JPS63160B2 - - Google Patents

Info

Publication number
JPS63160B2
JPS63160B2 JP7707686A JP7707686A JPS63160B2 JP S63160 B2 JPS63160 B2 JP S63160B2 JP 7707686 A JP7707686 A JP 7707686A JP 7707686 A JP7707686 A JP 7707686A JP S63160 B2 JPS63160 B2 JP S63160B2
Authority
JP
Japan
Prior art keywords
brazing
filler metal
brazing filler
content
melting point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP7707686A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6224892A (ja
Inventor
Hideaki Yoshida
Masaki Morikawa
Kunio Kishida
Tadaharu Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Metal Corp
Original Assignee
Mitsubishi Metal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Metal Corp filed Critical Mitsubishi Metal Corp
Priority to JP7707686A priority Critical patent/JPS6224892A/ja
Publication of JPS6224892A publication Critical patent/JPS6224892A/ja
Publication of JPS63160B2 publication Critical patent/JPS63160B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Ceramic Products (AREA)
JP7707686A 1986-04-03 1986-04-03 めれ性の良好な低融点Ｃｕ−Ａｇ系合金ろう材 Granted JPS6224892A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7707686A JPS6224892A (ja) 1986-04-03 1986-04-03 めれ性の良好な低融点Ｃｕ−Ａｇ系合金ろう材

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7707686A JPS6224892A (ja) 1986-04-03 1986-04-03 めれ性の良好な低融点Ｃｕ−Ａｇ系合金ろう材

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP5426681A Division JPS57171599A (en) 1981-04-13 1981-04-13 Low melting point cu-ag system alloy solder with excellent wetting property

Publications (2)

Publication Number Publication Date
JPS6224892A JPS6224892A (ja) 1987-02-02
JPS63160B2 true JPS63160B2 (enrdf_load_stackoverflow) 1988-01-05

Family

ID=13623693

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7707686A Granted JPS6224892A (ja) 1986-04-03 1986-04-03 めれ性の良好な低融点Ｃｕ−Ａｇ系合金ろう材

Country Status (1)

Country Link
JP (1) JPS6224892A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106467941A (zh) * 2016-09-30 2017-03-01 无锡日月合金材料有限公司 一种真空电子管封接低银多元合金材料及其制备方法
JP7014003B2 (ja) * 2018-03-28 2022-02-01 住友金属鉱山株式会社 はんだ接合電極およびはんだ接合電極の被膜形成用銅合金ターゲット

Also Published As

Publication number Publication date
JPS6224892A (ja) 1987-02-02

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