JPS63153535U - - Google Patents
Info
- Publication number
- JPS63153535U JPS63153535U JP1987045565U JP4556587U JPS63153535U JP S63153535 U JPS63153535 U JP S63153535U JP 1987045565 U JP1987045565 U JP 1987045565U JP 4556587 U JP4556587 U JP 4556587U JP S63153535 U JPS63153535 U JP S63153535U
- Authority
- JP
- Japan
- Prior art keywords
- tape carrier
- pellet
- bumps
- lead wires
- leaf spring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案の一実施例の断面図、第２図は
テープキヤリアの平面図、第３図は第１図の―
矢視図、第４図は第１図の―矢視図である
。 １……ペレツト、２……上面、３……バンプ、
４……把持具、５……テープキヤリア、６……上
面、７……リード線、８……先端、９……送り用
穴、１０……押え板、１１……板バネ、１２……
先端、１３……ネジ、１４……穴、１５……ネジ
穴、１６……穴。
テープキヤリアの平面図、第３図は第１図の―
矢視図、第４図は第１図の―矢視図である
。 １……ペレツト、２……上面、３……バンプ、
４……把持具、５……テープキヤリア、６……上
面、７……リード線、８……先端、９……送り用
穴、１０……押え板、１１……板バネ、１２……
先端、１３……ネジ、１４……穴、１５……ネジ
穴、１６……穴。
Claims (1)
- 半導体製造組立工程におけるテープキヤリア方
式のボンデイングで、リード線を備えたテープキ
ヤリアとバンプを備えたペレツトより成る半導体
部品において、リード線をペレツト上のバンプに
加熱圧着する押え治具をリード線の数だけ先端を
分割した板バネ構造としたことを特徴とするテー
プキヤリアのボンデイング方法。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987045565U JPS63153535U (ja) | 1987-03-30 | 1987-03-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987045565U JPS63153535U (ja) | 1987-03-30 | 1987-03-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63153535U true JPS63153535U (ja) | 1988-10-07 |
Family
ID=30864415
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987045565U Pending JPS63153535U (ja) | 1987-03-30 | 1987-03-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63153535U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0328769A (ja) * | 1989-06-27 | 1991-02-06 | Mitsubishi Electric Corp | 加速度センサ |
-
1987
- 1987-03-30 JP JP1987045565U patent/JPS63153535U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0328769A (ja) * | 1989-06-27 | 1991-02-06 | Mitsubishi Electric Corp | 加速度センサ |