JPS63146698A - ２次元アレイトランスデユ−サの製造方法 - Google Patents
２次元アレイトランスデユ−サの製造方法Info
- Publication number
- JPS63146698A JPS63146698A JP61293897A JP29389786A JPS63146698A JP S63146698 A JPS63146698 A JP S63146698A JP 61293897 A JP61293897 A JP 61293897A JP 29389786 A JP29389786 A JP 29389786A JP S63146698 A JPS63146698 A JP S63146698A
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric plate
- dicing
- conductor
- backing material
- elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 239000004020 conductor Substances 0.000 claims abstract description 20
- 239000000463 material Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 7
- 230000008878 coupling Effects 0.000 abstract description 7
- 238000010168 coupling process Methods 0.000 abstract description 7
- 238000005859 coupling reaction Methods 0.000 abstract description 7
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract description 4
- 238000012856 packing Methods 0.000 abstract 3
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 238000003491 array Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- 230000035606 childbirth Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Ultra Sonic Daignosis Equipment (AREA)
- Transducers For Ultrasonic Waves (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61293897A JPS63146698A (ja) | 1986-12-10 | 1986-12-10 | ２次元アレイトランスデユ−サの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61293897A JPS63146698A (ja) | 1986-12-10 | 1986-12-10 | ２次元アレイトランスデユ−サの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63146698A true JPS63146698A (ja) | 1988-06-18 |
| JPH041560B2 JPH041560B2 (enrdf_load_stackoverflow) | 1992-01-13 |
Family
ID=17800568
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61293897A Granted JPS63146698A (ja) | 1986-12-10 | 1986-12-10 | ２次元アレイトランスデユ−サの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63146698A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013500607A (ja) * | 2009-07-27 | 2013-01-07 | シーティーエス・コーポレーション | カプセル型セラミック素子とその製作方法 |
-
1986
- 1986-12-10 JP JP61293897A patent/JPS63146698A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013500607A (ja) * | 2009-07-27 | 2013-01-07 | シーティーエス・コーポレーション | カプセル型セラミック素子とその製作方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH041560B2 (enrdf_load_stackoverflow) | 1992-01-13 |
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