en) | Both-side printed circuit board | |
| JPS58140661U (en) | printed wiring board | |
| JPS6343391A (en) | Thick film circuit board | |
| JPS6381901A (en) | Chip resistor | |
| JPS62213232A (en) | High density mounting laminated capacitor | |
| JPS62172786A (en) | Printed circuit parts | |
| JPS5996869U (en) | Mounting device for chip-shaped circuit components | |
| JPS60169192A (en) | Printed circuit board | |
| JPS58140658U (en) | electrical parts assembly |