JPS63164294A - プリント回路基板の製造方法 - Google Patents

プリント回路基板の製造方法

Info

Publication number
JPS63164294A
JPS63164294A JP26252986A JP26252986A JPS63164294A JP S63164294 A JPS63164294 A JP S63164294A JP 26252986 A JP26252986 A JP 26252986A JP 26252986 A JP26252986 A JP 26252986A JP S63164294 A JPS63164294 A JP S63164294A
Authority
JP
Japan
Prior art keywords
printed circuit
circuit pattern
cavity
injection molding
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP26252986A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0368554B2 (enrdf_load_stackoverflow
Inventor
谷川　照男
洋典 小山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Meiki Seisakusho KK
Tobi Co Ltd
Navitas Co Ltd
Original Assignee
Meiki Seisakusho KK
Tobi Co Ltd
Navitas Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meiki Seisakusho KK, Tobi Co Ltd, Navitas Co Ltd filed Critical Meiki Seisakusho KK
Priority to JP26252986A priority Critical patent/JPS63164294A/ja
Publication of JPS63164294A publication Critical patent/JPS63164294A/ja
Publication of JPH0368554B2 publication Critical patent/JPH0368554B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern

Landscapes

  • Injection Moulding Of Plastics Or The Like (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP26252986A 1986-11-04 1986-11-04 プリント回路基板の製造方法 Granted JPS63164294A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26252986A JPS63164294A (ja) 1986-11-04 1986-11-04 プリント回路基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26252986A JPS63164294A (ja) 1986-11-04 1986-11-04 プリント回路基板の製造方法

Publications (2)

Publication Number Publication Date
JPS63164294A true JPS63164294A (ja) 1988-07-07
JPH0368554B2 JPH0368554B2 (enrdf_load_stackoverflow) 1991-10-28

Family

ID=17377062

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26252986A Granted JPS63164294A (ja) 1986-11-04 1986-11-04 プリント回路基板の製造方法

Country Status (1)

Country Link
JP (1) JPS63164294A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03502025A (ja) * 1988-10-05 1991-05-09 ロジヤース　コーポレイシヨン 高精度回路パターンを備えた曲線形プラスチツク本体
US6135200A (en) * 1998-03-11 2000-10-24 Denso Corporation Heat generating element cooling unit with louvers
US6185481B1 (en) * 1996-11-29 2001-02-06 Hitachi, Ltd. Air cooled electronic equipment apparatus

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61102093A (ja) * 1984-10-25 1986-05-20 シャープ株式会社 プリント基板の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61102093A (ja) * 1984-10-25 1986-05-20 シャープ株式会社 プリント基板の製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03502025A (ja) * 1988-10-05 1991-05-09 ロジヤース　コーポレイシヨン 高精度回路パターンを備えた曲線形プラスチツク本体
US6185481B1 (en) * 1996-11-29 2001-02-06 Hitachi, Ltd. Air cooled electronic equipment apparatus
US6135200A (en) * 1998-03-11 2000-10-24 Denso Corporation Heat generating element cooling unit with louvers

Also Published As

Publication number Publication date
JPH0368554B2 (enrdf_load_stackoverflow) 1991-10-28

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