JPS60110190A - Hybrid integrated circuit - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] [Description of the technical field to which the invention pertains] The present invention relates to hybrid integrated circuits.

[Description of prior art]

Hybrid integrated circuits (hereinafter referred to as hybrid ICs) are used in large quantities in the consumer market such as automobiles and audio equipment, and recently demand has been steadily expanding in the industrial equipment market related to communication devices and computers. It is showing an annual growth rate of more than 30 cm.In the future, as various electronic devices become digitalized, systemized, and integrated, it is expected that they will increasingly be converted to ICs, LSIs, and hybrid ICs.1. The production volume of hybrid ICs is on the rise.

However, as L-child devices become more highly integrated, smaller, and thinner, current hybrid ICs are generally printed on one side and mounted on one side, and are mounted on lead frames using molds, so they naturally become more dense and highly integrated. In addition, there are limits to miniaturization and thinning.

Also, double-sided printing and the use of highly integrated substrates such as multilayer ceramic substrates are methods for achieving higher integration, but these have drawbacks in terms of technology, cost, and reliability.

[Detailed description of the invention]

An object of the present invention is to provide a hybrid IC that eliminates the above-mentioned drawbacks and allows high-density wiring.

[Structure of the invention]

The present invention involves forming a conductor circuit, a resistor circuit, etc. on a ceramic substrate by screen printing, and forming a hybrid integrated element with predetermined components mounted on the substrate, and a predetermined conductor circuit on a flexible double-sided copper-clad laminate. , a flexible printed board on which through-holes and a resistance circuit are formed as necessary, the flexible printed board is pasted on the surface opposite to the surface of the hybrid integrated circuit element on which the component is mounted, and the edge of the flexible printed board is is folded back to the surface side of the hybrid integrated circuit element described in III, and the external connection conductor part of the flexible printed circuit board and the external connection conductor part of the hybrid integrated circuit element are overlapped and electrically connected to form a hybrid integrated circuit. This is a hybrid integrated circuit characterized by having an integrated structure of an element and a flexible printed circuit board.

[Description of Embodiments] Embodiments of the present invention will be described in detail below with reference to FIGS. 1 to 4.

As shown in FIG. 1, a conductor circuit 2, an external connection conductor part 3, and a resistance circuit 4 are formed in advance on a ceramic substrate 1 by screen printing, and a chip capacitor 5 and a mini-molded transistor 6 are formed on the ceramic substrate 1. etc. and soldered to form a hybrid integrated circuit element (hereinafter referred to as hybrid I).
C sweets) get 7.

On the other hand, as shown in FIGS. 2(a) and 2(b), both sides of a flexible polyimide film with a thickness of 50μ are
A double-sided copper-clad laminate 8 with μJi copper foil pasted thereon, a barrel circuit 9, a conductor portion 10 for external connection, and a through-hole flexible printed circuit board 13 are obtained. Then, as shown in FIG. 3, a flexible knob 1 non-plate (hereinafter F
A PC) 13 is bonded to the surface 7b of the hybrid IC element 7 opposite to the surface 7α on which the sound component is mounted,
Fold the edge of the FPC 13 to the surface 7a side of the hybrid IC element 7, and connect the FPC to the external connection conductor part 3 of the hybrid IC element 7.
The external connection conductor portions 10 of the PC 13 are stacked one on top of the other, and soldered by immersing them in a solder bath (not shown) at 235±5° C. for 2 to 3 seconds. By this soldering, the hybrid IC
The external connection conductor section 3 on the element 7 and the external connection upper conductor section 10 on the FPC 13 are electrically connected, and the hybrid IC element 7
By integrating the FPC 13 and the FPC 13, a high-density wiring hybrid integrated circuit 14 is obtained. As an example of the use of this high-density wiring hybrid integrated circuit 14, it can be soldered and mounted on a printed wiring board 16 having connection conductive pads 15 as shown in FIG. 4, and can be used for thin packaging packages and the like.

[Detailed description of the invention]

As described above, the present invention has the following advantages.

That is, in the present invention, since the flexible printed board is bonded to the hybrid IC element, the wiring density can be improved compared to the conventional hybrid IC.

Furthermore, unlike conventional hybrid ICs, it does not have external leads, so the lead mounting space can be reduced and the mounting height after mounting on a splint wiring board can be reduced.

Furthermore, if the design change is only in the wiring (no changes in mounted components), only the FPC, which is relatively easy to change, needs to be changed, reducing the time spent on setting up and changing compared to the conventional method. This has the effect of

[Brief explanation of the drawing]

FIGS. 1 and 2 (,z) are perspective views showing embodiments of the present invention, and FIG. 2(b) is an enlarged portion 1e of FIG. 2(α). i
FIG. 3 is a sectional view showing an embodiment of the present invention, and FIG.
The figure is a perspective view showing an example of use of the present invention. DESCRIPTION OF SYMBOLS 1...Ceramic substrate, 2...Conductor circuit, 3...Conductor part for connecting μ sound, 4...Resistance circuit, 5...Chip capacitor, 6...Mini mold transistor, 7
・Mixed assembly, bond circuit element, 8...polyimide film,
9... Conductor circuit, 10... External connection conductor part, 11
... Through hole 12 ... Overlay film, 13
...Flexiful. PCB, 14... High-density hybrid integrated circuit patent applicant Nippon °Kameki Co., Ltd.

Claims (1)

[Claims] (1) Predetermined conductor circuits, resistance circuits, etc. are formed on a ceramic substrate by screen printing method, and a hybrid integrated circuit element with predetermined components mounted on the substrate and a flexible double-sided copper-clad laminate with predetermined The flexible printed circuit board is pasted on the surface opposite to the surface of the hybrid integrated circuit element on which the component is mounted, and the edge of the flexible printed circuit board is attached to the hybrid integrated circuit element on which the component is mounted. Fold it back to the surface side of the integrated circuit element, overlap the external connection conductor part of the flexible printed circuit board and the external connection conductor part of the hybrid integrated circuit element, and electrically connect the hybrid integrated circuit element and the flexible printed circuit board. A hybrid integrated circuit characterized by having an integrated structure with a substrate.