JPS63150320A - エポキシ樹脂組成物 - Google Patents

エポキシ樹脂組成物

Info

Publication number
JPS63150320A
JPS63150320A JP29718886A JP29718886A JPS63150320A JP S63150320 A JPS63150320 A JP S63150320A JP 29718886 A JP29718886 A JP 29718886A JP 29718886 A JP29718886 A JP 29718886A JP S63150320 A JPS63150320 A JP S63150320A
Authority
JP
Japan
Prior art keywords
epoxy resin
resistance
resin composition
parts
epoxidized polybutadiene
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP29718886A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0528725B2 (enrdf_load_stackoverflow
Inventor
Yasuaki Takahashi
高橋 保明
Kazuhiro Nakahira
仲平 和宏
Atsushi Okuno
敦史 奥野
Tsuneichi Hashimoto
橋本 常一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyu Industries Ltd
Original Assignee
Sanyu Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyu Industries Ltd filed Critical Sanyu Industries Ltd
Priority to JP29718886A priority Critical patent/JPS63150320A/ja
Publication of JPS63150320A publication Critical patent/JPS63150320A/ja
Publication of JPH0528725B2 publication Critical patent/JPH0528725B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP29718886A 1986-12-12 1986-12-12 エポキシ樹脂組成物 Granted JPS63150320A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29718886A JPS63150320A (ja) 1986-12-12 1986-12-12 エポキシ樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29718886A JPS63150320A (ja) 1986-12-12 1986-12-12 エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JPS63150320A true JPS63150320A (ja) 1988-06-23
JPH0528725B2 JPH0528725B2 (enrdf_load_stackoverflow) 1993-04-27

Family

ID=17843317

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29718886A Granted JPS63150320A (ja) 1986-12-12 1986-12-12 エポキシ樹脂組成物

Country Status (1)

Country Link
JP (1) JPS63150320A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003002954A (ja) * 2001-06-19 2003-01-08 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4816835B2 (ja) * 1999-07-19 2011-11-16 日立化成工業株式会社 非導電性樹脂ペースト組成物及びこれを用いた半導体装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57120A (en) * 1980-06-04 1982-01-05 Hitachi Ltd Curable resin composition
JPS6086134A (ja) * 1983-10-18 1985-05-15 Nippon Oil Co Ltd 積層板用樹脂組成物

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57120A (en) * 1980-06-04 1982-01-05 Hitachi Ltd Curable resin composition
JPS6086134A (ja) * 1983-10-18 1985-05-15 Nippon Oil Co Ltd 積層板用樹脂組成物

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003002954A (ja) * 2001-06-19 2003-01-08 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置

Also Published As

Publication number Publication date
JPH0528725B2 (enrdf_load_stackoverflow) 1993-04-27

Similar Documents

Publication Publication Date Title
JPS6230215B2 (enrdf_load_stackoverflow)
EP0325022B1 (en) Rubber-modified phenolic resin composition and method of manufacturing the same
DE60200678T2 (de) Wärmehärtbare harzzusammensetzung und herstellungsverfahren
JPS63150320A (ja) エポキシ樹脂組成物
JPS58225121A (ja) エポキシ樹脂組成物及びそれを用いる電子部品の封止方法
JPH0977958A (ja) エポキシ樹脂組成物および半導体装置
JP2000086744A (ja) エポキシ樹脂組成物、インダクタンス部品および半導体封止装置
JPH0733429B2 (ja) エポキシ樹脂組成物
JP2541712B2 (ja) 半導体封止用エポキシ樹脂組成物
JP3115693B2 (ja) エポキシ樹脂組成物および半導体封止装置
JPH10182941A (ja) エポキシ樹脂組成物
KR960000973B1 (ko) 전기 절연용 열경화성 에폭시 수지 분체도료 조성물
JP3413923B2 (ja) 半導体封止用エポキシ樹脂組成物および樹脂封止型半導体装置
JP2987180B2 (ja) 硬化性エポキシ樹脂組成物
KR950005345B1 (ko) 에폭시 수지 분체 도료 조성물
JP3528925B2 (ja) 半導体封止用エポキシ樹脂組成物
JPH02173155A (ja) 半導体封止用エポキシ含有組成物
JPH1112442A (ja) 封止用樹脂組成物および半導体封止装置
JPH08245753A (ja) 半導体封止用エポキシ樹脂組成物および半導体装置
JPH039929B2 (enrdf_load_stackoverflow)
JPH08295724A (ja) エポキシ樹脂組成物および半導体封止装置
JP3093051B2 (ja) エポキシ樹脂組成物
JPH0725992B2 (ja) エポキシ樹脂組成物とその製造方法
JP2987179B2 (ja) 硬化性エポキシ樹脂組成物
JPS58206622A (ja) 一液型エポキシ樹脂組成物

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term