JPH0528725B2 - - Google Patents
Info
- Publication number
- JPH0528725B2 JPH0528725B2 JP61297188A JP29718886A JPH0528725B2 JP H0528725 B2 JPH0528725 B2 JP H0528725B2 JP 61297188 A JP61297188 A JP 61297188A JP 29718886 A JP29718886 A JP 29718886A JP H0528725 B2 JPH0528725 B2 JP H0528725B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- weight
- parts
- resin composition
- curing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29718886A JPS63150320A (ja) | 1986-12-12 | 1986-12-12 | エポキシ樹脂組成物 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29718886A JPS63150320A (ja) | 1986-12-12 | 1986-12-12 | エポキシ樹脂組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63150320A JPS63150320A (ja) | 1988-06-23 |
JPH0528725B2 true JPH0528725B2 (enrdf_load_stackoverflow) | 1993-04-27 |
Family
ID=17843317
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP29718886A Granted JPS63150320A (ja) | 1986-12-12 | 1986-12-12 | エポキシ樹脂組成物 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63150320A (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001031941A (ja) * | 1999-07-19 | 2001-02-06 | Hitachi Chem Co Ltd | 非導電性樹脂ペースト組成物及びこれを用いた半導体装置 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4961638B2 (ja) * | 2001-06-19 | 2012-06-27 | 住友ベークライト株式会社 | エポキシ樹脂組成物及び半導体装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57120A (en) * | 1980-06-04 | 1982-01-05 | Hitachi Ltd | Curable resin composition |
JPS6086134A (ja) * | 1983-10-18 | 1985-05-15 | Nippon Oil Co Ltd | 積層板用樹脂組成物 |
-
1986
- 1986-12-12 JP JP29718886A patent/JPS63150320A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001031941A (ja) * | 1999-07-19 | 2001-02-06 | Hitachi Chem Co Ltd | 非導電性樹脂ペースト組成物及びこれを用いた半導体装置 |
Also Published As
Publication number | Publication date |
---|---|
JPS63150320A (ja) | 1988-06-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0325022B1 (en) | Rubber-modified phenolic resin composition and method of manufacturing the same | |
JPH0528725B2 (enrdf_load_stackoverflow) | ||
JP2000086744A (ja) | エポキシ樹脂組成物、インダクタンス部品および半導体封止装置 | |
JP3018584B2 (ja) | 半導体封止用エポキシ樹脂組成物 | |
JP2000136290A (ja) | 封止用樹脂組成物及び半導体封止装置 | |
JPH0733429B2 (ja) | エポキシ樹脂組成物 | |
JP2001106768A (ja) | エポキシ樹脂組成物および半導体封止装置 | |
JPS6069129A (ja) | エポキシ樹脂組成物 | |
JP3413923B2 (ja) | 半導体封止用エポキシ樹脂組成物および樹脂封止型半導体装置 | |
JPH11286594A (ja) | 封止用樹脂組成物および半導体封止装置 | |
JP2987180B2 (ja) | 硬化性エポキシ樹脂組成物 | |
JP3451710B2 (ja) | 半導体封止用エポキシ樹脂組成物および樹脂封止型半導体装置 | |
JPH1112442A (ja) | 封止用樹脂組成物および半導体封止装置 | |
JP2002003704A (ja) | 封止用樹脂組成物および半導体封止装置 | |
JP3528925B2 (ja) | 半導体封止用エポキシ樹脂組成物 | |
JPH02173155A (ja) | 半導体封止用エポキシ含有組成物 | |
JPH0977850A (ja) | エポキシ樹脂組成物および樹脂封止型半導体装置 | |
JP2002275358A (ja) | エポキシ系樹脂組成物および半導体装置 | |
JPH11166103A (ja) | 封止用樹脂組成物および半導体封止装置 | |
KR960000973B1 (ko) | 전기 절연용 열경화성 에폭시 수지 분체도료 조성물 | |
JPH1112446A (ja) | 封止用樹脂組成物および半導体封止装置 | |
JPH11130943A (ja) | 封止用樹脂組成物および半導体封止装置 | |
JP3298084B2 (ja) | 封止用樹脂組成物および半導体封止装置 | |
JPH0649329A (ja) | 液状エポキシ樹脂成形材料 | |
JPS58206622A (ja) | 一液型エポキシ樹脂組成物 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
EXPY | Cancellation because of completion of term |